Copper Alloy C19400-H04
Supply condition
UNS C19400 · ASTM B465 · EN CW107C, CuFe2P · JIS C1940
H04 = full hard
Higher strength for terminals and shields with mild bends only (bend radius ≥ 1t across grain).
Values for the H04 condition
Other C19400 tempers and conditions
C19400 is listed in 10 conditions; see the grade overview at C19400.
Compare all 10 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Soft annealed | Maximum ductility for deep drawing and severe forming; lowest strength. | 145 | 315 | 32 | 40 HRB | 65 % IACS |
Light annealed | Partially recrystallised, fine grain: good formability with a useful strength floor and flat strip. | 190 | 340 | 25 | 82 HB | 65 % IACS |
Quarter hard | Intermediate temper when forming severity is still high but annealed strength is insufficient. | 290 | 380 | 16 | 100 HB | 65 % IACS |
Annealed to temper, half hard | Half-hard strength level reached by controlled anneal rather than final rolling — better flatness and more uniform bend behaviour than rolled H02. | 330 | 415 | 14 | 112 HB | 65 % IACS |
H02Default Half hard | Default stocking temper for lead frames and stamped terminals: balanced strength, bendability and conductivity. | 370 | 420 | 10 | 63 HRB | 65 % IACS |
H04This page Full hard | Higher strength for terminals and shields with mild bends only (bend radius ≥ 1t across grain). | 420 | 455 | 6 | 68 HRB | 64 % IACS |
Extra hard | For flat parts and gentle forms needing higher contact force and stress-relaxation resistance. | 460 | 490 | 4 | 136 HB | 64 % IACS |
Spring hard | Spring temper for contact springs where high yield and low relaxation matter more than bend severity. | 495 | 520 | 3 | 144 HB | 63 % IACS |
Extra spring hard | Near-maximum cold work for flat springs and stiff terminals; bends must be with-grain and generous. | 530 | 550 | 2.5 | 152 HB | 63 % IACS |
Strain hardened, half hard | Highest commercially rolled strength for C19400 — flat, blanked or lightly formed spring parts only. | 565 | 585 | 2 | 163 HB | 62 % IACS |
What is C19400-H04?
C19400-H04 is C19400 supplied in the H04 condition — higher strength for terminals and shields with mild bends only (bend radius ≥ 1t across grain). C19400-H04 has a yield strength of 420 MPa (60.9 ksi) and a tensile strength of 455 MPa (66 ksi) — stronger than 83% of copper alloy grades. Elongation at break is 6% and the elastic modulus is 121 GPa (17.5 Msi). C19400-H04 has a density of 8.91 g/cm³ (0.322 lb/in³), heavier than 80% of copper alloy grades. It melts at 1,080°C (1,976 °F). H02 is the default condition FabDigit quotes; H04 is available on request or by drawing note.
Advantages
- High strength — 420 MPa (60.9 ksi), better than 83% of copper alloy grades
- Conducts heat well — 258 W/m·K (149.1 BTU/hr·ft·°F), better than 82% of copper alloy grades
- High electrical conductivity — 64 % IACS, better than 82% of copper alloy grades
Limitations
- Limited ductility — 6%, worse than 89% of copper alloy grades
C19400-H04 properties
Typical room-temperature values for C19400-H04; 12 are specific to this condition. Other listed values are C19400 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C19400-H04 has a density of 8.91 g/cm³ (0.322 lb/in³), heavier than 80% of copper alloy grades. It melts at 1,080°C (1,976 °F).
Mechanical12
C19400-H04 has a yield strength of 420 MPa (60.9 ksi) and a tensile strength of 455 MPa (66 ksi) — stronger than 83% of copper alloy grades. Elongation at break is 6% and the elastic modulus is 121 GPa (17.5 Msi).
Thermal6
C19400-H04 is rated for continuous service to 180°C (356 °F). It conducts heat at 258 W/m·K (149.1 BTU/hr·ft·°F), better than 82% of copper alloy grades. Thermal expansion is 16.5 µm/m·K (9.17 µin/in·°F).
