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Copper Alloy T2-H08

Supply condition

GB T2 · UNS C11000 · ASTM B152 · EN CW004A, Cu-ETP · JIS C1100

H08 = spring hard

Use spring temper thin strip for contact springs and shielding fingers that need a high elastic limit (365 MPa yield) while still holding 96% IACS; forming is very restricted.

High cost $$$$

Values for the H08 condition

Other T2 tempers and conditions

T2 is listed in 11 conditions; see the grade overview at T2.

Compare all 11 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
MDefault
Thermomechanically controlled processed
Choose the soft annealed (O60) state for bending, deep drawing and forming, or wherever the full 101% IACS conductivity is needed; yield is lowest at 69 MPa.692204540 HB101 % IACS
as-hot-rolled plate
Pick as-hot-rolled plate over 10 mm for welded structures and machined blanks: lowest cost per kg with near-soft properties, 215 MPa tensile and 100% IACS.702154045 HB100 % IACS
Annealed to 0.050 mm grain size
Use strip annealed to a controlled 0.050 / 0.025 mm grain size for deep-drawn and cupped parts where uniform elongation and an orange-peel-free surface matter more than strength.762304242 HB101 % IACS
Hard drawn
Choose the as-extruded state for busbar and heavy-wall tube when near-annealed ductility and 100% IACS are wanted without a separate anneal; yield is only 80 MPa.802254245 HB100 % IACS
1/8 hard
Pick 1/8 hard sheet and strip when parts must be stiffer than annealed stock yet keep most of their formability; light cold work gives 140 MPa yield at 99% IACS.1402553060 HB99 % IACS
quarter hard
Choose quarter hard as the compromise for bent parts and stamped conductive tabs: 195 MPa yield with small-radius bends still possible at 98.5% IACS.1952702570 HB98.5 % IACS
half hard
Use half hard, the most commonly stocked sheet, strip and bar condition, when machined surface quality and low distortion matter; 240 MPa yield limits tight bends at 14% elongation.2402901480 HB98 % IACS
hard (cold drawn / cold rolled)
Pick the hard cold-drawn or cold-rolled state for rod, wire and rigid busbar needing the best strength (300 MPa yield) and dimensional accuracy; bending capability is limited.3003401295 HB97 % IACS
extra hard
Choose extra hard strip for switch contacts and commutator segments requiring higher strength and stiffness (340 MPa yield); elongation drops to 6% and service limit to 130 °C.3403806105 HB96.5 % IACS
H08This page
Spring hard
Use spring temper thin strip for contact springs and shielding fingers that need a high elastic limit (365 MPa yield) while still holding 96% IACS; forming is very restricted.3654004110 HB96 % IACS
Extra spring hard
Pick the extra spring temper only for very thin strip and foil where elasticity and 425 MPa tensile govern; at 2% elongation the material is effectively unformable.3904252115 HB95.5 % IACS

What is T2-H08?

T2-H08 is T2 supplied in the H08 condition — use spring temper thin strip for contact springs and shielding fingers that need a high elastic limit (365 MPa yield) while still holding 96% IACS; forming is very restricted. T2-H08 has a yield strength of 365 MPa (52.9 ksi) and a tensile strength of 400 MPa (58 ksi) — stronger than 74% of copper alloy grades. Elongation at break is 4% and the elastic modulus is 118 GPa (17.1 Msi). T2-H08 has a density of 8.93 g/cm³ (0.323 lb/in³), heavier than 82% of copper alloy grades. It melts at 1,065°C (1,949 °F). M is the default condition FabDigit quotes; H08 is available on request or by drawing note.

Advantages

  • Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
  • Conducts heat well — 380 W/m·K (219.6 BTU/hr·ft·°F), better than 91% of copper alloy grades
  • High electrical conductivity — 96 % IACS, better than 91% of copper alloy grades

Limitations

  • Limited service temperature — 120°C (248 °F), worse than 100% of copper alloy grades
  • Limited ductility — 4%, worse than 96% of copper alloy grades
  • Limited formability — 15/100, worse than 79% of copper alloy grades

T2-H08 properties

Typical room-temperature values for T2-H08; 20 are specific to this condition. Other listed values are T2 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

T2-H08 has a density of 8.93 g/cm³ (0.323 lb/in³), heavier than 82% of copper alloy grades. It melts at 1,065°C (1,949 °F).

Density8.93 g/cm³0.32 lb/in³
Melting Point (Solidus)1,065°C1,949 °F
Liquidus Temperature1,083°C1,981 °F

Mechanical13

T2-H08 has a yield strength of 365 MPa (52.9 ksi) and a tensile strength of 400 MPa (58 ksi) — stronger than 74% of copper alloy grades. Elongation at break is 4% and the elastic modulus is 118 GPa (17.1 Msi).

Elastic (Young's) Modulus118 GPa17.1 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus140 GPa20.3 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)400 MPa58 ksi
Yield Strength (0.2% offset)365 MPa52.9 ksi
Elongation at Break4%
Reduction in Area40%
Shear Strength240 MPa34.8 ksi
Fatigue Strength (Endurance Limit)120 MPa17.4 ksi
Charpy V-Notch Impact (RT)25 J18.4 ft·lbf
Hardness, Brinell110 HB
Hardness, Vickers118 HV

Thermal6

T2-H08 is rated for continuous service to 120°C (248 °F). It conducts heat at 380 W/m·K (219.6 BTU/hr·ft·°F), better than 91% of copper alloy grades. Thermal expansion is 17 µm/m·K (9.44 µin/in·°F).

Thermal Conductivity380 W/m·K220 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17 µm/m·K9.4 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)120°C248 °F
Min Service Temperature-200°C-328 °F

Electrical3

T2-H08 conducts electricity at 96 % IACS, better than 91% of copper alloy grades.

