Tin Plating
Electroplating & electroless plating · Electrolytic bath
Tin plating is a soft, solderable electrodeposit for copper-alloy and steel electrical parts.

What is Tin plate?
ASTM B545 defines service classes and minimum thickness.
How it works
Clean, activated parts are cathodically plated from an acid or alkaline tin electrolyte, usually with a nickel or copper underplate where diffusion or adhesion requires it. Matte tin minimizes organic brightener and is generally preferred where whisker controls matter. Fusing or reflow can change grain structure. As an electrolytic process, tin builds at edges and can be thin in deep recesses.
Why specify it
- Good solderability at 3–15 µm typical thickness
- Low contact resistance for separable low-force contacts
- RoHS-compatible pure tin options
- Protects copper from oxidation during storage
Where it falls short
- Pure tin can grow whiskers
- Fretting corrosion affects mating contacts
- Soft deposit scratches and cold-flows
- Steel needs underplate and corrosion design
Tin plate at a glance
Tin plate is a middle-of-the-range finish; its best score is cosmetic quality (45 of 100), at a standard cost. It adds little surface hardness.
Each score is 0–100 against every finish in this catalog. Corrosion comes from salt-spray life (ASTM B117, log scale) and hardness from the finish layer's Vickers or pencil hardness; cosmetic, lubricity and cost are FabDigit's engineering assessment. Economy on the radar is the inverse of cost.
Tin plate key numbers
Typical values from the governing specifications and shop practice; bars are this finish against the highest value among electroplating & electroless plating finishes.
- Thickness
- 3–8 µm for solderability; 8–15 µm for heavier service or diffusion margin
- Hardness
- 5–20 HV — Tin is very soft; values vary with deposit and test method.
- Corrosion (salt spray)
- 24–48 h per ASTM B117 to red rust on steel, 5–10 µm (typical) — Tin is cathodic to steel, so pores rust early; specified for solderability, not as a barrier.
- Electrical
- Conductive
- Colours
- silver
- Appearance
- Matte white-gray or bright silver-white.
Where Tin plate sits among all finishes
Surface hardness (Vickers, log scale) against corrosion protection (salt-spray hours, log scale) for every coating FabDigit offers, one cloud per finish group. Tin plate is highlighted; hover a dot for its name or open the full map.
Specifications for Tin plate
The documents a drawing cites to define this finish, with the Type / Class rows that apply. Each links to a page explaining the standard.
| Standard | Type / Class | Thickness | Requirement / test | Status |
|---|---|---|---|---|
Standard Specification for Electrodeposited Coatings of Tin · ASTM | Class A | ≥ 3 µm | Low-resistance contacts and mild protected service. · Thickness and applicable contact tests. | Active |
| Class B | ≥ 5 µm | Solderability, anti-galling, stop-off, and similar mild service. · Thickness, adhesion, and solderability when specified. | ||
| Class C | ≥ 8 µm | Indoor moderate exposure and solderability retention. · 10 µm minimum on steel. · Thickness, integrity, and solderability. | ||
| Class D | ≥ 15 µm | Dampness and moderate industrial exposure. · 20 µm minimum on steel. · Thickness, integrity, and applicable corrosion test. | ||
| Class E | 30–125 µm | Elevated temperature, abrasion, or corrosive exposure. · 30–125 µm may be required for abrasion or corrosive media. · Thickness, integrity, and specified performance. | ||
| Class F | ≥ 2 µm | Short-term contact or limited shelf life, subject to purchaser approval. · Thickness and purchaser-approved performance. |
Drawing call-out
MATTE TIN PLATE PER ASTM B545, SERVICE CLASS C, 8 µm MIN OVER 2.5 µm MIN NICKEL UNDERPLATE; PURE TIN, NO BRIGHTENERSPattern: TIN PLATE PER ASTM B545, CLASS <A|B|C|D|E|F>, <MATTE|BRIGHT|FLOW-BRIGHTENED>, <UNDERPLATE>
Which materials take Tin plate?
