Copper Alloy C1020-H08
Supply condition
JIS C1020 · UNS C10200 · EN CR008A, Cu-OF · GB TU2
H08 = spring hard
Thin strip/wire for spring contacts and shielding fingers where higher elastic limit is needed (conductivity slightly reduced).
Values for the H08 condition
Other C1020 tempers and conditions
C1020 is listed in 10 conditions; see the grade overview at C1020.
Compare all 10 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
ODefault Annealed | Choose for deep drawing, bending, gaskets, vacuum seals and maximum conductivity. | 69 | 221 | 45 | 40 HB | 101 % IACS |
Thermomechanically controlled processed | Thick plate, extruded bus bar and large sections supplied without final anneal or cold finish; properties near soft temper. | 70 | 210 | 40 | 45 HB | 101 % IACS |
Light anneal | Strip temper when soft-temper formability is needed but with slightly higher stiffness and better flatness/punchability. | 110 | 235 | 38 | 55 HB | 101 % IACS |
1/8 hard | Minimal cold work for improved flatness and handling stiffness with near-full formability. | 195 | 250 | 30 | 63 HB | 101 % IACS |
Quarter hard | Good compromise of formability and strength for stamped terminals and shielding parts. | 205 | 262 | 25 | 70 HB | 100.5 % IACS |
Half hard | Most common strip/sheet temper for busbars, lead frames and parts needing shape stability with moderate bending. | 230 | 276 | 14 | 85 HB | 100 % IACS |
Hard drawn | Standard supply condition for OF copper rod and drawn tube: straight, dimensionally accurate, moderate strength. | 250 | 290 | 12 | 92 HB | 99.5 % IACS |
Hardened | Pick for maximum strength/wear in flat conductors, waveguide flanges and machined parts where no severe bending follows. | 275 | 310 | 6 | 95 HB | 99 % IACS |
H08This page Spring hard | Thin strip/wire for spring contacts and shielding fingers where higher elastic limit is needed (conductivity slightly reduced). | 315 | 345 | 4 | 110 HB | 98 % IACS |
Extra spring hard | Highest cold-worked strength in thin strip/wire; very limited bending, softens above ~150 °C. | 345 | 380 | 3 | 118 HB | 97 % IACS |
What is C1020-H08?
C1020-H08 is C1020 supplied in the H08 condition — thin strip/wire for spring contacts and shielding fingers where higher elastic limit is needed (conductivity slightly reduced). C1020-H08 has a yield strength of 315 MPa (45.7 ksi) and a tensile strength of 345 MPa (50 ksi) — stronger than 67% of copper alloy grades. Elongation at break is 4% and the elastic modulus is 118 GPa (17.1 Msi). C1020-H08 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,083°C (1,981 °F). O is the default condition FabDigit quotes; H08 is available on request or by drawing note.
Advantages
- High electrical conductivity — 98 % IACS, better than 94% of copper alloy grades
- Conducts heat well — 386 W/m·K (223 BTU/hr·ft·°F), better than 93% of copper alloy grades
- Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
- Readily welded — 60/100, better than 76% of copper alloy grades
Limitations
- Limited service temperature — 100°C (212 °F), worse than 100% of copper alloy grades
- Limited ductility — 4%, worse than 96% of copper alloy grades
C1020-H08 properties
Typical room-temperature values for C1020-H08; 20 are specific to this condition. Other listed values are C1020 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C1020-H08 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,083°C (1,981 °F).
Mechanical12
C1020-H08 has a yield strength of 315 MPa (45.7 ksi) and a tensile strength of 345 MPa (50 ksi) — stronger than 67% of copper alloy grades. Elongation at break is 4% and the elastic modulus is 118 GPa (17.1 Msi).
Thermal6
C1020-H08 is rated for continuous service to 100°C (212 °F). It conducts heat at 386 W/m·K (223 BTU/hr·ft·°F), better than 93% of copper alloy grades. Thermal expansion is 17 µm/m·K (9.44 µin/in·°F).
