Copper Alloy C19400-H01
Supply condition
UNS C19400 · ASTM B465 · EN CW107C, CuFe2P · JIS C1940
H01 = quarter hard
Intermediate temper when forming severity is still high but annealed strength is insufficient.
Values for the H01 condition
Other C19400 tempers and conditions
C19400 is listed in 10 conditions; see the grade overview at C19400.
Compare all 10 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Soft annealed | Maximum ductility for deep drawing and severe forming; lowest strength. | 145 | 315 | 32 | 40 HRB | 65 % IACS |
Light annealed | Partially recrystallised, fine grain: good formability with a useful strength floor and flat strip. | 190 | 340 | 25 | 82 HB | 65 % IACS |
H01This page Quarter hard | Intermediate temper when forming severity is still high but annealed strength is insufficient. | 290 | 380 | 16 | 100 HB | 65 % IACS |
Annealed to temper, half hard | Half-hard strength level reached by controlled anneal rather than final rolling — better flatness and more uniform bend behaviour than rolled H02. | 330 | 415 | 14 | 112 HB | 65 % IACS |
H02Default Half hard | Default stocking temper for lead frames and stamped terminals: balanced strength, bendability and conductivity. | 370 | 420 | 10 | 63 HRB | 65 % IACS |
Full hard | Higher strength for terminals and shields with mild bends only (bend radius ≥ 1t across grain). | 420 | 455 | 6 | 68 HRB | 64 % IACS |
Extra hard | For flat parts and gentle forms needing higher contact force and stress-relaxation resistance. | 460 | 490 | 4 | 136 HB | 64 % IACS |
Spring hard | Spring temper for contact springs where high yield and low relaxation matter more than bend severity. | 495 | 520 | 3 | 144 HB | 63 % IACS |
Extra spring hard | Near-maximum cold work for flat springs and stiff terminals; bends must be with-grain and generous. | 530 | 550 | 2.5 | 152 HB | 63 % IACS |
Strain hardened, half hard | Highest commercially rolled strength for C19400 — flat, blanked or lightly formed spring parts only. | 565 | 585 | 2 | 163 HB | 62 % IACS |
What is C19400-H01?
C19400-H01 is C19400 supplied in the H01 condition — intermediate temper when forming severity is still high but annealed strength is insufficient. C19400-H01 has a yield strength of 290 MPa (42.1 ksi) and a tensile strength of 380 MPa (55.1 ksi) — stronger than 60% of copper alloy grades. Elongation at break is 16% and the elastic modulus is 121 GPa (17.5 Msi). C19400-H01 has a density of 8.91 g/cm³ (0.322 lb/in³), heavier than 80% of copper alloy grades. It melts at 1,080°C (1,976 °F). H02 is the default condition FabDigit quotes; H01 is available on request or by drawing note.
Advantages
- Conducts heat well — 260 W/m·K (150.2 BTU/hr·ft·°F), better than 82% of copper alloy grades
- High electrical conductivity — 65 % IACS, better than 82% of copper alloy grades
- Forms and bends easily — 72/100, better than 82% of copper alloy grades
C19400-H01 properties
Typical room-temperature values for C19400-H01; 18 are specific to this condition. Other listed values are C19400 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C19400-H01 has a density of 8.91 g/cm³ (0.322 lb/in³), heavier than 80% of copper alloy grades. It melts at 1,080°C (1,976 °F).
Mechanical12
C19400-H01 has a yield strength of 290 MPa (42.1 ksi) and a tensile strength of 380 MPa (55.1 ksi) — stronger than 60% of copper alloy grades. Elongation at break is 16% and the elastic modulus is 121 GPa (17.5 Msi).
Thermal6
C19400-H01 is rated for continuous service to 190°C (374 °F). It conducts heat at 260 W/m·K (150.2 BTU/hr·ft·°F), better than 82% of copper alloy grades. Thermal expansion is 16.5 µm/m·K (9.17 µin/in·°F).
Electrical3
C19400-H01 conducts electricity at 65 % IACS, better than 82% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (58/100), worse than 76% of copper alloy grades.
