FabDigit

Copper Alloy C10200

UNS C10200 · ASTM B170 · EN Cu-OF, CW008A · JIS C1020 · GB TU2

C10200 is oxygen-free wrought copper (99.95 % Cu minimum; CW008A, Cu-OF, TU2) with no oxide phase, so it does not embrittle in reducing or hydrogen atmospheres.

Values for the O condition

C10200 tempers and conditions

C10200 is supplied in 14 conditions, soft to hard. O is the default FabDigit quotes; the values on this page are for it.

Compare all 14 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
ODefault
Annealed
Most stocked condition: maximum ductility and conductivity for deep drawing, bending, gaskets, vacuum parts and busbar forming.692214545 HB101 % IACS
Hot rolled and annealed
Fully softened hot-rolled/hot-worked oxygen-free copper plate, bar and shapes with maximum ductility and ~101% IACS conductivity.692214545 HB101 % IACS
As hot rolled
Mill condition for thick plate, billet and heavy busbar that will be machined or annealed afterwards.752204545 HB101 % IACS
Annealed to 0.025 mm grain size
Fine-grain anneal for strip that must be formed and then keep a smooth (non-orange-peel) surface.902354050 HB101 % IACS
Eighth hard
Slight stiffening over annealed while keeping near-full formability; common for busbar and lead frames that still need bending.1702503060 HB100.5 % IACS
Light drawn
Light-drawn OF tube: stiffer than annealed but still bendable, used for vacuum and cryogenic lines.1952552570 HB100 % IACS
Quarter hard
Balanced strength/bendability for stamped contacts and shielding that see moderate forming.2052622570 HB100 % IACS
Half hard
Standard semi-rigid temper for bar, rod and strip needing handling stiffness with 90° bendability.2502901480 HB100 % IACS
Three-quarter hard
Intermediate step to full hard when higher yield is needed but full-hard brittleness in bending is unacceptable.2753151088 HB99.5 % IACS
Hard drawn
Hard-drawn seamless tube and rod for pressure lines, waveguides and machined vacuum hardware.2753151590 HB99 % IACS
Full hard
Highest routinely stocked strength for flat springs, hard-drawn wire/rod and machined parts needing chip control.310345695 HB99 % IACS
Extra hard
Thin strip/wire needing extra stiffness where forming is limited to gentle radii.3403654100 HB98.5 % IACS
Spring hard
Spring-temper strip/wire for contacts, gaskets and RF fingers where elastic limit matters more than ductility.3503804105 HB98 % IACS
Extra spring hard
Maximum cold-worked strength available in thin OF copper foil/strip; essentially flat-form only.3653933110 HB98 % IACS

What is C10200?

C10200 is oxygen-free wrought copper (99.95 % Cu minimum; CW008A, Cu-OF, TU2) with no oxide phase, so it does not embrittle in reducing or hydrogen atmospheres. It carries 101 % IACS electrical conductivity and 391 W/m·K thermal conductivity and is stocked as bar, plate, sheet, strip and tube in tempers from O through H10, with 45 % elongation and a formability score of 98 when annealed. Strength is low (69 MPa yield, 221 MPa tensile, 45 HB), machining is gummy, and service is limited to about 250 °C; C11000 ETP copper is cheaper where hydrogen brazing is not involved. C10200 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,083°C (1,981 °F). C10200 has a yield strength of 69 MPa (10 ksi) and a tensile strength of 221 MPa (32.1 ksi) — weaker than 96% of copper alloy grades. Elongation at break is 45% and the elastic modulus is 117 GPa (17 Msi).

What is C10200 used for?

  • Electrical conductors and bus bars
  • RF cavities and waveguides
  • Vacuum chamber components and seals
  • Hydrogen-brazed heat exchangers
  • Heat sinks and cold plates
  • Transformer and switchgear terminals
  • Deep-drawn and spun copper shells

Advantages

  • Forms and bends easily — 98/100, better than 99% of copper alloy grades
  • Conducts heat well — 391 W/m·K (225.9 BTU/hr·ft·°F), better than 98% of copper alloy grades
  • High electrical conductivity — 101 % IACS, better than 98% of copper alloy grades
  • Ductile — tolerates forming and impact — 45%, better than 91% of copper alloy grades
  • Readily welded — 65/100, better than 80% of copper alloy grades

Limitations

  • Low strength — 69 MPa (10 ksi), worse than 96% of copper alloy grades
  • Difficult to machine — 22/100, worse than 94% of copper alloy grades

C10200 properties

Typical room-temperature values for C10200-O; bars are the position among copper alloy grades.

