Gold Plating
Electroplating & electroless plating · Electrolytic bath
Gold plating supplies tarnish-free, low-resistance contact surfaces and decorative color.

What is Gold plate?
ASTM B488 defines purity, hardness, and thickness classes for engineering gold.
How it works
Parts are cleaned, activated, and usually nickel underplated to block copper diffusion. Direct current deposits pure or alloy-hardened gold from a controlled electrolyte. Selective rack, brush, or reel-to-reel methods confine precious metal to functional areas. Current density still drives edge buildup and recess thinning, so contact-zone thickness must be measured locally. Cobalt or nickel additions harden connector gold, while high-purity soft gold is reserved for wire bonding and similarly sensitive interfaces.
Why specify it
- Does not form insulating oxide in service
- 0.5–5 µm covers decorative through durable contact classes
- Very low contact resistance
- Nickel underplate limits copper diffusion
Where it falls short
- High material cost
- Thin soft gold wears rapidly under sliding contact
- Porous deposits can expose reactive underlayers
- Nickel underplate may be prohibited in wire-bonding systems
Gold plate at a glance
Gold plate is strongest on cosmetic quality (92 of 100), at a high cost.
Each score is 0–100 against every finish in this catalog. Corrosion comes from salt-spray life (ASTM B117, log scale) and hardness from the finish layer's Vickers or pencil hardness; cosmetic, lubricity and cost are FabDigit's engineering assessment. Economy on the radar is the inverse of cost.
Gold plate key numbers
Typical values from the governing specifications and shop practice; bars are this finish against the highest value among electroplating & electroless plating finishes.
- Thickness
- 0.5–1.25 µm for light-duty contacts; 1.25–2.5 µm or more for durable separable contacts
- Hardness
- 60–200 HV — Soft high-purity gold is at the low end; cobalt- or nickel-hardened contact gold is higher.
- Corrosion (salt spray)
- — — Gold itself does not corrode, but 0.1–2.5 µm deposits are porous; protection of the base metal comes from the nickel underplate and the pore count (ASTM B735), not from the gold. Specified for contact resistance and solderability, not as a barrier coating.
- Electrical
- Conductive
- Colours
- gold
- Appearance
- Bright yellow gold; shade varies with purity and hardening alloy.
Where Gold plate sits among all finishes
Surface hardness (Vickers, log scale) against corrosion protection (salt-spray hours, log scale) for every coating FabDigit offers, one cloud per finish group. Gold plate is highlighted; hover a dot for its name or open the full map.
Specifications for Gold plate
The documents a drawing cites to define this finish, with the Type / Class rows that apply. Each links to a page explaining the standard.
| Standard | Type / Class | Thickness | Requirement / test | Status |
|---|---|---|---|---|
Standard Specification for Electrodeposited Coatings of Gold for Engineering Uses · ASTM | Type I | — | At least 99.7% gold; compatible with Codes A, B, or C. · Gold purity and Knoop hardness. | Active |
| Type II | — | At least 99.0% gold; compatible with Codes B, C, or D. · Gold purity and Knoop hardness. | ||
| Type III | — | At least 99.9% gold; soft Code A deposit. · Gold purity and Knoop hardness. | ||
| Codes A–D | — | A ≤90, B 91–129, C 130–200, D >200 HK25. · Knoop hardness at 25 gf. | ||
| Thickness 0.25–5.0 | 0.3–5 µm | Common minimum thickness designations of 0.25, 0.50, 0.75, 1.0, 1.25, 2.5, and 5.0 µm. · Local coating thickness. |
Drawing call-out
GOLD PLATE PER ASTM B488, TYPE II, GRADE C, CLASS 1.25, 1.25 µm MIN OVER 2.5 µm MIN NICKEL UNDERPLATE ON CONTACT AREA ONLYPattern: GOLD PLATE PER ASTM B488, TYPE <I|II|III>, CODE <A|B|C|D>, THICKNESS <µm>, UNDERPLATE <SYSTEM>
Which materials take Gold plate?
