Copper Alloy C10100-H03
Supply condition
UNS C10100 · ASTM B170 · EN Cu-OFE, CW009A · JIS C1011 · GB TU1, TU0
H03 = three-quarter hard
Intermediate step between half and full hard where extra stiffness is needed but full hard is too brittle to form.
Values for the H03 condition
Other C10100 tempers and conditions
C10100 is listed in 12 conditions; see the grade overview at C10100.
Compare all 12 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
ODefault Annealed | Default stocked condition: maximum ductility and conductivity for deep drawing, spinning, gaskets, RF/vacuum parts and cryogenic conductors. | 69 | 235 | 45 | 45 HB | 101 % IACS |
As hot rolled | Hot-rolled plate and bar taken as-produced; softest practical condition for thick sections and machined blanks. | 70 | 220 | 40 | 45 HB | 101 % IACS |
Eighth hard | Slight temper for flatness and easier handling while keeping most of the formability of annealed stock. | 180 | 250 | 30 | 60 HB | 100 % IACS |
Light drawn | Light-drawn seamless tube temper: straight and dimensionally stable yet still bendable for waveguide and coolant lines. | 200 | 255 | 25 | 65 HB | 100 % IACS |
Quarter hard | Moderate temper for bent brackets, terminals and busbar clips needing some stiffness with good bendability. | 220 | 275 | 25 | 70 HB | 99 % IACS |
Half hard | Most common cold-worked strip/bar temper: usable strength for busbars, contacts and machined parts with acceptable bending. | 250 | 295 | 14 | 80 HB | 98 % IACS |
H03This page Three-quarter hard | Intermediate step between half and full hard where extra stiffness is needed but full hard is too brittle to form. | 275 | 315 | 10 | 87 HB | 97.5 % IACS |
Full hard | Standard hard temper for rod, bar and wire: highest strength commonly stocked, best for machining and load-bearing conductors. | 310 | 345 | 6 | 95 HB | 97 % IACS |
Extra hard | Heavily cold-worked strip/wire where strength and springback matter more than any forming ability. | 330 | 365 | 4 | 100 HB | 96.5 % IACS |
Spring hard | Spring-temper strip and wire for contacts, RF gaskets and springs where conductivity must stay near 100% IACS. | 345 | 380 | 4 | 105 HB | 96 % IACS |
Hard drawn | Hard-drawn tube/rod for pressure-carrying and self-supporting conductor runs; requires annealing before tight bending. | 345 | 380 | 8 | 98 HB | 97 % IACS |
Extra spring hard | Maximum cold-worked strength available in pure copper strip/wire; forming limited to gentle radii. | 365 | 400 | 2 | 110 HB | 96 % IACS |
What is C10100-H03?
C10100-H03 is C10100 supplied in the H03 condition — intermediate step between half and full hard where extra stiffness is needed but full hard is too brittle to form. C10100-H03 has a yield strength of 275 MPa (39.9 ksi) and a tensile strength of 315 MPa (45.7 ksi) — stronger than 57% of copper alloy grades. Elongation at break is 10% and the elastic modulus is 117 GPa (17 Msi). C10100-H03 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,083°C (1,981 °F). O is the default condition FabDigit quotes; H03 is available on request or by drawing note.
Advantages
- High electrical conductivity — 97.5 % IACS, better than 93% of copper alloy grades
- Conducts heat well — 385 W/m·K (222.4 BTU/hr·ft·°F), better than 92% of copper alloy grades
- Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
- Readily welded — 60/100, better than 76% of copper alloy grades
Limitations
- Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades
- Limited ductility — 10%, worse than 76% of copper alloy grades
C10100-H03 properties
Typical room-temperature values for C10100-H03; 20 are specific to this condition. Other listed values are C10100 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C10100-H03 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,083°C (1,981 °F).
Mechanical12
C10100-H03 has a yield strength of 275 MPa (39.9 ksi) and a tensile strength of 315 MPa (45.7 ksi) — stronger than 57% of copper alloy grades. Elongation at break is 10% and the elastic modulus is 117 GPa (17 Msi).
Thermal6
C10100-H03 is rated for continuous service to 150°C (302 °F). It conducts heat at 385 W/m·K (222.4 BTU/hr·ft·°F), better than 92% of copper alloy grades. Thermal expansion is 17.7 µm/m·K (9.83 µin/in·°F).
Electrical3
C10100-H03 conducts electricity at 97.5 % IACS, better than 93% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (58/100), worse than 76% of copper alloy grades.
Sustainability4
Producing a kilogram of C10100-H03 takes about 60 MJ of energy and emits 3.8 kg of CO₂ — more than 69% of copper alloy grades. Typical recycled content is 5%.
Manufacturability7
C10100-H03's machinability is poor (30/100, worse than 67% of copper alloy grades); weldability good (60/100); formability fair (45/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C10100-H03
Is C10100 easy to machine?
