Copper Alloy C10100-H55
Temper
UNS C10100 · ASTM B170 · EN Cu-OFE, CW009A · JIS C1011 · GB TU1, TU0
H55 = light drawn
Light-drawn seamless tube temper: straight and dimensionally stable yet still bendable for waveguide and coolant lines.
Values for the H55 condition
Other C10100 tempers and conditions
C10100 is listed in 12 conditions; see the grade overview at C10100.
Compare all 12 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
ODefault Annealed | Default stocked condition: maximum ductility and conductivity for deep drawing, spinning, gaskets, RF/vacuum parts and cryogenic conductors. | 69 | 235 | 45 | 45 HB | 101 % IACS |
As hot rolled | Hot-rolled plate and bar taken as-produced; softest practical condition for thick sections and machined blanks. | 70 | 220 | 40 | 45 HB | 101 % IACS |
Eighth hard | Slight temper for flatness and easier handling while keeping most of the formability of annealed stock. | 180 | 250 | 30 | 60 HB | 100 % IACS |
H55This page Light drawn | Light-drawn seamless tube temper: straight and dimensionally stable yet still bendable for waveguide and coolant lines. | 200 | 255 | 25 | 65 HB | 100 % IACS |
Quarter hard | Moderate temper for bent brackets, terminals and busbar clips needing some stiffness with good bendability. | 220 | 275 | 25 | 70 HB | 99 % IACS |
Half hard | Most common cold-worked strip/bar temper: usable strength for busbars, contacts and machined parts with acceptable bending. | 250 | 295 | 14 | 80 HB | 98 % IACS |
Three-quarter hard | Intermediate step between half and full hard where extra stiffness is needed but full hard is too brittle to form. | 275 | 315 | 10 | 87 HB | 97.5 % IACS |
Full hard | Standard hard temper for rod, bar and wire: highest strength commonly stocked, best for machining and load-bearing conductors. | 310 | 345 | 6 | 95 HB | 97 % IACS |
Extra hard | Heavily cold-worked strip/wire where strength and springback matter more than any forming ability. | 330 | 365 | 4 | 100 HB | 96.5 % IACS |
Spring hard | Spring-temper strip and wire for contacts, RF gaskets and springs where conductivity must stay near 100% IACS. | 345 | 380 | 4 | 105 HB | 96 % IACS |
Hard drawn | Hard-drawn tube/rod for pressure-carrying and self-supporting conductor runs; requires annealing before tight bending. | 345 | 380 | 8 | 98 HB | 97 % IACS |
Extra spring hard | Maximum cold-worked strength available in pure copper strip/wire; forming limited to gentle radii. | 365 | 400 | 2 | 110 HB | 96 % IACS |
What is C10100-H55?
C10100-H55 is C10100 in the H55 temper — light-drawn seamless tube temper: straight and dimensionally stable yet still bendable for waveguide and coolant lines. C10100-H55 has a yield strength of 200 MPa (29 ksi) and a tensile strength of 255 MPa (37 ksi) — weaker than 54% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 117 GPa (17 Msi). C10100-H55 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,083°C (1,981 °F). O is the default condition FabDigit quotes; H55 is available on request or by drawing note.
Advantages
- High electrical conductivity — 100 % IACS, better than 96% of copper alloy grades
- Conducts heat well — 388 W/m·K (224.2 BTU/hr·ft·°F), better than 95% of copper alloy grades
- Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
- Readily welded — 70/100, better than 85% of copper alloy grades
- Forms and bends easily — 80/100, better than 83% of copper alloy grades
Limitations
- Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades
C10100-H55 properties
Typical room-temperature values for C10100-H55; 20 are specific to this condition. Other listed values are C10100 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C10100-H55 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,083°C (1,981 °F).
Mechanical12
C10100-H55 has a yield strength of 200 MPa (29 ksi) and a tensile strength of 255 MPa (37 ksi) — weaker than 54% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 117 GPa (17 Msi).
Thermal6
C10100-H55 is rated for continuous service to 150°C (302 °F). It conducts heat at 388 W/m·K (224.2 BTU/hr·ft·°F), better than 95% of copper alloy grades. Thermal expansion is 17.7 µm/m·K (9.83 µin/in·°F).
Electrical3
C10100-H55 conducts electricity at 100 % IACS, better than 96% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (58/100), worse than 76% of copper alloy grades.
Sustainability4
Producing a kilogram of C10100-H55 takes about 60 MJ of energy and emits 3.8 kg of CO₂ — more than 69% of copper alloy grades. Typical recycled content is 5%.
Manufacturability7
C10100-H55's machinability is poor (30/100, worse than 67% of copper alloy grades); weldability very good (70/100); formability very good (80/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C10100-H55
Is C10100 easy to machine?