Physical3

C10200 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,083°C (1,981 °F).

Density8.94 g/cm³0.32 lb/in³
Melting Point (Solidus)1,083°C1,981 °F
Liquidus Temperature1,083°C1,981 °F

Mechanical12

C10200 has a yield strength of 69 MPa (10 ksi) and a tensile strength of 221 MPa (32.1 ksi) — weaker than 96% of copper alloy grades. Elongation at break is 45% and the elastic modulus is 117 GPa (17 Msi).

Elastic (Young's) Modulus117 GPa17 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus140 GPa20.3 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)221 MPa32.1 ksi
Yield Strength (0.2% offset)69 MPa10 ksi
Elongation at Break45%
Reduction in Area75%
Shear Strength152 MPa22 ksi
Fatigue Strength (Endurance Limit)76 MPa11 ksi
Hardness, Brinell45 HB
Hardness, Vickers50 HV

Thermal6

C10200 is rated for continuous service to 250°C (482 °F). It conducts heat at 391 W/m·K (225.9 BTU/hr·ft·°F), better than 98% of copper alloy grades. Thermal expansion is 16.9 µm/m·K (9.39 µin/in·°F).

Thermal Conductivity391 W/m·K226 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)16.9 µm/m·K9.4 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)250°C482 °F
Min Service Temperature-253°C-423 °F

Electrical3

C10200 conducts electricity at 101 % IACS, better than 98% of copper alloy grades.

Electrical Conductivity101 % IACS
Electrical Resistivity1.71×10⁻⁸ Ω·m0.672 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is very good (70/100), better than 76% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.25 V
Corrosion ResistanceVery good70/100
Chemical Resistance SummaryGood in fresh/sea water, non-oxidising acids and most organic media; attacked by ammonia and amines (SCC risk in Cu-ammonia), nitric acid, oxidising acids, sulphur compounds and moist halogens; tarnishes/oxidises freely above ~150 °C in air.

Sustainability4

Producing a kilogram of C10200 takes about 57 MJ of energy and emits 3.8 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 20%.

Embodied Energy (primary production)57 MJ/kg24,506 BTU/lb
Embodied Carbon (primary production)3.8 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content20%

Manufacturability8

C10200's machinability is poor (22/100, worse than 94% of copper alloy grades); weldability good (65/100); formability excellent (98/100).

MachinabilityPoor22/100
Machinability Rating (AISI 1212 = 100 %)18%
WeldabilityGood65/100
Formability (cold)Excellent98/100
CastabilityFair35/100
Brazeability / SolderabilityExcellent97/100
PolishabilityVery good80/100
Anodizing Responsen/a — copper is not anodised; protect with Ni/Ag/Sn electroplating, chromate-free passivation or clear lacquer

Common Calculations5

Specific Strength (UTS / density)calculated25 kN·m/kg
Specific Stiffness (E / density)calculated13.1 MN·m/kg
Modulus of Resiliencecalculated20 kJ/m³
Thermal Diffusivitycalculated113.6 mm²/s
Thermal Shock Resistance Indexcalculated44

Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.

Strength versus weight in the copper alloy family

Yield strength against density for every copper alloy grade FabDigit runs. C10200 is highlighted; hover a dot for its name, or open the interactive family chart.

501002005001,0007.588.599.5Density (g/cm³)Yield strength (MPa) — log scaleC10200

Working with C10200

Is C10200 easy to machine?

Gummy and stringy — use sharp positive-rake tools, high speed, generous soluble-oil coolant and H02/H04 temper (never annealed) for acceptable chip break; rating ~20 % of free-cutting brass.

Can C10200 be welded?

GTAW/GMAW with ERCu filler, helium or Ar-He shielding and 200–400 °C preheat on thick sections to overcome the heat sink; no hydrogen embrittlement risk, so brazing and hydrogen-furnace brazing are excellent.

Can C10200 be formed, bent or molded?

Outstanding cold formability in O temper (deep draw, coin, spin, roll-form); interanneal at 375–650 °C when total reduction exceeds ~60 %.

Manufacturability

The process limits FabDigit's quote engine applies to C10200. Design inside these and the part quotes instantly; outside them it routes to an engineer.