Verdict per material family, with the grades that behave differently. Each family links to its datasheets in the material library.
| Material family | Verdict | Notes |
|---|---|---|
| Yes | Common decorative and electrical substrate after cleaning. | |
| Yes | Common over nickel underplate. | |
| Yes | Common barrier and support substrate. | |
| With care | Requires zincate and multilayer underplating. | |
| With care | Metal AM parts can be plated after density, powder, and porosity review. | |
| With care | Requires activation and strike. | |
| With care | Requires copper and/or nickel underplates. | |
| With care | Die castings need a protective strike before acid baths. | |
| Limited | Highly reactive; needs a qualified pretreatment and is rarely plated this way. | |
| Limited | Only plateable resins after etch, catalyst, and electroless metallization. | |
| Limited | Only if the resin is qualified for metallization; most SLA parts are not. | |
| Limited | Possible only with specialized activation; not a routine job-shop sequence. | |
| No | Fused-filament polymers are not a standard plating substrate. | |
| No | Porous nylon powder-bed parts are not a standard plating substrate. | |
| No | Porous nylon powder-bed parts are not a standard plating substrate. |
How Gold plate is applied, and what it does to the part
- 1Clean
- 2Activate
- 3Nickel underplate unless prohibited
- 4Gold plate selectively
- 5Rinse
- 6Porosity or thickness test
- 7Package against abrasion
| Dimensions | Include nickel or copper underplate in total buildup; measure gold on the specified contact surface. |
|---|---|
| Build-up per side | 0.5–5 µm — Add underplate thickness separately; selective plating minimizes nonfunctional coverage. |
| Masking | Usually needed. Selective masking is normally essential to control precious-metal area and protect dimensions. |
| Electrical | Conductive |
| Appearance | Bright yellow gold; shade varies with purity and hardening alloy. |
| Added lead time | 4–8 working days on top of the bare part |
Design rules for Gold plate
What to decide on the drawing before the part goes to the finisher.
- Define the selective plating boundary.Gold outside the contact zone adds cost without function.
- Specify gold type and hardness code.Soft and hard gold have different wear and bonding behavior.
- Specify underplate material and thickness.Copper diffusion can reach thin gold and degrade the surface.
- Avoid sharp contact edges.Current crowding wastes gold and increases mating wear.
Gold plate versus the alternatives
Finishes engineers weigh against Gold plate, and when each wins.
| Finish | Corrosion | Hardness | Cosmetic | Cost | Thickness | Choose it when |
|---|---|---|---|---|---|---|
Gold plate this page | 68 | 39 | 92 | $$$$ | 0.5–5 µm | — |
| 55 | 39 | 72 | $$$$ | 5–20 µm | when high-current conductivity outweighs tarnish resistance | |
| 34 | 0 | 45 | $$ | 3–15 µm | when a low-cost solderable termination is sufficient |
The radar overlays Gold plate with Silver Plating, its most common alternative — chosen when high-current conductivity outweighs tarnish resistance. Scores in the table are 0–100 across every finish in the catalog.
Cost, lead time and compliance
Relative cost
Gold Plating is a high-cost finish ($$$$): more expensive than about 98 % of the finishes FabDigit quotes.
Finishing is priced per part with a lot minimum, from FabDigit's own China-side rates cross-checked against US job-shop pricing. The exact figure appears on the instant quote once the part is uploaded.
Lead time and compliance
| Added lead time | 4–8 working days |
|---|---|
| RoHS | Compliant |
| Notes | Gold deposits are RoHS compatible; bath chemistry and nickel underlayers require occupational and wastewater controls. |
What Gold plate is used for
- High-reliability connectors
- Sensor contacts
- RF hardware
- Medical contacts
- Decorative hardware
Gold plate — frequently asked
how thick is gold plating on contacts
Light-duty contacts often use 0.5–1.25 µm, while durable separable contacts commonly use 1.25–2.5 µm or more. ASTM B488 class and local contact-zone thickness should be stated.
hard gold vs soft gold plating
Soft gold is high purity and suits wire bonding or low-force applications. Hard gold includes small cobalt or nickel additions, reaches roughly 130–200 HV, and better resists connector wear.
why nickel under gold plating
A nickel layer blocks copper diffusion and provides a harder support under 0.5–5 µm of gold. Without it, copper can migrate to the surface and oxidize.
gold plating vs silver plating
Gold remains tarnish-free and is preferred for low-level reliable signals. Silver is more conductive and less costly for high-current use, but sulfur tarnish must be managed.
can gold plate aluminum
Yes, through an aluminum-specific zincate and nickel or copper underplate sequence. The total buildup is much greater than the 0.5–5 µm gold top layer.