Gummy and stringy — use sharp positive-rake tools, high speed with moderate feed, flood coolant, and prefer H02/H04 temper over annealed; expect ~20% of AISI 1212 rate.
Can C10100 be welded?
Excellent for GTAW/EBW/laser and resistance welding since there is no cuprous oxide to cause hydrogen embrittlement; high preheat needed on thick sections due to heat conduction, and weld metal softens the HAZ.
Can C10100 be formed, bent or molded?
Outstanding cold formability in O temper (deep draw, spin, coin, bend to zero radius); interstage anneal at 400–650 °C, and hard tempers must be annealed before severe forming.
What surface finishes work on C10100?
Solders and brazes readily; electroplate Ni/Ag/Au directly or polish to mirror finish, but bare surfaces tarnish — protect with lacquer, passivation or plating.
C10100 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| O5 ppm max — defines oxygen-free electronic grade | ≤ 5×10⁻⁴ | 3×10⁻⁴ |
| Ag | ≤ 0 | — |
| As | ≤ 5×10⁻⁴ | — |
| Sb | ≤ 4×10⁻⁴ | — |
| Bi | ≤ 1×10⁻⁴ | — |
| Cd | ≤ 1×10⁻⁴ | — |
| Fe | ≤ 0 | — |
| Pb | ≤ 5×10⁻⁴ | — |
| Mn | ≤ 5×10⁻⁵ | — |
| Ni | ≤ 0 | — |
| P | ≤ 3×10⁻⁴ | — |
| S | ≤ 0 | — |
| Se | ≤ 3×10⁻⁴ | — |
| Te | ≤ 2×10⁻⁴ | — |
| Sn | ≤ 2×10⁻⁴ | — |
| Zn | ≤ 1×10⁻⁴ | — |
| Hg | ≤ 1×10⁻⁴ | — |
| Cuincluding Ag; 99.99% min per ASTM B170 Grade 1 / UNS C10100 | ≥ 99.99 (balance) | — |
C10100-H55 — frequently asked
What is C10100-H55 used for?
C10100-H55 is typically used for vacuum tube and hermetic feedthrough parts, accelerator and microwave RF cavities, high-current busbars and conductors, superconductor stabiliser matrices, semiconductor process chamber components and heat sinks and thermal spreaders. In short: oxygen-free; pure copper.
What is the yield strength of C10100-H55?
C10100-H55 has a typical yield strength of 200 MPa (29 ksi) and a tensile strength of 255 MPa (37 ksi) — weaker than 54% of copper alloy grades. Strength varies by condition: see the 12 listed tempers.
Is C10100-H55 easy to machine?
Not especially — machinability is rated poor (30/100, worse than 67% of copper alloy grades). Gummy and stringy — use sharp positive-rake tools, high speed with moderate feed, flood coolant, and prefer H02/H04 temper over annealed; expect ~20% of AISI 1212 rate.
Can C10100-H55 be welded?
Yes — weldability is rated very good (70/100). Excellent for GTAW/EBW/laser and resistance welding since there is no cuprous oxide to cause hydrogen embrittlement; high preheat needed on thick sections due to heat conduction, and weld metal softens the HAZ.
What surface finishes work on C10100-H55?
Solders and brazes readily; electroplate Ni/Ag/Au directly or polish to mirror finish, but bare surfaces tarnish — protect with lacquer, passivation or plating.
Can C10100-H55 be formed, bent or molded?
Outstanding cold formability in O temper (deep draw, spin, coin, bend to zero radius); interstage anneal at 400–650 °C, and hard tempers must be annealed before severe forming.
What is the maximum service temperature of C10100-H55?
C10100-H55 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C10100-O and C10100-H10?
O is the default condition — default stocked condition: maximum ductility and conductivity for deep drawing, spinning, gaskets, RF/vacuum parts and cryogenic conductors. H10: maximum cold-worked strength available in pure copper strip/wire; forming limited to gentle radii. Yield strength is 69 MPa in O versus 365 MPa in H10.
Can FabDigit make parts in C10100-H55?
Yes — C10100-H55 is available for CNC machining and sheet metal with instant online pricing. Upload a STEP file to get a price and a DFM check.
Sources
- ASTM B170 — Oxygen-Free Electrolytic Copper Refinery Shapes — ASTM (2019)
- ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM (2019)
- ASTM B187 — Copper Bus Bar, Rod and Shapes — ASTM (2020)
- ASTM F68 — Oxygen-Free Copper in Wrought Forms for Electron Devices — ASTM (2019)
- CDA Alloy Datasheet C10100 (copper.org) — Copper Development Association (2024)
- ASM Handbook Vol. 2 — Properties of Nonferrous Alloys — ASM International (1990)
- EN 13601 / CW009A Cu-OFE — CEN (2021)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.