Gummy and stringy — use sharp positive-rake tools, high speed with moderate feed, flood coolant, and prefer H02/H04 temper over annealed; expect ~20% of AISI 1212 rate.
Can C10100 be welded?
Excellent for GTAW/EBW/laser and resistance welding since there is no cuprous oxide to cause hydrogen embrittlement; high preheat needed on thick sections due to heat conduction, and weld metal softens the HAZ.
Can C10100 be formed, bent or molded?
Outstanding cold formability in O temper (deep draw, spin, coin, bend to zero radius); interstage anneal at 400–650 °C, and hard tempers must be annealed before severe forming.
What surface finishes work on C10100?
Solders and brazes readily; electroplate Ni/Ag/Au directly or polish to mirror finish, but bare surfaces tarnish — protect with lacquer, passivation or plating.
C10100 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| O5 ppm max — defines oxygen-free electronic grade | ≤ 5×10⁻⁴ | 3×10⁻⁴ |
| Ag | ≤ 0 | |
| As | ≤ 5×10⁻⁴ | |
| Sb | ≤ 4×10⁻⁴ | |
| Bi | ≤ 1×10⁻⁴ | |
| Cd | ≤ 1×10⁻⁴ | |
| Fe | ≤ 0 | |
| Pb | ≤ 5×10⁻⁴ | |
| Mn | ≤ 5×10⁻⁵ | |
| Ni | ≤ 0 | |
| P | ≤ 3×10⁻⁴ | |
| S | ≤ 0 | |
| Se | ≤ 3×10⁻⁴ | |
| Te | ≤ 2×10⁻⁴ | |
| Sn | ≤ 2×10⁻⁴ | |
| Zn | ≤ 1×10⁻⁴ | |
| Hg | ≤ 1×10⁻⁴ | |
| Cuincluding Ag; 99.99% min per ASTM B170 Grade 1 / UNS C10100 | ≥ 99.99 (balance) |
C10100-H03 — frequently asked
What is C10100-H03 used for?
C10100-H03 is typically used for vacuum tube and hermetic feedthrough parts, accelerator and microwave RF cavities, high-current busbars and conductors, superconductor stabiliser matrices, semiconductor process chamber components and heat sinks and thermal spreaders. In short: oxygen-free; pure copper.
What is the yield strength of C10100-H03?
C10100-H03 has a typical yield strength of 275 MPa (39.9 ksi) and a tensile strength of 315 MPa (45.7 ksi) — stronger than 57% of copper alloy grades. Strength varies by condition: see the 12 listed tempers.
Is C10100-H03 easy to machine?
Not especially — machinability is rated poor (30/100, worse than 67% of copper alloy grades). Gummy and stringy — use sharp positive-rake tools, high speed with moderate feed, flood coolant, and prefer H02/H04 temper over annealed; expect ~20% of AISI 1212 rate.
Can C10100-H03 be welded?
Yes — weldability is rated good (60/100). Excellent for GTAW/EBW/laser and resistance welding since there is no cuprous oxide to cause hydrogen embrittlement; high preheat needed on thick sections due to heat conduction, and weld metal softens the HAZ.
What surface finishes work on C10100-H03?
Solders and brazes readily; electroplate Ni/Ag/Au directly or polish to mirror finish, but bare surfaces tarnish — protect with lacquer, passivation or plating.
Can C10100-H03 be formed, bent or molded?
Outstanding cold formability in O temper (deep draw, spin, coin, bend to zero radius); interstage anneal at 400–650 °C, and hard tempers must be annealed before severe forming.
What is the maximum service temperature of C10100-H03?
C10100-H03 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C10100-O and C10100-H10?
O is the default condition — default stocked condition: maximum ductility and conductivity for deep drawing, spinning, gaskets, RF/vacuum parts and cryogenic conductors. H10: maximum cold-worked strength available in pure copper strip/wire; forming limited to gentle radii. Yield strength is 69 MPa in O versus 365 MPa in H10.
Can FabDigit make parts in C10100-H03?
Yes — C10100-H03 is available for CNC machining and sheet metal with instant online pricing. Upload a STEP file to get a price and a DFM check.
Sources
- ASTM B170 — Oxygen-Free Electrolytic Copper Refinery Shapes — ASTM (2019)
- ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM (2019)
- ASTM B187 — Copper Bus Bar, Rod and Shapes — ASTM (2020)
- ASTM F68 — Oxygen-Free Copper in Wrought Forms for Electron Devices — ASTM (2019)
- CDA Alloy Datasheet C10100 (copper.org) — Copper Development Association (2024)
- ASM Handbook Vol. 2 — Properties of Nonferrous Alloys — ASM International (1990)
- EN 13601 / CW009A Cu-OFE — CEN (2021)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.