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Copper Alloy C26200-OS025

Temper

UNS C26200

OS025 = annealed to 0.025 mm grain size

Fine-grain anneal: good ductility with smoother drawn surface (less orange peel) than OS050.

High cost $$$$

Values for the OS025 condition

Other C26200 tempers and conditions

C26200 is listed in 9 conditions; see the grade overview at C26200.

Compare all 9 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Annealed to 0.050 mm grain size
Softest stock condition for deep drawing and severe forming of large parts.1053256260 HB28 % IACS
OS025This page
Annealed to 0.025 mm grain size
Fine-grain anneal: good ductility with smoother drawn surface (less orange peel) than OS050.1303655575 HB—
1/8 hard
Light temper rolling: flattens and stiffens strip while keeping near-annealed ductility.2153854885 HB—
Quarter hard
Balanced temper for moderate bending and forming with useful spring-back control.31042543100 HB—
H02Default
Half hard
Most widely stocked sheet/strip temper: good strength with enough ductility for 90° bends.37949023125 HB—
Full hard
High-strength strip for flat springs, contacts and parts formed only along gentle radii.4355808155 HB—
Extra hard
For flat, blanked or slightly formed parts needing higher stiffness and wear life.4506505175 HB—
Spring hard
Spring strip temper for clips, contacts and washers with high elastic limit.4706904185 HB—
Extra spring hard
Maximum cold-worked strength for thin flat springs; bends only across the rolling direction.4857253195 HB—

What is C26200-OS025?

C26200-OS025 is C26200 in the OS025 temper — fine-grain anneal: good ductility with smoother drawn surface (less orange peel) than OS050. C26200-OS025 has a yield strength of 130 MPa (18.9 ksi) and a tensile strength of 365 MPa (52.9 ksi) — weaker than 77% of copper alloy grades. Elongation at break is 55% and the elastic modulus is 110 GPa (16 Msi). C26200-OS025 has a density of 8.5 g/cm³ (0.307 lb/in³), lighter than 65% of copper alloy grades. It melts at 915°C (1,679 °F). H02 is the default condition FabDigit quotes; OS025 is available on request or by drawing note.

Advantages

  • Ductile — tolerates forming and impact — 55%, better than 98% of copper alloy grades
  • Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
  • Forms and bends easily — 92/100, better than 91% of copper alloy grades
  • High service temperature — 260°C (500 °F), better than 75% of copper alloy grades

Limitations

  • Low strength — 130 MPa (18.9 ksi), worse than 77% of copper alloy grades
  • High embodied carbon — 4.3 kg CO₂/kg, worse than 77% of copper alloy grades

C26200-OS025 properties

Typical room-temperature values for C26200-OS025; 11 are specific to this condition. Other listed values are C26200 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C26200-OS025 has a density of 8.5 g/cm³ (0.307 lb/in³), lighter than 65% of copper alloy grades. It melts at 915°C (1,679 °F).

Density8.5 g/cm³0.31 lb/in³
Melting Point (Solidus)915°C1,679 °F
Liquidus Temperature955°C1,751 °F

Mechanical12

C26200-OS025 has a yield strength of 130 MPa (18.9 ksi) and a tensile strength of 365 MPa (52.9 ksi) — weaker than 77% of copper alloy grades. Elongation at break is 55% and the elastic modulus is 110 GPa (16 Msi).

Elastic (Young's) Modulus110 GPa16 Msi
Shear Modulus41 GPa5.9 Msi
Bulk Modulus115 GPa16.7 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)365 MPa52.9 ksi
Yield Strength (0.2% offset)130 MPa18.9 ksi
Elongation at Break55%
Shear Strength235 MPa34.1 ksi
Fatigue Strength (Endurance Limit)105 MPa15.2 ksi
Hardness, Brinell75 HB
Hardness, Rockwell B40 HRB
Hardness, Vickers80 HV

Thermal6

C26200-OS025 is rated for continuous service to 260°C (500 °F). It conducts heat at 120 W/m·K (69.3 BTU/hr·ft·°F), better than 66% of copper alloy grades. Thermal expansion is 19.9 µm/m·K (11.1 µin/in·°F).

Thermal Conductivity120 W/m·K69.3 BTU/hr·ft·°F
Specific Heat Capacity375 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)19.9 µm/m·K11.1 µin/in·°F
Latent Heat of Fusion190 J/g81.7 BTU/lb
Max Service Temperature (continuous)260°C500 °F
Min Service Temperature-200°C-328 °F

Electrical3

C26200-OS025 conducts electricity at 28 % IACS, better than 69% of copper alloy grades.

