Copper Alloy Cu-ETP1-M
Heat-treated state · default condition
EN CR003A
M = thermomechanically controlled processed
Standard 8 mm bright rod / wire rod as supplied by the rod mill — the feedstock for all drawing operations.
Values for the M condition
Other Cu-ETP1 tempers and conditions
Cu-ETP1 is listed in 7 conditions; see the grade overview at Cu-ETP1.
Compare all 7 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
As cast | Unwrought cast product to EN 1976 used as remelt / rolling stock rather than as a finished engineering shape. | 55 | 175 | 30 | 40 HB | 101 % IACS |
annealed / soft, Rm ≥ 200 MPa | Fully soft condition for maximum conductivity, bending and winding of magnet wire or flexible busbar. | 60 | 215 | 42 | 43 HB | 101.5 % IACS |
MDefaultThis page Thermomechanically controlled processed | Standard 8 mm bright rod / wire rod as supplied by the rod mill — the feedstock for all drawing operations. | 70 | 220 | 40 | 45 HB | 101.5 % IACS |
Hardness temper, 40–65 HV | Ordered when a hardness window rather than a strength window is specified — essentially soft-drawn rod/bar. | 80 | 225 | 35 | 50 HB | 101 % IACS |
half-hard drawn, Rm ≥ 240 MPa | Half-hard drawn rod/bar giving a workable compromise between strength and remaining bendability for busbar and terminals. | 180 | 255 | 15 | 75 HB | 100 % IACS |
hard drawn, Rm ≥ 290 MPa | Hard-drawn rod/bar for overhead conductors, commutator bars and mechanically loaded electrical parts. | 260 | 315 | 6 | 95 HB | 98.5 % IACS |
Extra hard drawn wire, Rm ≥ 360 MPa | Heavily drawn fine wire for hard-drawn conductors and springy contacts where tensile strength matters more than elongation. | 340 | 385 | 2 | 110 HB | 97.5 % IACS |
What is Cu-ETP1-M?
Cu-ETP1-M is Cu-ETP1 heat treated to M — standard 8 mm bright rod / wire rod as supplied by the rod mill — the feedstock for all drawing operations. Cu-ETP1-M has a yield strength of 70 MPa (10.2 ksi) and a tensile strength of 220 MPa (31.9 ksi) — weaker than 93% of copper alloy grades. Elongation at break is 40% and the elastic modulus is 117 GPa (17 Msi). Cu-ETP1-M has a density of 8.93 g/cm³ (0.323 lb/in³), heavier than 82% of copper alloy grades. It melts at 1,065°C (1,949 °F).
Advantages
- Conducts heat well — 394 W/m·K (227.6 BTU/hr·ft·°F), better than 100% of copper alloy grades
- High electrical conductivity — 101.5 % IACS, better than 100% of copper alloy grades
- Forms and bends easily — 95/100, better than 94% of copper alloy grades
- Ductile — tolerates forming and impact — 40%, better than 84% of copper alloy grades
Limitations
- Low strength — 70 MPa (10.2 ksi), worse than 93% of copper alloy grades
Cu-ETP1-M properties
Typical room-temperature values for Cu-ETP1-M; 12 are specific to this condition. Other listed values are Cu-ETP1 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
Cu-ETP1-M has a density of 8.93 g/cm³ (0.323 lb/in³), heavier than 82% of copper alloy grades. It melts at 1,065°C (1,949 °F).
Mechanical13
Cu-ETP1-M has a yield strength of 70 MPa (10.2 ksi) and a tensile strength of 220 MPa (31.9 ksi) — weaker than 93% of copper alloy grades. Elongation at break is 40% and the elastic modulus is 117 GPa (17 Msi).
Thermal6
Cu-ETP1-M is rated for continuous service to 200°C (392 °F). It conducts heat at 394 W/m·K (227.6 BTU/hr·ft·°F), better than 100% of copper alloy grades. Thermal expansion is 17 µm/m·K (9.44 µin/in·°F).
Electrical3
Cu-ETP1-M conducts electricity at 101.5 % IACS, better than 100% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (65/100), better than 58% of copper alloy grades.
Sustainability4
Producing a kilogram of Cu-ETP1-M takes about 53 MJ of energy and emits 3.6 kg of CO₂ — less than 85% of copper alloy grades. Typical recycled content is 10%.
Manufacturability8
Cu-ETP1-M's machinability is poor (30/100, worse than 67% of copper alloy grades); weldability fair (50/100); formability excellent (95/100).
Common Calculations5
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with Cu-ETP1-M
Is Cu-ETP1 easy to machine?
Gummy and long-chipping — use sharp positive-rake tools, high speed, low feed and generous coolant; expect ~20 % of AISI 1212 productivity, consider C14500/C36000 if machining dominates.
