Copper Alloy C26200-H04
Supply condition
UNS C26200
H04 = full hard
High-strength strip for flat springs, contacts and parts formed only along gentle radii.
Values for the H04 condition
Other C26200 tempers and conditions
C26200 is listed in 9 conditions; see the grade overview at C26200.
Compare all 9 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Annealed to 0.050 mm grain size | Softest stock condition for deep drawing and severe forming of large parts. | 105 | 325 | 62 | 60 HB | 28 % IACS |
Annealed to 0.025 mm grain size | Fine-grain anneal: good ductility with smoother drawn surface (less orange peel) than OS050. | 130 | 365 | 55 | 75 HB | — |
1/8 hard | Light temper rolling: flattens and stiffens strip while keeping near-annealed ductility. | 215 | 385 | 48 | 85 HB | — |
Quarter hard | Balanced temper for moderate bending and forming with useful spring-back control. | 310 | 425 | 43 | 100 HB | — |
H02Default Half hard | Most widely stocked sheet/strip temper: good strength with enough ductility for 90° bends. | 379 | 490 | 23 | 125 HB | — |
H04This page Full hard | High-strength strip for flat springs, contacts and parts formed only along gentle radii. | 435 | 580 | 8 | 155 HB | — |
Extra hard | For flat, blanked or slightly formed parts needing higher stiffness and wear life. | 450 | 650 | 5 | 175 HB | — |
Spring hard | Spring strip temper for clips, contacts and washers with high elastic limit. | 470 | 690 | 4 | 185 HB | — |
Extra spring hard | Maximum cold-worked strength for thin flat springs; bends only across the rolling direction. | 485 | 725 | 3 | 195 HB | — |
What is C26200-H04?
C26200-H04 is C26200 supplied in the H04 condition — high-strength strip for flat springs, contacts and parts formed only along gentle radii. C26200-H04 has a yield strength of 435 MPa (63.1 ksi) and a tensile strength of 580 MPa (84.1 ksi) — stronger than 84% of copper alloy grades. Elongation at break is 8% and the elastic modulus is 110 GPa (16 Msi). C26200-H04 has a density of 8.5 g/cm³ (0.307 lb/in³), lighter than 65% of copper alloy grades. It melts at 915°C (1,679 °F). H02 is the default condition FabDigit quotes; H04 is available on request or by drawing note.
Advantages
- Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
- High strength — 435 MPa (63.1 ksi), better than 84% of copper alloy grades
Limitations
- Limited service temperature — 175°C (347 °F), worse than 92% of copper alloy grades
- Limited ductility — 8%, worse than 83% of copper alloy grades
- High embodied carbon — 4.3 kg CO₂/kg, worse than 77% of copper alloy grades
C26200-H04 properties
Typical room-temperature values for C26200-H04; 11 are specific to this condition. Other listed values are C26200 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C26200-H04 has a density of 8.5 g/cm³ (0.307 lb/in³), lighter than 65% of copper alloy grades. It melts at 915°C (1,679 °F).
Mechanical12
C26200-H04 has a yield strength of 435 MPa (63.1 ksi) and a tensile strength of 580 MPa (84.1 ksi) — stronger than 84% of copper alloy grades. Elongation at break is 8% and the elastic modulus is 110 GPa (16 Msi).
Thermal6
C26200-H04 is rated for continuous service to 175°C (347 °F). It conducts heat at 120 W/m·K (69.3 BTU/hr·ft·°F), better than 66% of copper alloy grades. Thermal expansion is 19.9 µm/m·K (11.1 µin/in·°F).
Electrical3
C26200-H04 conducts electricity at 28 % IACS, better than 69% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (57/100), worse than 80% of copper alloy grades.
Sustainability4
Producing a kilogram of C26200-H04 takes about 62 MJ of energy and emits 4.3 kg of CO₂ — more than 76% of copper alloy grades. Typical recycled content is 50%.
Manufacturability7
C26200-H04's machinability is fair (35/100, better than 51% of copper alloy grades); weldability fair (40/100); formability fair (38/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C26200-H04
Is C26200 easy to machine?
Machinability ≈30 % of free-cutting brass — gummy, long chips; use sharp positive-rake tools and generous coolant, or switch to C36000 for screw-machine work.
Can C26200 be welded?
Fusion welding is poor (zinc volatilization and porosity); prefer silver brazing, soldering or resistance welding with adequate fume extraction.
Can C26200 be formed, bent or molded?
Excellent cold formability in OS tempers — deep draws, spinning and severe bends; interstage anneal at 425–600 °C and stress-relieve cold-worked parts at 260–300 °C to avoid ammonia SCC.
What surface finishes work on C26200?
Not anodizable; bright-dip and lacquer, or nickel/chrome/tin/gold plate readily — takes a high polish for decorative hardware.
C26200 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Cuincludes silver | 67 – 70 | 68.5 |
| Pb | ≤ 0.07 | — |
| Fe | ≤ 0.05 | — |
| Zn≈31 % nominal | balance | — |
C26200-H04 — frequently asked
What is C26200-H04 used for?
C26200-H04 is typically used for hardware, fasteners, stamped components and eyelets and rivets. In short: cartridge-brass-class formability; stronger than C26800; not a screw-machine brass.
What is the yield strength of C26200-H04?
C26200-H04 has a typical yield strength of 435 MPa (63.1 ksi) and a tensile strength of 580 MPa (84.1 ksi) — stronger than 84% of copper alloy grades. Strength varies by condition: see the 9 listed tempers.
Is C26200-H04 easy to machine?
Not especially — machinability is rated fair (35/100, better than 51% of copper alloy grades). Machinability ≈30 % of free-cutting brass — gummy, long chips; use sharp positive-rake tools and generous coolant, or switch to C36000 for screw-machine work.
Can C26200-H04 be welded?
With care — weldability is rated fair (40/100). Fusion welding is poor (zinc volatilization and porosity); prefer silver brazing, soldering or resistance welding with adequate fume extraction.
What surface finishes work on C26200-H04?
Not anodizable; bright-dip and lacquer, or nickel/chrome/tin/gold plate readily — takes a high polish for decorative hardware.
Can C26200-H04 be formed, bent or molded?
Excellent cold formability in OS tempers — deep draws, spinning and severe bends; interstage anneal at 425–600 °C and stress-relieve cold-worked parts at 260–300 °C to avoid ammonia SCC.
What is the maximum service temperature of C26200-H04?
C26200-H04 is rated for continuous use to about 175°C (347 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C26200-H02 and C26200-OS050?
H02 is the default condition — most widely stocked sheet/strip temper: good strength with enough ductility for 90° bends. OS050: softest stock condition for deep drawing and severe forming of large parts. Yield strength is 379 MPa in H02 versus 105 MPa in OS050.
Sources
- ASTM B36/B36M — Brass Plate, Sheet, Strip and Rolled Bar — ASTM International (2018)
- ASTM B134/B134M — Brass Wire — ASTM International (2020)
- CDA Alloy Database — C26200 / cartridge brass family — Copper Development Association (2023)
- ASM Handbook Vol. 2 — Properties of Nonferrous Alloys — ASM International (1990)
- ASM Handbook Vol. 13B — Corrosion of Copper Alloys — ASM International (2005)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.