Electrical3
C19400-H04 conducts electricity at 64 % IACS, better than 82% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (58/100), worse than 76% of copper alloy grades.
Sustainability4
Producing a kilogram of C19400-H04 takes about 57 MJ of energy and emits 3.8 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 35%.
Manufacturability8
C19400-H04's machinability is fair (35/100, better than 51% of copper alloy grades); weldability fair (45/100); formability fair (48/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C19400-H04
Is C19400 easy to machine?
Gummy and low machinability (~20 % of free-cutting brass): use sharp positive-rake tools, high speed, generous coolant; stamping/blanking is far more economical than chip cutting.
Can C19400 be welded?
Resistance and laser spot welding are routine; fusion welding is fair — the heat-affected zone recrystallises and loses cold-worked strength, so soldering/brazing is usually preferred.
Can C19400 be formed, bent or molded?
Excellent progressive-die stamping and bending in O/H01/H02; for H06 and harder keep bends with-grain and use radii ≥ 2t to avoid edge cracking.
What surface finishes work on C19400?
Not anodizable; takes bright electroplated or electroless Sn, Ag, Ni and Ni/Pd/Au finishes well, and forms an adherent oxide for good epoxy mold-compound adhesion in lead frames.
C19400 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Fedispersed Fe-rich precipitates provide strengthening | 2.1 – 2.6 | 2.35 |
| P | 0.02 – 0.15 | 0.03 |
| Znimproves solder-joint/thermal stability | 0.05 – 0.2 | 0.12 |
| Pb | ≤ 0.03 | — |
| CuCu + named elements ≥ 99.8 %; Cu ≈ 97.0–97.8 % (Ag counted as Cu) | balance | — |
C19400-H04 — frequently asked
What is C19400-H04 used for?
C19400-H04 is typically used for lead frames, electronic connectors, relay and switch parts and terminals. In short: standard lead-frame copper; 65 % IACS, 260 W/m·K; excellent stamping formability.
What is the yield strength of C19400-H04?
C19400-H04 has a typical yield strength of 420 MPa (60.9 ksi) and a tensile strength of 455 MPa (66 ksi) — stronger than 83% of copper alloy grades. Strength varies by condition: see the 10 listed tempers.
Is C19400-H04 easy to machine?
Not especially — machinability is rated fair (35/100, better than 51% of copper alloy grades). Gummy and low machinability (~20 % of free-cutting brass): use sharp positive-rake tools, high speed, generous coolant; stamping/blanking is far more economical than chip cutting.
Can C19400-H04 be welded?
With care — weldability is rated fair (45/100). Resistance and laser spot welding are routine; fusion welding is fair — the heat-affected zone recrystallises and loses cold-worked strength, so soldering/brazing is usually preferred.
What surface finishes work on C19400-H04?
Not anodizable; takes bright electroplated or electroless Sn, Ag, Ni and Ni/Pd/Au finishes well, and forms an adherent oxide for good epoxy mold-compound adhesion in lead frames.
Can C19400-H04 be formed, bent or molded?
Excellent progressive-die stamping and bending in O/H01/H02; for H06 and harder keep bends with-grain and use radii ≥ 2t to avoid edge cracking.
What is the maximum service temperature of C19400-H04?
C19400-H04 is rated for continuous use to about 180°C (356 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C19400-H02 and C19400-O60?
H02 is the default condition — default stocking temper for lead frames and stamped terminals: balanced strength, bendability and conductivity. O60: maximum ductility for deep drawing and severe forming; lowest strength. Yield strength is 370 MPa in H02 versus 145 MPa in O60.
Sources
- ASTM B465 — Copper-Iron Alloy Plate, Sheet, Strip and Rolled Bar — ASTM International (2020)
- EN 1652 / CW107C (CuFe2P) wrought copper alloys — CEN (1998)
- CDA Alloy C19400 property sheet — Copper Development Association (2023)
- ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
- Lead-frame copper strip (CuFe2P) mill datasheet — strip mill (Olin/Wieland-class) (2022)
- GB/T 2059 / GB/T 2040 — SAC (2017)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.