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Copper Alloy C10800-H02

Supply condition

UNS C10800

H02 = half hard

Most common stock temper for strip, sheet and bus-bar needing strength plus mild forming.

High cost $$$$

Values for the H02 condition

Other C10800 tempers and conditions

C10800 is listed in 10 conditions; see the grade overview at C10800.

Compare all 10 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
OS050Default
Annealed to 0.050 mm grain size
Softest commercial condition; pick for deep drawing, bending, spinning and maximum conductivity.692214545 HB98 % IACS
Hot rolled and annealed
Thick plate/bar annealed after hot rolling for uniform soft properties and maximum conductivity in heavy sections.692214545 HB98 % IACS
As hot rolled
Mill hot-rolled plate/bar bought for bus-bar and machined blanks where surface finish and light work-hardening are acceptable.902354050 HB97 % IACS
1/8 hard
Slight cold work for flatness and easier handling while retaining most of the annealed ductility.1702503060 HB97 % IACS
Light drawn
Light-drawn tube temper: bendable by hand tooling yet stronger than annealed — refrigeration and plumbing tube.1952552570 HB97 % IACS
Quarter hard
Good compromise of moderate strength with useful bending ductility for formed electrical parts.2052622570 HB97 % IACS
H02This page
Half hard
Most common stock temper for strip, sheet and bus-bar needing strength plus mild forming.2502901485 HB96 % IACS
Hard drawn
Hard-drawn tube and rod for pressure lines and straight runs needing self-support; bend only with proper tooling.275315890 HB95 % IACS
Full hard
Choose where stiffness and strength matter more than formability — flat bus-bar, contacts, machined parts.310345695 HB95 % IACS
Spring hard
Heavily cold-worked strip/wire for springy contacts and clips where copper-level conductivity is required.3453804100 HB94 % IACS

What is C10800-H02?

C10800-H02 is C10800 supplied in the H02 condition — most common stock temper for strip, sheet and bus-bar needing strength plus mild forming. C10800-H02 has a yield strength of 250 MPa (36.3 ksi) and a tensile strength of 290 MPa (42.1 ksi) — stronger than 54% of copper alloy grades. Elongation at break is 14% and the elastic modulus is 117 GPa (17 Msi). C10800-H02 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F). OS050 is the default condition FabDigit quotes; H02 is available on request or by drawing note.

Advantages

  • Conducts heat well — 386 W/m·K (223 BTU/hr·ft·°F), better than 93% of copper alloy grades
  • Readily welded — 80/100, better than 93% of copper alloy grades
  • Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
  • High electrical conductivity — 96 % IACS, better than 91% of copper alloy grades
  • Forms and bends easily — 65/100, better than 78% of copper alloy grades

Limitations

  • Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades

C10800-H02 properties

Typical room-temperature values for C10800-H02; 12 are specific to this condition. Other listed values are C10800 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C10800-H02 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).

Density8.94 g/cm³0.32 lb/in³
Melting Point (Solidus)1,065°C1,949 °F
Liquidus Temperature1,083°C1,981 °F

Mechanical12

C10800-H02 has a yield strength of 250 MPa (36.3 ksi) and a tensile strength of 290 MPa (42.1 ksi) — stronger than 54% of copper alloy grades. Elongation at break is 14% and the elastic modulus is 117 GPa (17 Msi).

Elastic (Young's) Modulus117 GPa17 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus140 GPa20.3 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)290 MPa42.1 ksi
Yield Strength (0.2% offset)250 MPa36.3 ksi
Elongation at Break14%
Reduction in Area75%
Shear Strength186 MPa27 ksi
Fatigue Strength (Endurance Limit)97 MPa14.1 ksi
Hardness, Brinell85 HB
Hardness, Vickers48 HV

Thermal6

C10800-H02 is rated for continuous service to 150°C (302 °F). It conducts heat at 386 W/m·K (223 BTU/hr·ft·°F), better than 93% of copper alloy grades. Thermal expansion is 17.7 µm/m·K (9.83 µin/in·°F).

Thermal Conductivity386 W/m·K223 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.7 µm/m·K9.8 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)150°C302 °F
Min Service Temperature-269°C-452 °F

Electrical3

C10800-H02 conducts electricity at 96 % IACS, better than 91% of copper alloy grades.