CNC machining

MachinabilityFair22 / 100
ISO material groupN.5
Cutting speed (rough / finish)180 / 220 m/min
Minimum wall0.8 mm
Minimum internal radius1 mm
Drill depth limit6× diameter
Best surface (machined / polished)Ra 1.6 / —
Hardenable after machiningNo

Sheet metal

FormabilityExcellent98 / 100
WeldabilityGood65 / 100
BendableYes

C10200 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
O10 ppm max — defines the 'oxygen-free' grade≤ 05×10⁻⁴
Pnot deliberately added (deoxidiser-free to preserve conductivity)≤ 3×10⁻⁴
Agcounted as copper≈ 00
Total other impuritiesBi, Pb, S, Se, Te, Sb, As, Fe, Ni, Sn, Zn each held to ppm levels per ASTM B170≤ 0.05
CuCu + Ag, oxygen-free; ASTM B170 Grade 2 / UNS C10200≥ 99.95 (balance)

What surface finishes work on C10200?

Not anodisable — bright-dip/pickle then electroplate Ni, Ag, Sn or Au, or apply benzotriazole passivation/clear lacquer; polishes to a high mirror finish but tarnishes quickly if unprotected.

Surface treatments FabDigit runs on copper alloy parts — pick them in the quote configurator or call them out on the drawing. Each links to its datasheet in the surface-finish library (thickness, specs, call-out, material verdicts).

Equivalent designations

Standards and trade names that resolve to Copper Alloy C10200 in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.

ASTM
B170
EN / DIN / Werkstoff-Nr.
Cu-OFCW008ACR008A
GB (China)
TU2
Trade names
OFC CopperOxygen-Free CopperOF Copper

How much does C10200 cost?

C10200 is a high-cost copper alloy ($$$$), pricier than about 98% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.

C10200 — frequently asked

What is C10200 used for?

C10200 is typically used for electrical conductors and bus bars, RF cavities and waveguides, vacuum chamber components and seals, hydrogen-brazed heat exchangers, heat sinks and cold plates and transformer and switchgear terminals. In short: oxygen-free pure copper.

What is the yield strength of C10200?

C10200 has a typical yield strength of 69 MPa (10 ksi) and a tensile strength of 221 MPa (32.1 ksi) — weaker than 96% of copper alloy grades. Strength varies by condition: see the 14 listed tempers.

Is C10200 easy to machine?

Not especially — machinability is rated poor (22/100, worse than 94% of copper alloy grades). Gummy and stringy — use sharp positive-rake tools, high speed, generous soluble-oil coolant and H02/H04 temper (never annealed) for acceptable chip break; rating ~20 % of free-cutting brass.

Can C10200 be welded?

Yes — weldability is rated good (65/100). GTAW/GMAW with ERCu filler, helium or Ar-He shielding and 200–400 °C preheat on thick sections to overcome the heat sink; no hydrogen embrittlement risk, so brazing and hydrogen-furnace brazing are excellent.

What surface finishes work on C10200?

Not anodisable — bright-dip/pickle then electroplate Ni, Ag, Sn or Au, or apply benzotriazole passivation/clear lacquer; polishes to a high mirror finish but tarnishes quickly if unprotected.

Can C10200 be formed, bent or molded?

Outstanding cold formability in O temper (deep draw, coin, spin, roll-form); interanneal at 375–650 °C when total reduction exceeds ~60 %.

What is the maximum service temperature of C10200?

C10200 is rated for continuous use to about 250°C (482 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C10200-O and C10200-H10?

O is the default condition — most stocked condition: maximum ductility and conductivity for deep drawing, bending, gaskets, vacuum parts and busbar forming. H10: maximum cold-worked strength available in thin OF copper foil/strip; essentially flat-form only. Yield strength is 69 MPa in O versus 365 MPa in H10.

How much does C10200 cost?

C10200 is a high-cost copper alloy ($$$$), pricier than about 98% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.

Can FabDigit make parts in C10200?

Yes — C10200 is available for CNC machining and sheet metal with instant online pricing. Upload a STEP file to get a price and a DFM check.

Sources

  1. ASTM B170 — Oxygen-Free Electrolytic Copper Refinery Shapes — ASTM International (2019)
  2. ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM International (2019)
  3. ASTM B187 — Copper Bus Bar, Rod and Shapes — ASTM International (2020)
  4. EN 13601 / EN 1976 — Cu-OF (CW008A) — CEN (2013)
  5. CDA/copper.org alloy datasheet C10200 — Copper Development Association (2024)
  6. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)

Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.