Sustainability4
Producing a kilogram of C19400-H01 takes about 57 MJ of energy and emits 3.8 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 35%.
Manufacturability8
C19400-H01's machinability is poor (30/100, worse than 67% of copper alloy grades); weldability fair (45/100); formability very good (72/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C19400-H01
Is C19400 easy to machine?
Gummy and low machinability (~20 % of free-cutting brass): use sharp positive-rake tools, high speed, generous coolant; stamping/blanking is far more economical than chip cutting.
Can C19400 be welded?
Resistance and laser spot welding are routine; fusion welding is fair — the heat-affected zone recrystallises and loses cold-worked strength, so soldering/brazing is usually preferred.
Can C19400 be formed, bent or molded?
Excellent progressive-die stamping and bending in O/H01/H02; for H06 and harder keep bends with-grain and use radii ≥ 2t to avoid edge cracking.
What surface finishes work on C19400?
Not anodizable; takes bright electroplated or electroless Sn, Ag, Ni and Ni/Pd/Au finishes well, and forms an adherent oxide for good epoxy mold-compound adhesion in lead frames.
C19400 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Fedispersed Fe-rich precipitates provide strengthening | 2.1 – 2.6 | 2.35 |
| P | 0.02 – 0.15 | 0.03 |
| Znimproves solder-joint/thermal stability | 0.05 – 0.2 | 0.12 |
| Pb | ≤ 0.03 | — |
| CuCu + named elements ≥ 99.8 %; Cu ≈ 97.0–97.8 % (Ag counted as Cu) | balance | — |
C19400-H01 — frequently asked
What is C19400-H01 used for?
C19400-H01 is typically used for lead frames, electronic connectors, relay and switch parts and terminals. In short: standard lead-frame copper; 65 % IACS, 260 W/m·K; excellent stamping formability.
What is the yield strength of C19400-H01?
C19400-H01 has a typical yield strength of 290 MPa (42.1 ksi) and a tensile strength of 380 MPa (55.1 ksi) — stronger than 60% of copper alloy grades. Strength varies by condition: see the 10 listed tempers.
Is C19400-H01 easy to machine?
Not especially — machinability is rated poor (30/100, worse than 67% of copper alloy grades). Gummy and low machinability (~20 % of free-cutting brass): use sharp positive-rake tools, high speed, generous coolant; stamping/blanking is far more economical than chip cutting.
Can C19400-H01 be welded?
With care — weldability is rated fair (45/100). Resistance and laser spot welding are routine; fusion welding is fair — the heat-affected zone recrystallises and loses cold-worked strength, so soldering/brazing is usually preferred.
What surface finishes work on C19400-H01?
Not anodizable; takes bright electroplated or electroless Sn, Ag, Ni and Ni/Pd/Au finishes well, and forms an adherent oxide for good epoxy mold-compound adhesion in lead frames.
Can C19400-H01 be formed, bent or molded?
Excellent progressive-die stamping and bending in O/H01/H02; for H06 and harder keep bends with-grain and use radii ≥ 2t to avoid edge cracking.
What is the maximum service temperature of C19400-H01?
C19400-H01 is rated for continuous use to about 190°C (374 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C19400-H02 and C19400-O60?
H02 is the default condition — default stocking temper for lead frames and stamped terminals: balanced strength, bendability and conductivity. O60: maximum ductility for deep drawing and severe forming; lowest strength. Yield strength is 370 MPa in H02 versus 145 MPa in O60.
Sources
- ASTM B465 — Copper-Iron Alloy Plate, Sheet, Strip and Rolled Bar — ASTM International (2020)
- EN 1652 / CW107C (CuFe2P) wrought copper alloys — CEN (1998)
- CDA Alloy C19400 property sheet — Copper Development Association (2023)
- ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
- Lead-frame copper strip (CuFe2P) mill datasheet — strip mill (Olin/Wieland-class) (2022)
- GB/T 2059 / GB/T 2040 — SAC (2017)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.