Copper Alloy CC751S-GP
Grade
EN CC751S
GP = pressure (high-pressure) die cast
For high-volume thin-wall hardware where the silicon addition's fluidity and die-filling are exploited; check availability with the foundry.
Values for the GP condition
Other CC751S tempers and conditions
CC751S is listed in 5 conditions; see the grade overview at CC751S.
Compare all 5 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
GSDefault Sand cast | Standard sand-cast condition for general fittings, housings and one-off/low-volume parts. | 90 | 220 | 15 | 55 HB | 20 % IACS |
Gravity die (permanent mould) cast | Pick for medium/high volume fittings needing finer grain, better surface and higher strength than sand cast. | 110 | 270 | 12 | 65 HB | 20 % IACS |
Centrifugally cast | Use for bushings, rings and sleeves where a dense, inclusion-free wall is required. | 110 | 270 | 12 | 65 HB | 20 % IACS |
Continuously cast | Continuous-cast bar/tube stock for machined fittings and small pressure-tight bodies. | 120 | 280 | 12 | 70 HB | 20 % IACS |
GPThis page Pressure (high-pressure) die cast | For high-volume thin-wall hardware where the silicon addition's fluidity and die-filling are exploited; check availability with the foundry. | 140 | 300 | 8 | 75 HB | 20 % IACS |
What is CC751S-GP?
CC751S-GP is CC751S in the GP grade — for high-volume thin-wall hardware where the silicon addition's fluidity and die-filling are exploited; check availability with the foundry. CC751S-GP has a yield strength of 140 MPa (20.3 ksi) and a tensile strength of 300 MPa (43.5 ksi) — weaker than 74% of copper alloy grades. Elongation at break is 8% and the elastic modulus is 95 GPa (13.8 Msi). CC751S-GP has a density of 8.5 g/cm³ (0.307 lb/in³), lighter than 65% of copper alloy grades. It melts at 880°C (1,616 °F). GS is the default condition FabDigit quotes; GP is available on request or by drawing note.
Advantages
- Low embodied carbon — 3 kg CO₂/kg, better than 97% of copper alloy grades
- Easy to machine — 80/100, better than 86% of copper alloy grades
Limitations
- Difficult to weld — 15/100, worse than 94% of copper alloy grades
- Low stiffness — 95 GPa (13.8 Msi), worse than 93% of copper alloy grades
- Limited formability — 12/100, worse than 85% of copper alloy grades
- Limited ductility — 8%, worse than 83% of copper alloy grades
CC751S-GP properties
Typical room-temperature values for CC751S-GP; 21 are specific to this condition. Other listed values are CC751S reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
CC751S-GP has a density of 8.5 g/cm³ (0.307 lb/in³), lighter than 65% of copper alloy grades. It melts at 880°C (1,616 °F).
Mechanical15
CC751S-GP has a yield strength of 140 MPa (20.3 ksi) and a tensile strength of 300 MPa (43.5 ksi) — weaker than 74% of copper alloy grades. Elongation at break is 8% and the elastic modulus is 95 GPa (13.8 Msi).
Thermal6
CC751S-GP is rated for continuous service to 200°C (392 °F). It conducts heat at 105 W/m·K (60.7 BTU/hr·ft·°F), better than 56% of copper alloy grades. Thermal expansion is 20.5 µm/m·K (11.4 µin/in·°F).
Electrical3
CC751S-GP conducts electricity at 20 % IACS, better than 52% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (58/100), worse than 76% of copper alloy grades.
Sustainability4
Producing a kilogram of CC751S-GP takes about 45 MJ of energy and emits 3 kg of CO₂ — less than 97% of copper alloy grades. Typical recycled content is 75%.
Manufacturability8
CC751S-GP's machinability is very good (80/100, better than 86% of copper alloy grades); weldability poor (15/100); formability not recommended (12/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with CC751S-GP
Is CC751S easy to machine?
Excellent free-cutting behaviour (~80 % of AISI 1212): use zero/negative rake brass geometry, high speeds, light oil or dry, expect short chips.
Can CC751S be welded?
Not recommended for fusion welding (lead + zinc fume/hot cracking); repair by brazing or soft soldering, or mechanically fasten.
Can CC751S be formed, bent or molded?
Casting alloy only — silicon gives high fluidity and good pressure tightness for thin walls; feed with generous risers, degas melt and control zinc loss at low pour temperatures.
What surface finishes work on CC751S?
Polishes and buffs well to a bright brass finish; readily nickel/chrome or bright-brass plated and lacquered; pickle/deburr to remove smeared lead before plating.
CC751S chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| CuEN 1982 range | 63 – 67 | 65 |
| Pbfree-machining addition; restricted for potable-water use in some markets | 1 – 3 | 2 |
| Sifluidity / pressure-tightness addition | 0.2 – 0.8 | 0.5 |
| Snimpurity limit | ≤ 0.5 | — |
| Feimpurity limit | ≤ 0.6 | — |
| Niimpurity limit | ≤ 1 | — |
| Alimpurity limit | ≤ 0.05 | — |
| Mnimpurity limit | ≤ 0.2 | — |
| Sbimpurity limit | ≤ 0.1 | — |
| Znremainder, nominally ~33 % | balance | — |
CC751S-GP — frequently asked
What is CC751S-GP used for?
CC751S-GP is typically used for plumbing fittings, sanitary fittings and general castings. In short: silicon-boosted casting fluidity; thin-wall pressure-tight brass; 80 % free-cutting behaviour.
What is the yield strength of CC751S-GP?
CC751S-GP has a typical yield strength of 140 MPa (20.3 ksi) and a tensile strength of 300 MPa (43.5 ksi) — weaker than 74% of copper alloy grades. Strength varies by condition: see the 5 listed tempers.
Is CC751S-GP easy to machine?
Yes — machinability is rated very good (80/100, better than 86% of copper alloy grades). Excellent free-cutting behaviour (~80 % of AISI 1212): use zero/negative rake brass geometry, high speeds, light oil or dry, expect short chips.
Can CC751S-GP be welded?
Not readily — weldability is rated poor (15/100). Not recommended for fusion welding (lead + zinc fume/hot cracking); repair by brazing or soft soldering, or mechanically fasten.
What surface finishes work on CC751S-GP?
Polishes and buffs well to a bright brass finish; readily nickel/chrome or bright-brass plated and lacquered; pickle/deburr to remove smeared lead before plating.
Can CC751S-GP be formed, bent or molded?
Casting alloy only — silicon gives high fluidity and good pressure tightness for thin walls; feed with generous risers, degas melt and control zinc loss at low pour temperatures.
What is the maximum service temperature of CC751S-GP?
CC751S-GP is rated for continuous use to about 200°C (392 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between CC751S-GS and CC751S-GP?
GS is the default condition — standard sand-cast condition for general fittings, housings and one-off/low-volume parts. GP: for high-volume thin-wall hardware where the silicon addition's fluidity and die-filling are exploited; check availability with the foundry. Yield strength is 90 MPa in GS versus 140 MPa in GP.
Sources
- EN 1982 — Copper and copper alloys: ingots and castings — CEN (2017)
- ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
- Copper alloy datasheets (cast leaded brasses) — Copper Development Association (2023)
- Cast brass alloy datasheets (CuZn33Pb2Si-C / CB751S) — European brass foundries / ingot makers (2023)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.