Copper Alloy C11100-H55
Temper
UNS C11100
H55 = light drawn / light cold worked
Slight cold work to straighten and stiffen wire while keeping high elongation.
Values for the H55 condition
Other C11100 tempers and conditions
C11100 is listed in 11 conditions; see the grade overview at C11100.
Compare all 11 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Soft annealed | Maximum ductility and conductivity; for tight bending, winding, riveting and formed contacts. | 70 | 230 | 45 | 45 HB | 100 % IACS |
Annealed to 0.050 mm grain size | Coarser-grain annealed strip for deep drawing and severe stretch forming. | 70 | 225 | 48 | 43 HB | 100 % IACS |
Annealed to 0.025 mm grain size | Fine-grain annealed strip for shallow forming with a smooth surface after bending. | 85 | 235 | 42 | 48 HB | 100 % IACS |
H55This page Light drawn / light cold worked | Slight cold work to straighten and stiffen wire while keeping high elongation. | 180 | 270 | 30 | 60 HB | 99 % IACS |
1/8 hard | Minimal cold work for handling stiffness with still-good bending ability. | 195 | 250 | 30 | 62 HB | 99 % IACS |
Quarter hard | Balanced strip temper for stamped terminals and lightly formed conductors. | 220 | 275 | 25 | 70 HB | 98 % IACS |
Half hard | Common strip/bar temper where moderate strength plus some bending is needed. | 250 | 300 | 14 | 82 HB | 98 % IACS |
H04Default Full hard | Standard stocked condition: hard-drawn anneal-resistant copper wire and rod for windings, leads and commutator parts. | 340 | 400 | 3 | 100 HB | 97 % IACS |
Extra hard | Higher cold work for springy strip and stiff conductor sections. | 345 | 365 | 4 | 105 HB | 97 % IACS |
Spring hard | Spring-temper strip/wire for contact fingers and clips needing resilience with high conductivity. | 355 | 380 | 3 | 110 HB | 97 % IACS |
Extra spring hard | Maximum cold-worked strength available in this copper; formability is minimal. | 370 | 395 | 2 | 115 HB | 97 % IACS |
What is C11100-H55?
C11100-H55 is C11100 in the H55 temper — slight cold work to straighten and stiffen wire while keeping high elongation. C11100-H55 has a yield strength of 180 MPa (26.1 ksi) and a tensile strength of 270 MPa (39.2 ksi) — weaker than 59% of copper alloy grades. Elongation at break is 30% and the elastic modulus is 117 GPa (17 Msi). C11100-H55 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F). H04 is the default condition FabDigit quotes; H55 is available on request or by drawing note.
Advantages
- Conducts heat well — 388 W/m·K (224.2 BTU/hr·ft·°F), better than 95% of copper alloy grades
- High electrical conductivity — 99 % IACS, better than 95% of copper alloy grades
- Forms and bends easily — 80/100, better than 83% of copper alloy grades
- Ductile — tolerates forming and impact — 30%, better than 75% of copper alloy grades
C11100-H55 properties
Typical room-temperature values for C11100-H55; 20 are specific to this condition. Other listed values are C11100 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C11100-H55 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).
Mechanical12
C11100-H55 has a yield strength of 180 MPa (26.1 ksi) and a tensile strength of 270 MPa (39.2 ksi) — weaker than 59% of copper alloy grades. Elongation at break is 30% and the elastic modulus is 117 GPa (17 Msi).
Thermal6
C11100-H55 is rated for continuous service to 250°C (482 °F). It conducts heat at 388 W/m·K (224.2 BTU/hr·ft·°F), better than 95% of copper alloy grades. Thermal expansion is 17.7 µm/m·K (9.83 µin/in·°F).
Electrical3
C11100-H55 conducts electricity at 99 % IACS, better than 95% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (60/100), worse than 68% of copper alloy grades.