Verdict per material family, with the grades that behave differently. Each family links to its datasheets in the material library.
| Material family | Verdict | Notes |
|---|---|---|
| Yes | Common electrical substrate; nickel underplate limits zinc diffusion. | |
| Yes | Primary terminal and busbar substrate.
| |
| With care | Needs underplate and edge-corrosion design. | |
| With care | Needs a strike before tin. | |
| Limited | Requires specialized activation and underplating. | |
| Limited | Metal AM electrical parts after porosity review. | |
| Limited | Requires activation and usually a nickel underplate. | |
| No | Fused-filament polymers are incompatible with this process. | |
| No | Incompatible. | |
| No | Polymer powder-bed prints are incompatible with this process. | |
| No | Organic polymers cannot take this inorganic metal-finishing process. | |
| No | Photopolymer prints are incompatible with this process. | |
| No | Polymer powder-bed prints are incompatible with this process. | |
| No | Titanium is not a standard tin-plate substrate. |
How Tin plate is applied, and what it does to the part
- 1Clean
- 2Activate
- 3Underplate if required
- 4Tin plate
- 5Rinse
- 6Optional reflow
- 7Solderability and thickness test
| Dimensions | Allow 3–15 µm tin plus any nickel or copper underplate; threads can gall or bind because tin is soft. |
|---|---|
| Build-up per side | 3–15 µm — Local electrolytic buildup is heavier at edges; add underplate separately. |
| Masking | Usually needed. Mask contact zones requiring another finish, precision fits, and surfaces that must remain weldable. |
| Electrical | Conductive |
| Temperature limit | 150 °C (302 °F) continuous |
| Appearance | Matte white-gray or bright silver-white. |
| Added lead time | 3–6 working days on top of the bare part |
Design rules for Tin plate
What to decide on the drawing before the part goes to the finisher.
- Choose matte tin for whisker-managed designs.Bright deposits can carry higher residual stress.
- Specify an underplate where required.Nickel limits copper-zinc diffusion and supports solderability.
- State shelf-life and solderability tests.Oxide growth and intermetallics change wetting over time.
- Do not use tin against tin in vibration without review.Fretting and cold welding can raise contact resistance.
Tin plate versus the alternatives
Finishes engineers weigh against Tin plate, and when each wins.
| Finish | Corrosion | Hardness | Cosmetic | Cost | Thickness | Choose it when |
|---|---|---|---|---|---|---|
Tin plate this page | 34 | 0 | 45 | $$ | 3–15 µm | — |
| 55 | 39 | 72 | $$$$ | 5–20 µm | when high-current conductivity is more important | |
| 42 | 9 | 35 | $$ | 5–25 µm | when a predeposited solder alloy is required |
The radar overlays Tin plate with Silver Plating, its most common alternative — chosen when high-current conductivity is more important. Scores in the table are 0–100 across every finish in the catalog.
Cost, lead time and compliance
Relative cost
Tin Plating is a standard-cost finish ($$): cheaper than about 78 % of the finishes FabDigit quotes.
Finishing is priced per part with a lot minimum, from FabDigit's own China-side rates cross-checked against US job-shop pricing. The exact figure appears on the instant quote once the part is uploaded.
Lead time and compliance
| Added lead time | 3–6 working days |
|---|---|
| RoHS | Compliant |
| Notes | Pure tin is RoHS compatible; whisker risk requires product-specific controls. |
What Tin plate is used for
- Busbars
- Terminal pins
- Battery contacts
- Solderable lugs
Tin plate — frequently asked
how thick is tin plating
Typical engineering tin is 3–15 µm. Solderable terminals often use 3–8 µm, while heavier service uses 8–15 µm plus any required underplate.
matte tin vs bright tin plating
Matte tin uses fewer brighteners and is generally preferred in whisker-risk controls. Bright tin looks smoother but may have higher residual stress and different solderability aging.
does tin plating grow whiskers
Pure tin can spontaneously grow conductive whiskers, especially under compressive stress. Mitigations include matte deposits, nickel underplates, annealing, design spacing, and a documented control plan.
is tin plating solderable
Yes, solderability is its main use, commonly at 3–15 µm. Storage oxidation and copper-tin intermetallic growth can reduce wetting, so shelf life and underplate matter.
tin plating vs silver plating
Tin is lower cost and readily solderable but soft and vulnerable to fretting and whiskers. Silver handles higher current with better conductivity, typically at 5–20 µm, but tarnishes in sulfur atmospheres.
