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Copper Alloy C19025-H02

Supply condition

UNS C19025

H02 = half hard

Cold-rolled half hard strip for forming-dominated parts that do not need the extra relaxation resistance of a stress-relief bake.

High cost $$$$

Values for the H02 condition

Other C19025 tempers and conditions

C19025 is listed in 7 conditions; see the grade overview at C19025.

Compare all 7 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Soft annealed
Pick for deep-drawn or severely formed parts where strength is added later by the customer's own work hardening.18038025105 HB48 % IACS
H02This page
Half hard
Cold-rolled half hard strip for forming-dominated parts that do not need the extra relaxation resistance of a stress-relief bake.43050010148 HB43 % IACS
Half hard and stress relieved
Choose when tight bends (small bend radii, complex terminal geometry) matter more than peak spring force.480520983 HRB46 % IACS
Full hard
Straight cold-rolled hard strip; cheaper than the HR grades but with lower stress-relaxation resistance.5105656166 HB42 % IACS
HR04Default
Full hard and stress relieved
The workhorse connector-strip temper: balanced spring force, bendability and stress-relaxation resistance.550585688 HRB45 % IACS
Extra hard and stress relieved
Highest-strength stocked temper for miniature high-force contacts; bend radii must be generous and grain direction respected.610635492 HRB44 % IACS
Spring hard and stress relieved
Special-order spring temper for flat contact springs where formability is minimal but contact force must be maximal.655680314 HRC43 % IACS

What is C19025-H02?

C19025-H02 is C19025 supplied in the H02 condition — cold-rolled half hard strip for forming-dominated parts that do not need the extra relaxation resistance of a stress-relief bake. C19025-H02 has a yield strength of 430 MPa (62.4 ksi) and a tensile strength of 500 MPa (72.5 ksi) — stronger than 84% of copper alloy grades. Elongation at break is 10% and the elastic modulus is 125 GPa (18.1 Msi). C19025-H02 has a density of 8.9 g/cm³ (0.322 lb/in³), heavier than 77% of copper alloy grades. It melts at 1,070°C (1,958 °F). HR04 is the default condition FabDigit quotes; H02 is available on request or by drawing note.

Advantages

  • High strength — 430 MPa (62.4 ksi), better than 84% of copper alloy grades
  • High electrical conductivity — 43 % IACS, better than 75% of copper alloy grades

Limitations

  • Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades
  • Limited ductility — 10%, worse than 76% of copper alloy grades

C19025-H02 properties

Typical room-temperature values for C19025-H02; 18 are specific to this condition. Other listed values are C19025 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C19025-H02 has a density of 8.9 g/cm³ (0.322 lb/in³), heavier than 77% of copper alloy grades. It melts at 1,070°C (1,958 °F).

Density8.9 g/cm³0.32 lb/in³
Melting Point (Solidus)1,070°C1,958 °F
Liquidus Temperature1,090°C1,994 °F

Mechanical11

C19025-H02 has a yield strength of 430 MPa (62.4 ksi) and a tensile strength of 500 MPa (72.5 ksi) — stronger than 84% of copper alloy grades. Elongation at break is 10% and the elastic modulus is 125 GPa (18.1 Msi).

Elastic (Young's) Modulus125 GPa18.1 Msi
Shear Modulus47 GPa6.8 Msi
Bulk Modulus135 GPa19.6 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)500 MPa72.5 ksi
Yield Strength (0.2% offset)430 MPa62.4 ksi
Elongation at Break10%
Shear Strength315 MPa45.7 ksi
Fatigue Strength (Endurance Limit)185 MPa26.8 ksi
Hardness, Rockwell B80 HRB
Hardness, Vickers155 HV

Thermal6

C19025-H02 is rated for continuous service to 150°C (302 °F). It conducts heat at 172 W/m·K (99.4 BTU/hr·ft·°F), better than 74% of copper alloy grades. Thermal expansion is 17.5 µm/m·K (9.72 µin/in·°F).

Thermal Conductivity172 W/m·K99.4 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.5 µm/m·K9.7 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)150°C302 °F
Min Service Temperature-196°C-321 °F

Electrical3

C19025-H02 conducts electricity at 43 % IACS, better than 75% of copper alloy grades.