Electrical Conductivity28 % IACS
Electrical Resistivity6.2×10⁻⁸ Ω·m2.44 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (57/100), worse than 80% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.27 V
Corrosion ResistanceGood57/100
Chemical Resistance SummaryGood in fresh water, dry atmospheres and most organics; attacked by ammonia/amines (stress-corrosion cracking risk in cold-worked tempers), oxidizing acids, sulphides and chlorides; may dezincify in stagnant or acidic waters.

Sustainability4

Producing a kilogram of C26200-OS025 takes about 62 MJ of energy and emits 4.3 kg of CO₂ — more than 76% of copper alloy grades. Typical recycled content is 50%.

Embodied Energy (primary production)62 MJ/kg26,655 BTU/lb
Embodied Carbon (primary production)4.3 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content50%

Manufacturability7

C26200-OS025's machinability is poor (28/100, worse than 78% of copper alloy grades); weldability fair (40/100); formability excellent (92/100).

MachinabilityPoor28/100
Machinability Rating (AISI 1212 = 100 %)30%
WeldabilityFair40/100
Formability (cold)Excellent92/100
Brazeability / SolderabilityExcellent90/100
PolishabilityExcellent85/100
Anodizing Responsen/a — copper alloy; use bright dip, clear lacquer, nickel/chrome or tin plating instead

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C26200-OS025

Is C26200 easy to machine?

Machinability ≈30 % of free-cutting brass — gummy, long chips; use sharp positive-rake tools and generous coolant, or switch to C36000 for screw-machine work.

Can C26200 be welded?

Fusion welding is poor (zinc volatilization and porosity); prefer silver brazing, soldering or resistance welding with adequate fume extraction.

Can C26200 be formed, bent or molded?

Excellent cold formability in OS tempers — deep draws, spinning and severe bends; interstage anneal at 425–600 °C and stress-relieve cold-worked parts at 260–300 °C to avoid ammonia SCC.

What surface finishes work on C26200?

Not anodizable; bright-dip and lacquer, or nickel/chrome/tin/gold plate readily — takes a high polish for decorative hardware.

C26200 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Cuincludes silver67 – 7068.5
Pb≤ 0.07—
Fe≤ 0.05—
Zn≈31 % nominalbalance—

C26200-OS025 — frequently asked

What is C26200-OS025 used for?

C26200-OS025 is typically used for hardware, fasteners, stamped components and eyelets and rivets. In short: cartridge-brass-class formability; stronger than C26800; not a screw-machine brass.

What is the yield strength of C26200-OS025?

C26200-OS025 has a typical yield strength of 130 MPa (18.9 ksi) and a tensile strength of 365 MPa (52.9 ksi) — weaker than 77% of copper alloy grades. Strength varies by condition: see the 9 listed tempers.

Is C26200-OS025 easy to machine?

Not especially — machinability is rated poor (28/100, worse than 78% of copper alloy grades). Machinability ≈30 % of free-cutting brass — gummy, long chips; use sharp positive-rake tools and generous coolant, or switch to C36000 for screw-machine work.

Can C26200-OS025 be welded?

With care — weldability is rated fair (40/100). Fusion welding is poor (zinc volatilization and porosity); prefer silver brazing, soldering or resistance welding with adequate fume extraction.

What surface finishes work on C26200-OS025?

Not anodizable; bright-dip and lacquer, or nickel/chrome/tin/gold plate readily — takes a high polish for decorative hardware.

Can C26200-OS025 be formed, bent or molded?

Excellent cold formability in OS tempers — deep draws, spinning and severe bends; interstage anneal at 425–600 °C and stress-relieve cold-worked parts at 260–300 °C to avoid ammonia SCC.

What is the maximum service temperature of C26200-OS025?

C26200-OS025 is rated for continuous use to about 260°C (500 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C26200-H02 and C26200-OS050?

H02 is the default condition — most widely stocked sheet/strip temper: good strength with enough ductility for 90° bends. OS050: softest stock condition for deep drawing and severe forming of large parts. Yield strength is 379 MPa in H02 versus 105 MPa in OS050.

Sources

  1. ASTM B36/B36M — Brass Plate, Sheet, Strip and Rolled Bar — ASTM International (2018)
  2. ASTM B134/B134M — Brass Wire — ASTM International (2020)
  3. CDA Alloy Database — C26200 / cartridge brass family — Copper Development Association (2023)
  4. ASM Handbook Vol. 2 — Properties of Nonferrous Alloys — ASM International (1990)
  5. ASM Handbook Vol. 13B — Corrosion of Copper Alloys — ASM International (2005)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.