Copper Alloy C11400-H02
Supply condition
UNS C11400
H02 = half hard
The general-purpose cold-rolled strip/sheet temper: usable strength with 90° bends still possible.
Values for the H02 condition
Other C11400 tempers and conditions
C11400 is listed in 13 conditions; see the grade overview at C11400.
Compare all 13 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
As hot extruded | Hot-extruded rod, bar and shapes destined for further drawing or machining. | 62 | 221 | 50 | 42 HB | 101 % IACS |
Annealed to 0.050 mm grain size | Softest commercial anneal — pick for deep drawing, spinning and severe forming. | 69 | 221 | 45 | 45 HB | 101 % IACS |
As hot rolled | Hot-rolled plate/bar for bus bars and heavy fabrications where temper is not critical. | 69 | 228 | 45 | 45 HB | 101 % IACS |
Annealed to 0.035 mm grain size | Intermediate anneal for moderate drawing with a finer, less orange-peel-prone surface. | 72 | 228 | 45 | 47 HB | 101 % IACS |
Annealed to 0.025 mm grain size | Fine-grain anneal — soft but with better surface finish and slightly higher strength than OS050. | 76 | 234 | 42 | 50 HB | 101 % IACS |
1/8 hard | Slight stiffening while keeping most of the annealed ductility for forming after shearing. | 195 | 250 | 30 | 60 HB | 100 % IACS |
Quarter hard | Good compromise of spring-back and bendability for gaskets, terminals and light stampings. | 205 | 262 | 25 | 65 HB | 99 % IACS |
H02This page Half hard | The general-purpose cold-rolled strip/sheet temper: usable strength with 90° bends still possible. | 250 | 290 | 14 | 75 HB | 98 % IACS |
H04Default Full hard | Default stock condition — maximum strength with adequate handling ductility for bus bars, commutator segments and contacts that see soldering heat. | 310 | 345 | 6 | 90 HB | 98 % IACS |
Extra hard | Between hard and spring — chosen when H04 strength is short of requirement but full spring temper is too brittle. | 330 | 365 | 5 | 93 HB | 97 % IACS |
Spring hard | High-strength strip for conductive springs, clips and contacts where silver keeps the temper after reflow soldering. | 345 | 379 | 4 | 95 HB | 97 % IACS |
Extra spring hard | Maximum cold-worked strength; use only for flat parts or very generous bend radii. | 360 | 393 | 4 | 100 HB | 97 % IACS |
Hard drawn | Hard-drawn wire and rod for overhead conductors, commutator risers and windings needing softening resistance. | 380 | 420 | 2.5 | 100 HB | 97 % IACS |
What is C11400-H02?
C11400-H02 is C11400 supplied in the H02 condition — the general-purpose cold-rolled strip/sheet temper: usable strength with 90° bends still possible. C11400-H02 has a yield strength of 250 MPa (36.3 ksi) and a tensile strength of 290 MPa (42.1 ksi) — stronger than 54% of copper alloy grades. Elongation at break is 14% and the elastic modulus is 117 GPa (17 Msi). C11400-H02 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,065°C (1,949 °F). H04 is the default condition FabDigit quotes; H02 is available on request or by drawing note.
Advantages
- Conducts heat well — 388 W/m·K (224.2 BTU/hr·ft·°F), better than 95% of copper alloy grades
- High electrical conductivity — 98 % IACS, better than 94% of copper alloy grades
Limitations
- Difficult to machine — 25/100, worse than 86% of copper alloy grades
C11400-H02 properties
Typical room-temperature values for C11400-H02; 13 are specific to this condition. Other listed values are C11400 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C11400-H02 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,065°C (1,949 °F).
Mechanical12
C11400-H02 has a yield strength of 250 MPa (36.3 ksi) and a tensile strength of 290 MPa (42.1 ksi) — stronger than 54% of copper alloy grades. Elongation at break is 14% and the elastic modulus is 117 GPa (17 Msi).
Thermal6
C11400-H02 is rated for continuous service to 185°C (365 °F). It conducts heat at 388 W/m·K (224.2 BTU/hr·ft·°F), better than 95% of copper alloy grades. Thermal expansion is 17 µm/m·K (9.44 µin/in·°F).