Electrical Conductivity43 % IACS
Electrical Resistivity4.01×10⁻⁸ Ω·m1.58 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (62/100), worse than 57% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.25 V
Corrosion ResistanceGood62/100
Chemical Resistance SummaryGood in fresh/marine atmospheres and most neutral media; tarnishes in sulphide/ammonia environments and attacked by oxidising acids; not for ammonia-bearing service.

Sustainability4

Producing a kilogram of C19025-H02 takes about 57 MJ of energy and emits 3.9 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 30%.

Embodied Energy (primary production)57 MJ/kg24,506 BTU/lb
Embodied Carbon (primary production)3.9 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content30%

Manufacturability7

C19025-H02's machinability is poor (28/100, worse than 78% of copper alloy grades); weldability fair (45/100); formability good (60/100).

MachinabilityPoor28/100
Machinability Rating (AISI 1212 = 100 %)19%
WeldabilityFair45/100
Formability (cold)Good60/100
Brazeability / SolderabilityExcellent85/100
PolishabilityVery good75/100
Anodizing Responsen/a — copper alloy; use tin, silver, nickel or gold plating instead

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C19025-H02

Is C19025 easy to machine?

Gummy, non-leaded copper alloy — use sharp positive-rake carbide, high speed and flood coolant; mostly stamped rather than machined.

Can C19025 be welded?

Resistance and laser spot welding are practical; any fusion welding locally anneals the cold-worked temper and drops contact force.

Can C19025 be formed, bent or molded?

Progressive-die stamping of thin strip; bend with grain direction in mind (GW ≈ 0.3–0.5 t at HR02, ≥1 t at HR06) and stress-relief bake after severe forming.

What surface finishes work on C19025?

Not anodisable — standard finishes are reflow/matte tin, nickel underplate with gold or silver flash for contact surfaces.

C19025 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Niprincipal strengthener with Sn/P0.8 – 1.81
Snsolid-solution strengthening, improves stress relaxation0.5 – 1.50.9
Pforms Ni-P precipitates, deoxidiser0.01 – 0.150.05
Znimpurity limit≤ 0.2—
Feimpurity limit≤ 0.1—
Cu96.0 % min including Ag; balancebalance—

C19025-H02 — frequently asked

What is C19025-H02 used for?

C19025-H02 is typically used for automotive connectors, electronic terminals and battery contacts. In short: high-strength connector strip; stronger than C19020; 45 % IACS spring copper.

What is the yield strength of C19025-H02?

C19025-H02 has a typical yield strength of 430 MPa (62.4 ksi) and a tensile strength of 500 MPa (72.5 ksi) — stronger than 84% of copper alloy grades. Strength varies by condition: see the 7 listed tempers.

Is C19025-H02 easy to machine?

Not especially — machinability is rated poor (28/100, worse than 78% of copper alloy grades). Gummy, non-leaded copper alloy — use sharp positive-rake carbide, high speed and flood coolant; mostly stamped rather than machined.

Can C19025-H02 be welded?

With care — weldability is rated fair (45/100). Resistance and laser spot welding are practical; any fusion welding locally anneals the cold-worked temper and drops contact force.

What surface finishes work on C19025-H02?

Not anodisable — standard finishes are reflow/matte tin, nickel underplate with gold or silver flash for contact surfaces.

Can C19025-H02 be formed, bent or molded?

Progressive-die stamping of thin strip; bend with grain direction in mind (GW ≈ 0.3–0.5 t at HR02, ≥1 t at HR06) and stress-relief bake after severe forming.

What is the maximum service temperature of C19025-H02?

C19025-H02 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C19025-HR04 and C19025-O60?

HR04 is the default condition — the workhorse connector-strip temper: balanced spring force, bendability and stress-relaxation resistance. O60: pick for deep-drawn or severely formed parts where strength is added later by the customer's own work hardening. Yield strength is 550 MPa in HR04 versus 180 MPa in O60.

Sources

  1. ASTM B888/B888M — Copper Alloy Strip for Use in Manufacture of Electrical Connectors or Spring Contacts — ASTM International (2020)
  2. CDA Alloy Registration — C19025 (Cu-Ni-Sn-P) — Copper Development Association (2022)
  3. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  4. High-performance Cu-Ni-Sn-P connector strip (KLF-118 class) datasheet — Copper strip producer (2021)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.