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Copper Alloy C10100 · supply condition

Copper Alloy C10100-H02

Properties of the H02 condition, compared with the other C10100 tempers.

Most common cold-worked strip/bar temper: usable strength for busbars, contacts and machined parts with acceptable bending.

CNC machiningSheet metalSpecialty cost $$$$$

What is C10100-H02?

C10100-H02 is C10100 supplied in the H02 condition — most common cold-worked strip/bar temper: usable strength for busbars, contacts and machined parts with acceptable bending. C10100-H02 has a yield strength of 250 MPa (36.3 ksi) and a tensile strength of 295 MPa (42.8 ksi) — stronger than 54% of copper alloy grades. Elongation at break is 14% and the elastic modulus is 117 GPa (17 Msi). C10100-H02 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,083°C (1,981 °F). O is the default condition FabDigit quotes; H02 is available on request or by drawing note.

Advantages

  • Conducts heat well — 387 W/m·K (223.6 BTU/hr·ft·°F), better than 93% of copper alloy grades
  • High electrical conductivity — 98 % IACS, better than 93% of copper alloy grades
  • Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
  • Readily welded — 70/100, better than 84% of copper alloy grades

Limitations

  • Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades

C10100-H02 properties

Typical room-temperature values for C10100-H02 — 14 properties are specific to this condition; the rest are grade-level values shared by every C10100 temper. Each bar shows where the value sits among the copper alloy grades in FabDigit's library — further right is higher.

Physical3

C10100-H02 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,083°C (1,981 °F).

Density8.94 g/cm³0.32 lb/in³
Melting Point (Solidus)1,083°C1,981 °F
Liquidus Temperature1,083°C1,981 °F

Mechanical12

C10100-H02 has a yield strength of 250 MPa (36.3 ksi) and a tensile strength of 295 MPa (42.8 ksi) — stronger than 54% of copper alloy grades. Elongation at break is 14% and the elastic modulus is 117 GPa (17 Msi).

Elastic (Young's) Modulus117 GPa17 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus140 GPa20.3 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)295 MPa42.8 ksi
Yield Strength (0.2% offset)250 MPa36.3 ksi
Elongation at Break14%
Reduction in Area75%
Shear Strength185 MPa26.8 ksi
Fatigue Strength (Endurance Limit)76 MPa11 ksi
Hardness, Brinell80 HB
Hardness, Vickers85 HV

Thermal6

C10100-H02 is rated for continuous service to 150°C (302 °F). It conducts heat at 387 W/m·K (223.6 BTU/hr·ft·°F), better than 93% of copper alloy grades. Thermal expansion is 17.7 µm/m·K (9.83 µin/in·°F).

Thermal Conductivity387 W/m·K224 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.7 µm/m·K9.8 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)150°C302 °F
Min Service Temperature-253°C-423 °F

Electrical3

C10100-H02 conducts electricity at 98 % IACS, better than 93% of copper alloy grades.

Electrical Conductivity98 % IACS
Electrical Resistivity1.76×10⁻⁸ Ω·m0.693 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (58/100), worse than 76% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.24 V
Corrosion ResistanceGood58/100
Chemical Resistance SummaryGood in fresh and sea water, steam, non-oxidizing acids and most organics; forms protective patina in air. Attacked by ammonia/amines, oxidizing acids (HNO3), oxidizing salts, sulfur and H2S; not for strongly oxidizing or acidic-aerated service.

Sustainability4

Producing a kilogram of C10100-H02 takes about 60 MJ of energy and emits 3.8 kg of CO₂ — more than 69% of copper alloy grades. Typical recycled content is 5%.

Embodied Energy (primary production)60 MJ/kg25,795 BTU/lb
Embodied Carbon (primary production)3.8 kg CO₂/kg
Embodied Water250 L/kg30 gal/lb
Typical Recycled Content5%

Manufacturability7

C10100-H02's machinability is poor (28/100, worse than 76% of copper alloy grades); weldability very good (70/100); formability good (60/100).

MachinabilityPoor28/100
Machinability Rating (AISI 1212 = 100 %)22%
WeldabilityVery good70/100
Formability (cold)Good60/100
Brazeability / SolderabilityExcellent95/100
PolishabilityExcellent85/100
Anodizing Responsen/a — copper is not anodized; use electroplating (Ni/Ag/Au), tin, or clear lacquer for tarnish control

Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.

Other C10100 tempers and conditions

C10100 is also supplied in 11 other conditions. The full side-by-side table is on the C10100 overview.

Working with C10100-H02

Is C10100 easy to machine?