Electrical Conductivity96 % IACS
Electrical Resistivity1.76×10⁻⁸ Ω·m0.693 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (62/100), worse than 57% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.22 V
Corrosion ResistanceGood62/100
Chemical Resistance SummaryGood in fresh/sea water, non-oxidizing acids, alkalis (except ammonia) and most organics; attacked by ammonia/amines (stress-corrosion), oxidizing acids (HNO₃), sulphides and moist ammonia-bearing atmospheres.

Sustainability4

Producing a kilogram of C10800-H02 takes about 57 MJ of energy and emits 3.6 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 15%.

Embodied Energy (primary production)57 MJ/kg24,506 BTU/lb
Embodied Carbon (primary production)3.6 kg CO₂/kg
Embodied Water250 L/kg30 gal/lb
Typical Recycled Content15%

Manufacturability7

C10800-H02's machinability is fair (38/100, better than 55% of copper alloy grades); weldability very good (80/100); formability good (65/100).

MachinabilityFair38/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityVery good80/100
Formability (cold)Good65/100
Brazeability / SolderabilityExcellent95/100
PolishabilityExcellent85/100
Anodizing Responsen/a — copper is not anodized; use tin, nickel or silver plating, or clear lacquer to stop tarnish.

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C10800-H02

Is C10800 easy to machine?

Gummy and stringy — use sharp, high-rake tools, high speed, generous coolant; work in H02/H04 temper for cleaner chips, and expect ~20% of AISI 1212 rates.

Can C10800 be welded?

GTAW/GMAW readily with preheat on thick sections; phosphorus deoxidation avoids the hydrogen embrittlement seen in tough-pitch copper, but high conductivity demands high heat input.

Can C10800 be formed, bent or molded?

Excellent cold formability in OS050/O25 (deep draw, spin, tube bend); interanneal at 400–600 °C when cumulative reduction exceeds ~60%.

What surface finishes work on C10800?

Not anodizable — bright-dip/pickle then lacquer, or electroplate tin, nickel or silver for tarnish and contact resistance control; takes a high polish easily.

C10800 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
PPhosphorus deoxidized, low-residual range0.010.01
CuCu + Ag, min 99.95% including the P content per CDA/ASTM registration; oxygen-free≥ 99.95 (balance)—

C10800-H02 — frequently asked

What is C10800-H02 used for?

C10800-H02 is typically used for refrigeration and air-conditioning tubing, welded conductor assemblies, brazed heat-exchanger tube, busbar and electrical connector strip, welded pressure tubing and deep-drawn cups and shells. In short: weldable high-conductivity copper; low-phosphorus oxygen-free grade; excellent deep-draw formability.

What is the yield strength of C10800-H02?

C10800-H02 has a typical yield strength of 250 MPa (36.3 ksi) and a tensile strength of 290 MPa (42.1 ksi) — stronger than 54% of copper alloy grades. Strength varies by condition: see the 10 listed tempers.

Is C10800-H02 easy to machine?

Not especially — machinability is rated fair (38/100, better than 55% of copper alloy grades). Gummy and stringy — use sharp, high-rake tools, high speed, generous coolant; work in H02/H04 temper for cleaner chips, and expect ~20% of AISI 1212 rates.

Can C10800-H02 be welded?

Yes — weldability is rated very good (80/100). GTAW/GMAW readily with preheat on thick sections; phosphorus deoxidation avoids the hydrogen embrittlement seen in tough-pitch copper, but high conductivity demands high heat input.

What surface finishes work on C10800-H02?

Not anodizable — bright-dip/pickle then lacquer, or electroplate tin, nickel or silver for tarnish and contact resistance control; takes a high polish easily.

Can C10800-H02 be formed, bent or molded?

Excellent cold formability in OS050/O25 (deep draw, spin, tube bend); interanneal at 400–600 °C when cumulative reduction exceeds ~60%.

What is the maximum service temperature of C10800-H02?

C10800-H02 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C10800-OS050 and C10800-H08?

OS050 is the default condition — softest commercial condition; pick for deep drawing, bending, spinning and maximum conductivity. H08: heavily cold-worked strip/wire for springy contacts and clips where copper-level conductivity is required. Yield strength is 69 MPa in OS050 versus 345 MPa in H08.

Sources

  1. ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM International (2019)
  2. ASTM B280 — Seamless Copper Tube for ACR Field Service — ASTM International (2020)
  3. CDA Alloy Database — C10800 (oxygen-free, low phosphorus copper) — Copper Development Association (2023)
  4. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  5. GB/T 5231 — (TU1/TUP equivalents) — SAC (2022)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.