Copper Alloy C10200 · supply condition
Copper Alloy C10200-H01
Properties of the H01 condition, compared with the other C10200 tempers.
Balanced strength/bendability for stamped contacts and shielding that see moderate forming.
What is C10200-H01?
C10200-H01 is C10200 supplied in the H01 condition — balanced strength/bendability for stamped contacts and shielding that see moderate forming. C10200-H01 has a yield strength of 205 MPa (29.7 ksi) and a tensile strength of 262 MPa (38 ksi) — weaker than 52% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 117 GPa (17 Msi). C10200-H01 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,083°C (1,981 °F). O is the default condition FabDigit quotes; H01 is available on request or by drawing note.
Advantages
- Conducts heat well — 391 W/m·K (225.9 BTU/hr·ft·°F), better than 98% of copper alloy grades
- High electrical conductivity — 100 % IACS, better than 95% of copper alloy grades
- Forms and bends easily — 82/100, better than 82% of copper alloy grades
- Readily welded — 65/100, better than 79% of copper alloy grades
Limitations
- Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades
- Difficult to machine — 22/100, worse than 94% of copper alloy grades
C10200-H01 properties
Typical room-temperature values for C10200-H01 — 9 properties are specific to this condition; the rest are grade-level values shared by every C10200 temper. Each bar shows where the value sits among the copper alloy grades in FabDigit's library — further right is higher.
Physical3
C10200-H01 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,083°C (1,981 °F).
Mechanical12
C10200-H01 has a yield strength of 205 MPa (29.7 ksi) and a tensile strength of 262 MPa (38 ksi) — weaker than 52% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 117 GPa (17 Msi).
Thermal6
C10200-H01 is rated for continuous service to 150°C (302 °F). It conducts heat at 391 W/m·K (225.9 BTU/hr·ft·°F), better than 98% of copper alloy grades. Thermal expansion is 16.9 µm/m·K (9.39 µin/in·°F).
Electrical3
C10200-H01 conducts electricity at 100 % IACS, better than 95% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is very good (70/100), better than 76% of copper alloy grades.
Sustainability4
Producing a kilogram of C10200-H01 takes about 57 MJ of energy and emits 3.8 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 20%.
Manufacturability8
C10200-H01's machinability is poor (22/100, worse than 94% of copper alloy grades); weldability good (65/100); formability very good (82/100).
Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.
Other C10200 tempers and conditions
C10200 is also supplied in 13 other conditions. The full side-by-side table is on the C10200 overview.
- ODefaultMost stocked condition: maximum ductility and conductivity for deep drawing, bending, gaskets, vacuum parts and busbar forming.69 MPa yield · 45 HB
- H10Maximum cold-worked strength available in thin OF copper foil/strip; essentially flat-form only.365 MPa yield · 110 HB
- H08Spring-temper strip/wire for contacts, gaskets and RF fingers where elastic limit matters more than ductility.350 MPa yield · 105 HB
- H06Thin strip/wire needing extra stiffness where forming is limited to gentle radii.340 MPa yield · 100 HB
- H04Highest routinely stocked strength for flat springs, hard-drawn wire/rod and machined parts needing chip control.310 MPa yield · 95 HB
- H03Intermediate step to full hard when higher yield is needed but full-hard brittleness in bending is unacceptable.275 MPa yield · 88 HB
- H80Hard-drawn seamless tube and rod for pressure lines, waveguides and machined vacuum hardware.275 MPa yield · 90 HB
- H02Standard semi-rigid temper for bar, rod and strip needing handling stiffness with 90° bendability.250 MPa yield · 80 HB
- H01Balanced strength/bendability for stamped contacts and shielding that see moderate forming.205 MPa yield · 70 HB
- H00Slight stiffening over annealed while keeping near-full formability; common for busbar and lead frames that still need bending.170 MPa yield · 60 HB
- O25Fully softened hot-rolled/hot-worked oxygen-free copper plate, bar and shapes with maximum ductility and ~101% IACS conductivity.69 MPa yield · 45 HB
Working with C10200-H01
Is C10200 easy to machine?