Gummy and stringy — use sharp positive-rake tools, high speed with moderate feed, flood coolant, and prefer H02/H04 temper over annealed; expect ~20% of AISI 1212 rate.

Can C10100 be welded?

Excellent for GTAW/EBW/laser and resistance welding since there is no cuprous oxide to cause hydrogen embrittlement; high preheat needed on thick sections due to heat conduction, and weld metal softens the HAZ.

Can C10100 be formed, bent or molded?

Outstanding cold formability in O temper (deep draw, spin, coin, bend to zero radius); interstage anneal at 400–650 °C, and hard tempers must be annealed before severe forming.

What surface finishes work on C10100?

Solders and brazes readily; electroplate Ni/Ag/Au directly or polish to mirror finish, but bare surfaces tarnish — protect with lacquer, passivation or plating.

C10100 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
O5 ppm max — defines oxygen-free electronic grade≤ 5×10⁻⁴3×10⁻⁴
Ag≤ 0
As≤ 5×10⁻⁴
Sb≤ 4×10⁻⁴
Bi≤ 1×10⁻⁴
Cd≤ 1×10⁻⁴
Fe≤ 0
Pb≤ 5×10⁻⁴
Mn≤ 5×10⁻⁵
Ni≤ 0
P≤ 3×10⁻⁴
S≤ 0
Se≤ 3×10⁻⁴
Te≤ 2×10⁻⁴
Sn≤ 2×10⁻⁴
Zn≤ 1×10⁻⁴
Hg≤ 1×10⁻⁴
Cuincluding Ag; 99.99% min per ASTM B170 Grade 1 / UNS C10100≥ 99.99 (balance)

C10100-H02 — frequently asked

What is C10100-H02 used for?

C10100-H02 is typically used for vacuum tube and hermetic feedthrough parts, accelerator and microwave RF cavities, high-current busbars and conductors, superconductor stabiliser matrices, semiconductor process chamber components and heat sinks and thermal spreaders. In short: oxygen-free; pure copper.

What is the yield strength of C10100-H02?

C10100-H02 has a typical yield strength of 250 MPa (36.3 ksi) and a tensile strength of 295 MPa (42.8 ksi) — stronger than 54% of copper alloy grades. Strength varies by condition: see the 12 listed tempers.

Is C10100-H02 easy to machine?

Not especially — machinability is rated poor (28/100, worse than 76% of copper alloy grades). Gummy and stringy — use sharp positive-rake tools, high speed with moderate feed, flood coolant, and prefer H02/H04 temper over annealed; expect ~20% of AISI 1212 rate.

Can C10100-H02 be welded?

Yes — weldability is rated very good (70/100). Excellent for GTAW/EBW/laser and resistance welding since there is no cuprous oxide to cause hydrogen embrittlement; high preheat needed on thick sections due to heat conduction, and weld metal softens the HAZ.

What surface finishes work on C10100-H02?

Solders and brazes readily; electroplate Ni/Ag/Au directly or polish to mirror finish, but bare surfaces tarnish — protect with lacquer, passivation or plating.

Can C10100-H02 be formed, bent or molded?

Outstanding cold formability in O temper (deep draw, spin, coin, bend to zero radius); interstage anneal at 400–650 °C, and hard tempers must be annealed before severe forming.

What is the maximum service temperature of C10100-H02?

C10100-H02 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C10100-O and C10100-H10?

O is the default condition — default stocked condition: maximum ductility and conductivity for deep drawing, spinning, gaskets, RF/vacuum parts and cryogenic conductors. H10: maximum cold-worked strength available in pure copper strip/wire; forming limited to gentle radii. Yield strength is 69 MPa in O versus 365 MPa in H10.

Can FabDigit make parts in C10100-H02?

Yes — C10100-H02 is available for CNC machining and sheet metal with instant online pricing. Upload a STEP file to get a price and a DFM check.

Sources

  1. ASTM B170 — Oxygen-Free Electrolytic Copper Refinery ShapesASTM (2019)
  2. ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled BarASTM (2019)
  3. ASTM B187 — Copper Bus Bar, Rod and ShapesASTM (2020)
  4. ASTM F68 — Oxygen-Free Copper in Wrought Forms for Electron DevicesASTM (2019)
  5. CDA Alloy Datasheet C10100 (copper.org)Copper Development Association (2024)
  6. ASM Handbook Vol. 2 — Properties of Nonferrous AlloysASM International (1990)
  7. EN 13601 / CW009A Cu-OFECEN (2021)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.