Electrical3
C11400-H02 conducts electricity at 98 % IACS, better than 94% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is very good (70/100), better than 76% of copper alloy grades.
Sustainability4
Producing a kilogram of C11400-H02 takes about 55 MJ of energy and emits 3.5 kg of CO₂ — less than 72% of copper alloy grades. Typical recycled content is 35%.
Manufacturability8
C11400-H02's machinability is poor (25/100, worse than 86% of copper alloy grades); weldability poor (30/100); formability good (60/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C11400-H02
Is C11400 easy to machine?
Gummy and long-chipping at ~20 % of AISI 1212 — use sharp, high-rake, polished-flute tools, high speed with flood coolant; hard tempers cut cleaner than annealed.
Can C11400 be welded?
Poor for fusion welding: dissolved oxygen causes porosity and hydrogen embrittlement — prefer brazing, soldering, resistance welding, or GTAW with deoxidised filler and minimum heat.
Can C11400 be formed, bent or molded?
Excellent cold formability in OS tempers (deep drawing, spinning, roll forming); interanneal at 400–600 °C, keep hard tempers to generous bend radii across grain.
What surface finishes work on C11400?
Solders and brazes readily; takes bright polish, Ni/Sn/Ag plating and clear lacquer; untreated surfaces oxidise and patinate — no anodising.
C11400 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Ag10 troy oz/short ton minimum silver; counted within the Cu+Ag total | ≥ 0.03 | 0.04 |
| Otypical 0.02–0.05 % as Cu2O (tough pitch); not normally a specified limit | ≈ 0.04 | 0.04 |
| CuCu + Ag ≥ 99.90 % per ASTM B5 / CDA registration | ≥ 99.9 (balance) | — |
C11400-H02 — frequently asked
What is C11400-H02 used for?
C11400-H02 is typically used for commutator segments, electrical conductors exposed to soldering heat, motor lead wire, terminals and lugs, contact strip and busbar stock. In short: economy silver-bearing ETP copper; modest softening resistance; 98 % IACS conductor.
What is the yield strength of C11400-H02?
C11400-H02 has a typical yield strength of 250 MPa (36.3 ksi) and a tensile strength of 290 MPa (42.1 ksi) — stronger than 54% of copper alloy grades. Strength varies by condition: see the 13 listed tempers.
Is C11400-H02 easy to machine?
Not especially — machinability is rated poor (25/100, worse than 86% of copper alloy grades). Gummy and long-chipping at ~20 % of AISI 1212 — use sharp, high-rake, polished-flute tools, high speed with flood coolant; hard tempers cut cleaner than annealed.
Can C11400-H02 be welded?
Not readily — weldability is rated poor (30/100). Poor for fusion welding: dissolved oxygen causes porosity and hydrogen embrittlement — prefer brazing, soldering, resistance welding, or GTAW with deoxidised filler and minimum heat.
What surface finishes work on C11400-H02?
Solders and brazes readily; takes bright polish, Ni/Sn/Ag plating and clear lacquer; untreated surfaces oxidise and patinate — no anodising.
Can C11400-H02 be formed, bent or molded?
Excellent cold formability in OS tempers (deep drawing, spinning, roll forming); interanneal at 400–600 °C, keep hard tempers to generous bend radii across grain.
What is the maximum service temperature of C11400-H02?
C11400-H02 is rated for continuous use to about 185°C (365 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C11400-H04 and C11400-M30?
H04 is the default condition — default stock condition — maximum strength with adequate handling ductility for bus bars, commutator segments and contacts that see soldering heat. M30: hot-extruded rod, bar and shapes destined for further drawing or machining. Yield strength is 310 MPa in H04 versus 62 MPa in M30.
Sources
- ASTM B5 — Electrolytic Tough Pitch Copper Refinery Shapes — ASTM International (2021)
- ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM International (2019)
- CDA Alloy Database — C11400 silver-bearing tough pitch copper — Copper Development Association (copper.org) (2023)
- ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.