Copper Alloy C11100-H08
Supply condition
UNS C11100
H08 = spring hard
Spring-temper strip/wire for contact fingers and clips needing resilience with high conductivity.
Values for the H08 condition
Other C11100 tempers and conditions
C11100 is listed in 11 conditions; see the grade overview at C11100.
Compare all 11 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Soft annealed | Maximum ductility and conductivity; for tight bending, winding, riveting and formed contacts. | 70 | 230 | 45 | 45 HB | 100 % IACS |
Annealed to 0.050 mm grain size | Coarser-grain annealed strip for deep drawing and severe stretch forming. | 70 | 225 | 48 | 43 HB | 100 % IACS |
Annealed to 0.025 mm grain size | Fine-grain annealed strip for shallow forming with a smooth surface after bending. | 85 | 235 | 42 | 48 HB | 100 % IACS |
Light drawn / light cold worked | Slight cold work to straighten and stiffen wire while keeping high elongation. | 180 | 270 | 30 | 60 HB | 99 % IACS |
1/8 hard | Minimal cold work for handling stiffness with still-good bending ability. | 195 | 250 | 30 | 62 HB | 99 % IACS |
Quarter hard | Balanced strip temper for stamped terminals and lightly formed conductors. | 220 | 275 | 25 | 70 HB | 98 % IACS |
Half hard | Common strip/bar temper where moderate strength plus some bending is needed. | 250 | 300 | 14 | 82 HB | 98 % IACS |
H04Default Full hard | Standard stocked condition: hard-drawn anneal-resistant copper wire and rod for windings, leads and commutator parts. | 340 | 400 | 3 | 100 HB | 97 % IACS |
Extra hard | Higher cold work for springy strip and stiff conductor sections. | 345 | 365 | 4 | 105 HB | 97 % IACS |
H08This page Spring hard | Spring-temper strip/wire for contact fingers and clips needing resilience with high conductivity. | 355 | 380 | 3 | 110 HB | 97 % IACS |
Extra spring hard | Maximum cold-worked strength available in this copper; formability is minimal. | 370 | 395 | 2 | 115 HB | 97 % IACS |
What is C11100-H08?
C11100-H08 is C11100 supplied in the H08 condition — spring-temper strip/wire for contact fingers and clips needing resilience with high conductivity. C11100-H08 has a yield strength of 355 MPa (51.5 ksi) and a tensile strength of 380 MPa (55.1 ksi) — stronger than 74% of copper alloy grades. Elongation at break is 3% and the elastic modulus is 117 GPa (17 Msi). C11100-H08 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F). H04 is the default condition FabDigit quotes; H08 is available on request or by drawing note.
Advantages
- Conducts heat well — 385 W/m·K (222.4 BTU/hr·ft·°F), better than 92% of copper alloy grades
- High electrical conductivity — 97 % IACS, better than 92% of copper alloy grades
Limitations
- Limited ductility — 3%, worse than 97% of copper alloy grades
C11100-H08 properties
Typical room-temperature values for C11100-H08; 20 are specific to this condition. Other listed values are C11100 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C11100-H08 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).
Mechanical12
C11100-H08 has a yield strength of 355 MPa (51.5 ksi) and a tensile strength of 380 MPa (55.1 ksi) — stronger than 74% of copper alloy grades. Elongation at break is 3% and the elastic modulus is 117 GPa (17 Msi).
Thermal6
C11100-H08 is rated for continuous service to 250°C (482 °F). It conducts heat at 385 W/m·K (222.4 BTU/hr·ft·°F), better than 92% of copper alloy grades. Thermal expansion is 17.7 µm/m·K (9.83 µin/in·°F).
Electrical3
C11100-H08 conducts electricity at 97 % IACS, better than 92% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (60/100), worse than 68% of copper alloy grades.
Sustainability4
Producing a kilogram of C11100-H08 takes about 57 MJ of energy and emits 3.5 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 25%.
Manufacturability8
C11100-H08's machinability is fair (35/100, better than 51% of copper alloy grades); weldability poor (30/100); formability poor (25/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C11100-H08
Is C11100 easy to machine?
Gummy with long chips — use sharp positive-rake tools, high speed, generous coolant and light finishing passes; rating only ~20% of AISI 1212.
Can C11100 be welded?
Oxygen-bearing copper: avoid fusion welding where possible (porosity and hydrogen embrittlement); prefer brazing, soldering or resistance/ultrasonic joining, and never anneal in hydrogen-rich atmospheres.
Can C11100 be formed, bent or molded?
Excellent cold formability in O60/OS tempers (deep drawing, coining, tight bends); in H04 and above allow only gentle bends or interanneal — note that the Cd addition needs a higher annealing temperature (~350–450 °C) than plain ETP.
What surface finishes work on C11100?
Solders and plates readily (Sn, Ag, Ni); polishes to a bright finish but tarnishes, so lacquer, tin-plate or patinate for service.
C11100 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Cdanneal-resisting addition | 0.01 | 0.01 |
| Otypical residual oxygen of tough-pitch copper, 0.02–0.05 wt% | ≈ 0.03 | 0.03 |
| CuCu + Ag, minimum; oxygen-bearing (tough pitch) | ≥ 99.9 (balance) | — |
C11100-H08 — frequently asked
What is C11100-H08 used for?
C11100-H08 is typically used for magnet wire, commutator segments and high-temperature electrical conductors. In short: softening-resistant tough pitch copper; magnet-wire and commutator grade; higher anneal than C11000.
What is the yield strength of C11100-H08?
C11100-H08 has a typical yield strength of 355 MPa (51.5 ksi) and a tensile strength of 380 MPa (55.1 ksi) — stronger than 74% of copper alloy grades. Strength varies by condition: see the 11 listed tempers.
Is C11100-H08 easy to machine?
Not especially — machinability is rated fair (35/100, better than 51% of copper alloy grades). Gummy with long chips — use sharp positive-rake tools, high speed, generous coolant and light finishing passes; rating only ~20% of AISI 1212.
Can C11100-H08 be welded?
Not readily — weldability is rated poor (30/100). Oxygen-bearing copper: avoid fusion welding where possible (porosity and hydrogen embrittlement); prefer brazing, soldering or resistance/ultrasonic joining, and never anneal in hydrogen-rich atmospheres.
What surface finishes work on C11100-H08?
Solders and plates readily (Sn, Ag, Ni); polishes to a bright finish but tarnishes, so lacquer, tin-plate or patinate for service.
Can C11100-H08 be formed, bent or molded?
Excellent cold formability in O60/OS tempers (deep drawing, coining, tight bends); in H04 and above allow only gentle bends or interanneal — note that the Cd addition needs a higher annealing temperature (~350–450 °C) than plain ETP.
What is the maximum service temperature of C11100-H08?
C11100-H08 is rated for continuous use to about 250°C (482 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C11100-H04 and C11100-O60?
H04 is the default condition — standard stocked condition: hard-drawn anneal-resistant copper wire and rod for windings, leads and commutator parts. O60: maximum ductility and conductivity; for tight bending, winding, riveting and formed contacts. Yield strength is 340 MPa in H04 versus 70 MPa in O60.
Sources
- CDA Alloy Datasheet C11100 (anneal-resistant electrolytic tough pitch copper) — Copper Development Association (2023)
- ASM Handbook Vol.2: Properties and Selection — Nonferrous Alloys and Special-Purpose Materials — ASM International (1990)
- ASTM B1 — Standard Specification for Hard-Drawn Copper Wire — ASTM International (2021)
- ASTM B601 — Temper Designations for Copper and Copper Alloys — ASTM International (2019)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.