Copper Alloy C26200-OS050
Temper
UNS C26200
OS050 = annealed to 0.050 mm grain size
Softest stock condition for deep drawing and severe forming of large parts.
Values for the OS050 condition
Other C26200 tempers and conditions
C26200 is listed in 9 conditions; see the grade overview at C26200.
Compare all 9 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
OS050This page Annealed to 0.050 mm grain size | Softest stock condition for deep drawing and severe forming of large parts. | 105 | 325 | 62 | 60 HB | 28 % IACS |
Annealed to 0.025 mm grain size | Fine-grain anneal: good ductility with smoother drawn surface (less orange peel) than OS050. | 130 | 365 | 55 | 75 HB | — |
1/8 hard | Light temper rolling: flattens and stiffens strip while keeping near-annealed ductility. | 215 | 385 | 48 | 85 HB | — |
Quarter hard | Balanced temper for moderate bending and forming with useful spring-back control. | 310 | 425 | 43 | 100 HB | — |
H02Default Half hard | Most widely stocked sheet/strip temper: good strength with enough ductility for 90° bends. | 379 | 490 | 23 | 125 HB | — |
Full hard | High-strength strip for flat springs, contacts and parts formed only along gentle radii. | 435 | 580 | 8 | 155 HB | — |
Extra hard | For flat, blanked or slightly formed parts needing higher stiffness and wear life. | 450 | 650 | 5 | 175 HB | — |
Spring hard | Spring strip temper for clips, contacts and washers with high elastic limit. | 470 | 690 | 4 | 185 HB | — |
Extra spring hard | Maximum cold-worked strength for thin flat springs; bends only across the rolling direction. | 485 | 725 | 3 | 195 HB | — |
What is C26200-OS050?
C26200-OS050 is C26200 in the OS050 temper — softest stock condition for deep drawing and severe forming of large parts. C26200-OS050 has a yield strength of 105 MPa (15.2 ksi) and a tensile strength of 325 MPa (47.1 ksi) — weaker than 85% of copper alloy grades. Elongation at break is 62% and the elastic modulus is 110 GPa (16 Msi). C26200-OS050 has a density of 8.5 g/cm³ (0.307 lb/in³), lighter than 65% of copper alloy grades. It melts at 915°C (1,679 °F). H02 is the default condition FabDigit quotes; OS050 is available on request or by drawing note.
Advantages
- Ductile — tolerates forming and impact — 62%, better than 99% of copper alloy grades
- Forms and bends easily — 96/100, better than 97% of copper alloy grades
- Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
- High service temperature — 260°C (500 °F), better than 75% of copper alloy grades
Limitations
- Low strength — 105 MPa (15.2 ksi), worse than 85% of copper alloy grades
- High embodied carbon — 4.3 kg CO₂/kg, worse than 77% of copper alloy grades
C26200-OS050 properties
Typical room-temperature values for C26200-OS050; 12 are specific to this condition. Other listed values are C26200 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C26200-OS050 has a density of 8.5 g/cm³ (0.307 lb/in³), lighter than 65% of copper alloy grades. It melts at 915°C (1,679 °F).
Mechanical12
C26200-OS050 has a yield strength of 105 MPa (15.2 ksi) and a tensile strength of 325 MPa (47.1 ksi) — weaker than 85% of copper alloy grades. Elongation at break is 62% and the elastic modulus is 110 GPa (16 Msi).
Thermal6
C26200-OS050 is rated for continuous service to 260°C (500 °F). It conducts heat at 120 W/m·K (69.3 BTU/hr·ft·°F), better than 66% of copper alloy grades. Thermal expansion is 19.9 µm/m·K (11.1 µin/in·°F).
Electrical3
C26200-OS050 conducts electricity at 28 % IACS, better than 69% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (57/100), worse than 80% of copper alloy grades.
Sustainability4
Producing a kilogram of C26200-OS050 takes about 62 MJ of energy and emits 4.3 kg of CO₂ — more than 76% of copper alloy grades. Typical recycled content is 50%.
Manufacturability7
C26200-OS050's machinability is poor (26/100, worse than 81% of copper alloy grades); weldability fair (40/100); formability excellent (96/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C26200-OS050
Is C26200 easy to machine?
Machinability ≈30 % of free-cutting brass — gummy, long chips; use sharp positive-rake tools and generous coolant, or switch to C36000 for screw-machine work.
Can C26200 be welded?
Fusion welding is poor (zinc volatilization and porosity); prefer silver brazing, soldering or resistance welding with adequate fume extraction.
Can C26200 be formed, bent or molded?
Excellent cold formability in OS tempers — deep draws, spinning and severe bends; interstage anneal at 425–600 °C and stress-relieve cold-worked parts at 260–300 °C to avoid ammonia SCC.
What surface finishes work on C26200?
Not anodizable; bright-dip and lacquer, or nickel/chrome/tin/gold plate readily — takes a high polish for decorative hardware.
C26200 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Cuincludes silver | 67 – 70 | 68.5 |
| Pb | ≤ 0.07 | — |
| Fe | ≤ 0.05 | — |
| Zn≈31 % nominal | balance | — |
C26200-OS050 — frequently asked
What is C26200-OS050 used for?
C26200-OS050 is typically used for hardware, fasteners, stamped components and eyelets and rivets. In short: cartridge-brass-class formability; stronger than C26800; not a screw-machine brass.
What is the yield strength of C26200-OS050?
C26200-OS050 has a typical yield strength of 105 MPa (15.2 ksi) and a tensile strength of 325 MPa (47.1 ksi) — weaker than 85% of copper alloy grades. Strength varies by condition: see the 9 listed tempers.
Is C26200-OS050 easy to machine?
Not especially — machinability is rated poor (26/100, worse than 81% of copper alloy grades). Machinability ≈30 % of free-cutting brass — gummy, long chips; use sharp positive-rake tools and generous coolant, or switch to C36000 for screw-machine work.
Can C26200-OS050 be welded?
With care — weldability is rated fair (40/100). Fusion welding is poor (zinc volatilization and porosity); prefer silver brazing, soldering or resistance welding with adequate fume extraction.
What surface finishes work on C26200-OS050?
Not anodizable; bright-dip and lacquer, or nickel/chrome/tin/gold plate readily — takes a high polish for decorative hardware.
Can C26200-OS050 be formed, bent or molded?
Excellent cold formability in OS tempers — deep draws, spinning and severe bends; interstage anneal at 425–600 °C and stress-relieve cold-worked parts at 260–300 °C to avoid ammonia SCC.
What is the maximum service temperature of C26200-OS050?
C26200-OS050 is rated for continuous use to about 260°C (500 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C26200-H02 and C26200-OS050?
H02 is the default condition — most widely stocked sheet/strip temper: good strength with enough ductility for 90° bends. OS050: softest stock condition for deep drawing and severe forming of large parts. Yield strength is 379 MPa in H02 versus 105 MPa in OS050.
Sources
- ASTM B36/B36M — Brass Plate, Sheet, Strip and Rolled Bar — ASTM International (2018)
- ASTM B134/B134M — Brass Wire — ASTM International (2020)
- CDA Alloy Database — C26200 / cartridge brass family — Copper Development Association (2023)
- ASM Handbook Vol. 2 — Properties of Nonferrous Alloys — ASM International (1990)
- ASM Handbook Vol. 13B — Corrosion of Copper Alloys — ASM International (2005)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.