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Copper Alloy C12600-OS050

Temper

UNS C12600

OS050 = annealed to 0.050 mm grain size

Grain-size-controlled soft sheet/strip for severe drawing without orange peel.

High cost $$$$

Values for the OS050 condition

Other C12600 tempers and conditions

C12600 is listed in 15 conditions; see the grade overview at C12600.

Compare all 15 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Soft annealed
Choose for deep drawing, spinning, tight bending, gaskets and flexible braid/laminated bus.702204545 HB98 % IACS
As hot rolled
Cheapest mill condition for thick plate, bus bar blanks and hot-extruded shapes where softness is acceptable.752254545 HB98 % IACS
OS050This page
Annealed to 0.050 mm grain size
Grain-size-controlled soft sheet/strip for severe drawing without orange peel.762304545 HB98 % IACS
Annealed to 0.025 mm grain size
Fine-grain soft strip for shallow forming with better surface finish and slightly higher strength.852404250 HB98 % IACS
1/8 hard
Slight stiffening while keeping most of the soft-temper formability (roofing, flashing, formed bus).1952503065 HB97 % IACS
Light drawn
Tube temper giving some stiffness while still allowing bending and flaring.1952502565 HB97 % IACS
Quarter hard
Good balance of bendability and stiffness for brackets, terminals and light formed parts.2052602575 HB97 % IACS
Drawn, general purpose
Standard hard-drawn tube condition for straight-length plumbing and pressure lines.2202802080 HB97 % IACS
Half hard
Most common stocked strip/plate temper when moderate strength plus some bending is needed.2502901485 HB97 % IACS
Three-quarter hard
Intermediate step where H02 is too soft but full hard would crack on the required bend.2753151090 HB97 % IACS
H04Default
Full hard
Default stock condition for bus bar, rod, hard-drawn wire and plate needing strength and stiffness with minimal forming.310345695 HB97 % IACS
Extra hard
For flat springs, clips and contacts where higher yield matters more than ductility.3403655100 HB96 % IACS
Spring hard
Maximum practical strength in strip form for spring contacts and shielding fingers.3503804105 HB96 % IACS
Extra spring hard
Heaviest cold reduction offered on strip; bend only along, not across, the rolling direction.3653954108 HB96 % IACS
Hard drawn
Heavily drawn wire/rod for overhead conductors, grounding conductors and stranded cable.3804152110 HB96 % IACS

What is C12600-OS050?

C12600-OS050 is C12600 in the OS050 temper — grain-size-controlled soft sheet/strip for severe drawing without orange peel. C12600-OS050 has a yield strength of 76 MPa (11 ksi) and a tensile strength of 230 MPa (33.4 ksi) — weaker than 91% of copper alloy grades. Elongation at break is 45% and the elastic modulus is 115 GPa (16.7 Msi). C12600-OS050 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F). H04 is the default condition FabDigit quotes; OS050 is available on request or by drawing note.

Advantages

  • Conducts heat well — 391 W/m·K (225.9 BTU/hr·ft·°F), better than 98% of copper alloy grades
  • High electrical conductivity — 98 % IACS, better than 94% of copper alloy grades
  • Forms and bends easily — 95/100, better than 94% of copper alloy grades
  • Ductile — tolerates forming and impact — 45%, better than 91% of copper alloy grades

Limitations

  • Difficult to machine — 20/100, worse than 98% of copper alloy grades
  • Low strength — 76 MPa (11 ksi), worse than 91% of copper alloy grades

C12600-OS050 properties

Typical room-temperature values for C12600-OS050; 19 are specific to this condition. Other listed values are C12600 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C12600-OS050 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).

Density8.94 g/cm³0.32 lb/in³
Melting Point (Solidus)1,065°C1,949 °F
Liquidus Temperature1,083°C1,981 °F

Mechanical12

C12600-OS050 has a yield strength of 76 MPa (11 ksi) and a tensile strength of 230 MPa (33.4 ksi) — weaker than 91% of copper alloy grades. Elongation at break is 45% and the elastic modulus is 115 GPa (16.7 Msi).

Elastic (Young's) Modulus115 GPa16.7 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus140 GPa20.3 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)230 MPa33.4 ksi
Yield Strength (0.2% offset)76 MPa11 ksi
Elongation at Break45%
Reduction in Area78%
Shear Strength150 MPa21.8 ksi
Fatigue Strength (Endurance Limit)76 MPa11 ksi
Hardness, Brinell45 HB
Hardness, Rockwell B50 HRB

Thermal6

C12600-OS050 is rated for continuous service to 200°C (392 °F). It conducts heat at 391 W/m·K (225.9 BTU/hr·ft·°F), better than 98% of copper alloy grades. Thermal expansion is 17.7 µm/m·K (9.83 µin/in·°F).

Thermal Conductivity391 W/m·K226 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.7 µm/m·K9.8 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)200°C392 °F
Min Service Temperature-200°C-328 °F

Electrical3

C12600-OS050 conducts electricity at 98 % IACS, better than 94% of copper alloy grades.