Electrical Conductivity96 % IACS
Electrical Resistivity1.8×10⁻⁸ Ω·m0.707 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (58/100), worse than 76% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.22 V
Corrosion ResistanceGood58/100
Chemical Resistance SummaryGood in air, fresh/sea water (low velocity), non-oxidizing acids and most organics; attacked by ammonia and amines (SCC of cold-worked stock), oxidizing acids (HNO₃), sulfides, and high-velocity aerated water.

Sustainability4

Producing a kilogram of T2-H08 takes about 57 MJ of energy and emits 3.8 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 40%.

Embodied Energy (primary production)57 MJ/kg24,506 BTU/lb
Embodied Carbon (primary production)3.8 kg CO₂/kg
Embodied Water350 L/kg41.9 gal/lb
Typical Recycled Content40%

Manufacturability8

T2-H08's machinability is fair (35/100, better than 51% of copper alloy grades); weldability fair (35/100); formability poor (15/100).

MachinabilityFair35/100
Machinability Rating (AISI 1212 = 100 %)25%
WeldabilityFair35/100
Formability (cold)Poor15/100
CastabilityFair35/100
Brazeability / SolderabilityExcellent95/100
PolishabilityExcellent85/100
Anodizing Responsen/a — copper is not anodized; use tin, nickel or silver plating, chromate/benzotriazole passivation or clear lacquer

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with T2-H08

Is T2 easy to machine?

In the soft temper it is gummy and throws burrs; use sharp, high-positive-rake edges, high speed and plenty of emulsion coolant, or order half-hard/hard temper for better surface quality. It contains no lead, so chips are long and tough and the machinability rating is only about 20.

Can T2 be welded?

Brazing and soft soldering are excellent. In TIG/MIG welding the residual oxygen reacts with hydrogen to form steam porosity and embrittles the heat-affected zone, so use high heat input, preheat and deoxidized filler; for gas-tight or hydrogen-atmosphere structures switch to oxygen-free TU1.

Can T2 be formed, bent or molded?

Cold formability in the annealed temper is excellent, covering deep drawing, spinning and bending down to about 0.5 t. It work-hardens quickly, so allow an intermediate anneal at 450-600 °C between forming stages.

What surface finishes work on T2?

Not anodizable. Tin, nickel or silver plating, chemical passivation (benzotriazole) or clear lacquer all work; polishing gives a mirror finish, but a dark oxide film forms naturally if left uncoated.

T2 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Oas Cu2O in tough-pitch copper; typical 0.02–0.05 %≤ 0.060.03
Bi≤ 0—
Sb≤ 0—
As≤ 0—
Fe≤ 0.01—
Pb≤ 0.01—
S≤ 0.01—
Ni≤ 0.01—
Zn≤ 0.01—
Sn≤ 0—
total impuritiesGB/T 5231 T2, oxygen excluded≤ 0.1—
CuCu+Ag ≥ 99.90 % (tough pitch, oxygen not counted as impurity)≥ 99.9 (balance)—

T2-H08 — frequently asked

What is T2-H08 used for?

T2-H08 is typically used for busbars, electrical terminals, copper tube, gaskets and general fabrication. In short: standard 101 % IACS copper; cheapest conductive copper; best-formability soft temper.

What is the yield strength of T2-H08?

T2-H08 has a typical yield strength of 365 MPa (52.9 ksi) and a tensile strength of 400 MPa (58 ksi) — stronger than 74% of copper alloy grades. Strength varies by condition: see the 11 listed tempers.

Is T2-H08 easy to machine?

Not especially — machinability is rated fair (35/100, better than 51% of copper alloy grades). In the soft temper it is gummy and throws burrs; use sharp, high-positive-rake edges, high speed and plenty of emulsion coolant, or order half-hard/hard temper for better surface quality. It contains no lead, so chips are long and tough and the machinability rating is only about 20.

Can T2-H08 be welded?

With care — weldability is rated fair (35/100). Brazing and soft soldering are excellent. In TIG/MIG welding the residual oxygen reacts with hydrogen to form steam porosity and embrittles the heat-affected zone, so use high heat input, preheat and deoxidized filler; for gas-tight or hydrogen-atmosphere structures switch to oxygen-free TU1.

What surface finishes work on T2-H08?

Not anodizable. Tin, nickel or silver plating, chemical passivation (benzotriazole) or clear lacquer all work; polishing gives a mirror finish, but a dark oxide film forms naturally if left uncoated.

Can T2-H08 be formed, bent or molded?

Cold formability in the annealed temper is excellent, covering deep drawing, spinning and bending down to about 0.5 t. It work-hardens quickly, so allow an intermediate anneal at 450-600 °C between forming stages.

What is the maximum service temperature of T2-H08?

T2-H08 is rated for continuous use to about 120°C (248 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between T2-M and T2-H10?

M is the default condition — choose the soft annealed (O60) state for bending, deep drawing and forming, or wherever the full 101% IACS conductivity is needed; yield is lowest at 69 MPa. H10: pick the extra spring temper only for very thin strip and foil where elasticity and 425 MPa tensile govern; at 2% elongation the material is effectively unformable. Yield strength is 69 MPa in M versus 390 MPa in H10.

Sources

  1. ASTM B152/B152M Copper Sheet, Strip, Plate and Rolled Bar — ASTM (2019)
  2. ASTM B187 Copper Bus Bar, Rod and Shapes — ASTM (2020)
  3. EN 13601 Copper rod, bar and wire (Cu-ETP, CW004A) — CEN (2021)
  4. C11000 Electrolytic Tough Pitch Copper alloy datasheet — Copper Development Association (copper.org) (2023)
  5. ASM Handbook Vol. 2 — Properties of Nonferrous Alloys — ASM International (1990)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.