Gummy and stringy — use sharp positive-rake tools, high speed, generous soluble-oil coolant and H02/H04 temper (never annealed) for acceptable chip break; rating ~20 % of free-cutting brass.
Can C10200 be welded?
GTAW/GMAW with ERCu filler, helium or Ar-He shielding and 200–400 °C preheat on thick sections to overcome the heat sink; no hydrogen embrittlement risk, so brazing and hydrogen-furnace brazing are excellent.
Can C10200 be formed, bent or molded?
Outstanding cold formability in O temper (deep draw, coin, spin, roll-form); interanneal at 375–650 °C when total reduction exceeds ~60 %.
What surface finishes work on C10200?
Not anodisable — bright-dip/pickle then electroplate Ni, Ag, Sn or Au, or apply benzotriazole passivation/clear lacquer; polishes to a high mirror finish but tarnishes quickly if unprotected.
C10200 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| O10 ppm max — defines the 'oxygen-free' grade | ≤ 0 | 5×10⁻⁴ |
| Pnot deliberately added (deoxidiser-free to preserve conductivity) | ≤ 3×10⁻⁴ | — |
| Agcounted as copper | ≈ 0 | 0 |
| Total other impuritiesBi, Pb, S, Se, Te, Sb, As, Fe, Ni, Sn, Zn each held to ppm levels per ASTM B170 | ≤ 0.05 | — |
| CuCu + Ag, oxygen-free; ASTM B170 Grade 2 / UNS C10200 | ≥ 99.95 (balance) | — |
C10200-H01 — frequently asked
What is C10200-H01 used for?
C10200-H01 is typically used for electrical conductors and bus bars, RF cavities and waveguides, vacuum chamber components and seals, hydrogen-brazed heat exchangers, heat sinks and cold plates and transformer and switchgear terminals. In short: oxygen-free pure copper.
What is the yield strength of C10200-H01?
C10200-H01 has a typical yield strength of 205 MPa (29.7 ksi) and a tensile strength of 262 MPa (38 ksi) — weaker than 52% of copper alloy grades. Strength varies by condition: see the 14 listed tempers.
Is C10200-H01 easy to machine?
Not especially — machinability is rated poor (22/100, worse than 94% of copper alloy grades). Gummy and stringy — use sharp positive-rake tools, high speed, generous soluble-oil coolant and H02/H04 temper (never annealed) for acceptable chip break; rating ~20 % of free-cutting brass.
Can C10200-H01 be welded?
Yes — weldability is rated good (65/100). GTAW/GMAW with ERCu filler, helium or Ar-He shielding and 200–400 °C preheat on thick sections to overcome the heat sink; no hydrogen embrittlement risk, so brazing and hydrogen-furnace brazing are excellent.
What surface finishes work on C10200-H01?
Not anodisable — bright-dip/pickle then electroplate Ni, Ag, Sn or Au, or apply benzotriazole passivation/clear lacquer; polishes to a high mirror finish but tarnishes quickly if unprotected.
Can C10200-H01 be formed, bent or molded?
Outstanding cold formability in O temper (deep draw, coin, spin, roll-form); interanneal at 375–650 °C when total reduction exceeds ~60 %.
What is the maximum service temperature of C10200-H01?
C10200-H01 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C10200-O and C10200-H10?
O is the default condition — most stocked condition: maximum ductility and conductivity for deep drawing, bending, gaskets, vacuum parts and busbar forming. H10: maximum cold-worked strength available in thin OF copper foil/strip; essentially flat-form only. Yield strength is 69 MPa in O versus 365 MPa in H10.
Can FabDigit make parts in C10200-H01?
Yes — C10200-H01 is available for CNC machining and sheet metal with instant online pricing. Upload a STEP file to get a price and a DFM check.
Sources
- ASTM B170 — Oxygen-Free Electrolytic Copper Refinery Shapes — ASTM International (2019)
- ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM International (2019)
- ASTM B187 — Copper Bus Bar, Rod and Shapes — ASTM International (2020)
- EN 13601 / EN 1976 — Cu-OF (CW008A) — CEN (2013)
- CDA/copper.org alloy datasheet C10200 — Copper Development Association (2024)
- ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.