Electrical Conductivity98 % IACS
Electrical Resistivity1.76×10⁻⁸ Ω·m0.693 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (60/100), worse than 68% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.2 V
Corrosion ResistanceGood60/100
Chemical Resistance SummaryGood in air, fresh and sea water (low velocity), neutral salts and non-oxidizing acids; attacked by ammonia/amines, nitric and hot concentrated sulfuric acid, oxidizing salts and sulfides; embrittled by hot hydrogen-bearing atmospheres.

Sustainability4

Producing a kilogram of C12600-OS050 takes about 55 MJ of energy and emits 3.8 kg of CO₂ — less than 72% of copper alloy grades. Typical recycled content is 45%.

Embodied Energy (primary production)55 MJ/kg23,646 BTU/lb
Embodied Carbon (primary production)3.8 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content45%

Manufacturability7

C12600-OS050's machinability is poor (20/100, worse than 98% of copper alloy grades); weldability fair (35/100); formability excellent (95/100).

MachinabilityPoor20/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityFair35/100
Formability (cold)Excellent95/100
Brazeability / SolderabilityExcellent95/100
PolishabilityVery good75/100
Anodizing Responsen/a — copper is not anodized; use tin, nickel or silver plating, or clear lacquer to control tarnish.

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C12600-OS050

Is C12600 easy to machine?

Gummy and low rated (~20 % of AISI 1212): use sharp positive-rake tools, high speed, generous coolant and chip breakers; consider C14500/C36000 if heavy machining is required.

Can C12600 be welded?

Oxygen-bearing copper is prone to hydrogen embrittlement and porosity — prefer GTAW/GMAW with deoxidized filler (ERCu), preheat 200–500 °C on thick sections, and avoid reducing/H2 atmospheres above ~370 °C; brazing and soldering are excellent.

Can C12600 be formed, bent or molded?

Outstanding cold formability in O60/OS tempers (deep drawing, spinning, roll forming); interstage anneal at 400–600 °C when reduction exceeds ~60 %.

What surface finishes work on C12600?

Cannot be anodized; polishes to a bright finish but tarnishes — protect with clear lacquer/benzotriazole, or tin, nickel or silver plate for contacts and bus joints.

C12600 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Ocuprous oxide present as dispersed Cu2O; not usually a spec limit0.02 – 0.050.04
Sbimpurity limit, typical FRTP practice≤ 0—
Asimpurity limit≤ 0.01—
Biimpurity limit≤ 0—
Pbimpurity limit≤ 0.01—
Feimpurity limit≤ 0.03—
Niimpurity limit≤ 0.05—
Simpurity limit≤ 0—
CuCu + Ag, remainder; fire-refined tough pitch, oxygen-bearing≥ 99.9 (balance)—

C12600-OS050 — frequently asked

What is C12600-OS050 used for?

C12600-OS050 is typically used for wire products, general fabrication and roofing sheet. In short: tighter purity than C12500; 97 % IACS commercial copper; wide temper range on file.

What is the yield strength of C12600-OS050?

C12600-OS050 has a typical yield strength of 76 MPa (11 ksi) and a tensile strength of 230 MPa (33.4 ksi) — weaker than 91% of copper alloy grades. Strength varies by condition: see the 15 listed tempers.

Is C12600-OS050 easy to machine?

Not especially — machinability is rated poor (20/100, worse than 98% of copper alloy grades). Gummy and low rated (~20 % of AISI 1212): use sharp positive-rake tools, high speed, generous coolant and chip breakers; consider C14500/C36000 if heavy machining is required.

Can C12600-OS050 be welded?

With care — weldability is rated fair (35/100). Oxygen-bearing copper is prone to hydrogen embrittlement and porosity — prefer GTAW/GMAW with deoxidized filler (ERCu), preheat 200–500 °C on thick sections, and avoid reducing/H2 atmospheres above ~370 °C; brazing and soldering are excellent.

What surface finishes work on C12600-OS050?

Cannot be anodized; polishes to a bright finish but tarnishes — protect with clear lacquer/benzotriazole, or tin, nickel or silver plate for contacts and bus joints.

Can C12600-OS050 be formed, bent or molded?

Outstanding cold formability in O60/OS tempers (deep drawing, spinning, roll forming); interstage anneal at 400–600 °C when reduction exceeds ~60 %.

What is the maximum service temperature of C12600-OS050?

C12600-OS050 is rated for continuous use to about 200°C (392 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C12600-H04 and C12600-O60?

H04 is the default condition — default stock condition for bus bar, rod, hard-drawn wire and plate needing strength and stiffness with minimal forming. O60: choose for deep drawing, spinning, tight bending, gaskets and flexible braid/laminated bus. Yield strength is 310 MPa in H04 versus 70 MPa in O60.

Sources

  1. ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM International (2019)
  2. ASTM B187/B187M — Copper Bus Bar, Rod and Shapes — ASTM International (2020)
  3. ASTM B49 — Copper Rod for Electrical Purposes — ASTM International (2020)
  4. CDA Standard Designations for Wrought and Cast Copper and Copper Alloys (C1xxxx series datasheets) — Copper Development Association (2023)
  5. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys and Special-Purpose Materials — ASM International (1990)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.