Can Cu-ETP1 be welded?
Weldable by GTAW/GMAW with phosphorus-deoxidised filler and high preheat, but oxygen-bearing tough-pitch copper is prone to porosity and hydrogen embrittlement — avoid reducing atmospheres above ~400 °C; prefer Cu-DHP/Cu-OF for welded assemblies.
Can Cu-ETP1 be formed, bent or molded?
Outstanding cold drawing, upsetting and bending in the soft/M condition; interstage anneals at 400–600 °C restore ductility, and hard tempers should be bent generously to avoid edge cracking.
What surface finishes work on Cu-ETP1?
Not anodisable; solders and electroplates (Sn, Ni, Ag) readily, takes a high polish but tarnishes — protect with benzotriazole, lacquer or plating.
Cu-ETP1 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Otough-pitch oxygen content | 0.01 – 0.04 | 0.03 |
| Agcounted as Cu | ≤ 0 | — |
| Bitighter than Cu-ETP | ≤ 5×10⁻⁴ | — |
| Pb | ≤ 5×10⁻⁴ | — |
| Se | ≤ 2×10⁻⁴ | — |
| Te | ≤ 2×10⁻⁴ | — |
| S | ≤ 0 | — |
| As | ≤ 5×10⁻⁴ | — |
| Sb | ≤ 4×10⁻⁴ | — |
| Fe | ≤ 0 | — |
| Ni | ≤ 0 | — |
| Sn | ≤ 5×10⁻⁴ | — |
| Zn | ≤ 0 | — |
| P | ≤ 5×10⁻⁴ | — |
| total impurities (excl. O, Ag)Cu-CATH-1 quality feed per EN 1978 | ≤ 0.01 | — |
| CuCu including Ag, minimum; balance | ≥ 99.95 (balance) | — |
Cu-ETP1-M — frequently asked
What is Cu-ETP1-M used for?
Cu-ETP1-M is typically used for electrical rod stock, busbars and high-conductivity connectors. In short: highest-conductivity ETP rod; 101.5 % IACS; poor choice for welding.
What is the yield strength of Cu-ETP1-M?
Cu-ETP1-M has a typical yield strength of 70 MPa (10.2 ksi) and a tensile strength of 220 MPa (31.9 ksi) — weaker than 93% of copper alloy grades. Strength varies by condition: see the 7 listed tempers.
Is Cu-ETP1-M easy to machine?
Not especially — machinability is rated poor (30/100, worse than 67% of copper alloy grades). Gummy and long-chipping — use sharp positive-rake tools, high speed, low feed and generous coolant; expect ~20 % of AISI 1212 productivity, consider C14500/C36000 if machining dominates.
Can Cu-ETP1-M be welded?
With care — weldability is rated fair (50/100). Weldable by GTAW/GMAW with phosphorus-deoxidised filler and high preheat, but oxygen-bearing tough-pitch copper is prone to porosity and hydrogen embrittlement — avoid reducing atmospheres above ~400 °C; prefer Cu-DHP/Cu-OF for welded assemblies.
What surface finishes work on Cu-ETP1-M?
Not anodisable; solders and electroplates (Sn, Ni, Ag) readily, takes a high polish but tarnishes — protect with benzotriazole, lacquer or plating.
Can Cu-ETP1-M be formed, bent or molded?
Outstanding cold drawing, upsetting and bending in the soft/M condition; interstage anneals at 400–600 °C restore ductility, and hard tempers should be bent generously to avoid edge cracking.
What is the maximum service temperature of Cu-ETP1-M?
Cu-ETP1-M is rated for continuous use to about 200°C (392 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between Cu-ETP1-M and Cu-ETP1-R360?
M is the default condition — standard 8 mm bright rod / wire rod as supplied by the rod mill — the feedstock for all drawing operations. R360: heavily drawn fine wire for hard-drawn conductors and springy contacts where tensile strength matters more than elongation. Yield strength is 70 MPa in M versus 340 MPa in R360.
Sources
- EN 1976 — Copper and copper alloys: cast unwrought copper products (Cu-ETP1, CR003A) — CEN (2012)
- EN 13601 — Copper rod, bar and wire for general electrical purposes — CEN (2021)
- EN 13602 — Drawn round copper wire for electrical conductors — CEN (2013)
- EN 1978 — Copper cathodes (Cu-CATH-1) — CEN (1998)
- ASM Handbook Vol. 2 — Properties of Copper and Copper Alloys — ASM International (1990)
- CDA alloy datasheet C11000 (ETP copper) — Copper Development Association (2023)
- IEC 60028 — International standard of resistance for copper — IEC (1925)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.