Sustainability4
Producing a kilogram of C11100-H55 takes about 57 MJ of energy and emits 3.5 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 25%.
Manufacturability8
C11100-H55's machinability is poor (26/100, worse than 81% of copper alloy grades); weldability poor (30/100); formability very good (80/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C11100-H55
Is C11100 easy to machine?
Gummy with long chips — use sharp positive-rake tools, high speed, generous coolant and light finishing passes; rating only ~20% of AISI 1212.
Can C11100 be welded?
Oxygen-bearing copper: avoid fusion welding where possible (porosity and hydrogen embrittlement); prefer brazing, soldering or resistance/ultrasonic joining, and never anneal in hydrogen-rich atmospheres.
Can C11100 be formed, bent or molded?
Excellent cold formability in O60/OS tempers (deep drawing, coining, tight bends); in H04 and above allow only gentle bends or interanneal — note that the Cd addition needs a higher annealing temperature (~350–450 °C) than plain ETP.
What surface finishes work on C11100?
Solders and plates readily (Sn, Ag, Ni); polishes to a bright finish but tarnishes, so lacquer, tin-plate or patinate for service.
C11100 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Cdanneal-resisting addition | 0.01 | 0.01 |
| Otypical residual oxygen of tough-pitch copper, 0.02–0.05 wt% | ≈ 0.03 | 0.03 |
| CuCu + Ag, minimum; oxygen-bearing (tough pitch) | ≥ 99.9 (balance) | — |
C11100-H55 — frequently asked
What is C11100-H55 used for?
C11100-H55 is typically used for magnet wire, commutator segments and high-temperature electrical conductors. In short: softening-resistant tough pitch copper; magnet-wire and commutator grade; higher anneal than C11000.
What is the yield strength of C11100-H55?
C11100-H55 has a typical yield strength of 180 MPa (26.1 ksi) and a tensile strength of 270 MPa (39.2 ksi) — weaker than 59% of copper alloy grades. Strength varies by condition: see the 11 listed tempers.
Is C11100-H55 easy to machine?
Not especially — machinability is rated poor (26/100, worse than 81% of copper alloy grades). Gummy with long chips — use sharp positive-rake tools, high speed, generous coolant and light finishing passes; rating only ~20% of AISI 1212.
Can C11100-H55 be welded?
Not readily — weldability is rated poor (30/100). Oxygen-bearing copper: avoid fusion welding where possible (porosity and hydrogen embrittlement); prefer brazing, soldering or resistance/ultrasonic joining, and never anneal in hydrogen-rich atmospheres.
What surface finishes work on C11100-H55?
Solders and plates readily (Sn, Ag, Ni); polishes to a bright finish but tarnishes, so lacquer, tin-plate or patinate for service.
Can C11100-H55 be formed, bent or molded?
Excellent cold formability in O60/OS tempers (deep drawing, coining, tight bends); in H04 and above allow only gentle bends or interanneal — note that the Cd addition needs a higher annealing temperature (~350–450 °C) than plain ETP.
What is the maximum service temperature of C11100-H55?
C11100-H55 is rated for continuous use to about 250°C (482 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C11100-H04 and C11100-O60?
H04 is the default condition — standard stocked condition: hard-drawn anneal-resistant copper wire and rod for windings, leads and commutator parts. O60: maximum ductility and conductivity; for tight bending, winding, riveting and formed contacts. Yield strength is 340 MPa in H04 versus 70 MPa in O60.
Sources
- CDA Alloy Datasheet C11100 (anneal-resistant electrolytic tough pitch copper) — Copper Development Association (2023)
- ASM Handbook Vol.2: Properties and Selection — Nonferrous Alloys and Special-Purpose Materials — ASM International (1990)
- ASTM B1 — Standard Specification for Hard-Drawn Copper Wire — ASTM International (2021)
- ASTM B601 — Temper Designations for Copper and Copper Alloys — ASTM International (2019)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.