Electrical3
C1020-H08 conducts electricity at 98 % IACS, better than 94% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (60/100), worse than 68% of copper alloy grades.
Sustainability4
Producing a kilogram of C1020-H08 takes about 57 MJ of energy and emits 3.8 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 25%.
Manufacturability8
C1020-H08's machinability is fair (35/100, better than 51% of copper alloy grades); weldability good (60/100); formability poor (30/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C1020-H08
Is C1020 easy to machine?
Gummy and low-rated (~20 % of B1112): use sharp, high-rake, polished-flute tools, high speed with light feed and flood emulsion; avoid built-up edge — for volume turning switch to C14500/C36000.
Can C1020 be welded?
Excellent for GTAW/EBW/laser and brazing because there is no oxygen to cause hydrogen embrittlement; preheat 200–400 °C on thick sections due to high thermal conductivity, and use Ar/He shielding.
Can C1020 be formed, bent or molded?
Outstanding cold formability in O temper (deep draw, spinning, severe bending); interanneal at 400–600 °C when cumulative reduction exceeds ~60 %.
What surface finishes work on C1020?
Not anodisable — commonly electroplated with Ni, Ag, Sn or Au, chemically brightened, or lacquered/ROHS-passivated to prevent tarnish; polishes to a high mirror finish.
C1020 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Ooxygen ≤10 ppm — defining limit for oxygen-free copper | ≤ 0 | 5×10⁻⁴ |
| Ptypical impurity limit, ASTM B170 | ≤ 3×10⁻⁴ | — |
| Bi | ≤ 0 | — |
| Pb | ≤ 0 | — |
| S | ≤ 0 | — |
| Se | ≤ 0 | — |
| Te | ≤ 0 | — |
| CuCu (incl. Ag) min per JIS H3100 / ASTM B170 Grade 2 (C10200) | ≥ 99.96 (balance) | — |
C1020-H08 — frequently asked
What is C1020-H08 used for?
C1020-H08 is typically used for electronic connectors, high-conductivity bus bar and semiconductor lead frames. In short: oxygen-free JIS copper; best copper weldability; 101 % IACS conductivity.
What is the yield strength of C1020-H08?
C1020-H08 has a typical yield strength of 315 MPa (45.7 ksi) and a tensile strength of 345 MPa (50 ksi) — stronger than 67% of copper alloy grades. Strength varies by condition: see the 10 listed tempers.
Is C1020-H08 easy to machine?
Not especially — machinability is rated fair (35/100, better than 51% of copper alloy grades). Gummy and low-rated (~20 % of B1112): use sharp, high-rake, polished-flute tools, high speed with light feed and flood emulsion; avoid built-up edge — for volume turning switch to C14500/C36000.
Can C1020-H08 be welded?
Yes — weldability is rated good (60/100). Excellent for GTAW/EBW/laser and brazing because there is no oxygen to cause hydrogen embrittlement; preheat 200–400 °C on thick sections due to high thermal conductivity, and use Ar/He shielding.
What surface finishes work on C1020-H08?
Not anodisable — commonly electroplated with Ni, Ag, Sn or Au, chemically brightened, or lacquered/ROHS-passivated to prevent tarnish; polishes to a high mirror finish.
Can C1020-H08 be formed, bent or molded?
Outstanding cold formability in O temper (deep draw, spinning, severe bending); interanneal at 400–600 °C when cumulative reduction exceeds ~60 %.
What is the maximum service temperature of C1020-H08?
C1020-H08 is rated for continuous use to about 100°C (212 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C1020-O and C1020-H10?
O is the default condition — choose for deep drawing, bending, gaskets, vacuum seals and maximum conductivity. H10: highest cold-worked strength in thin strip/wire; very limited bending, softens above ~150 °C. Yield strength is 69 MPa in O versus 345 MPa in H10.
Sources
- JIS H3100 / H3250 / H3300 — Copper and copper alloy sheets, rods and tubes — JSA (2018)
- ASTM B170 — Oxygen-Free Electrolytic Copper Refinery Shapes — ASTM (2019)
- CDA Alloy Datasheet C10200 (OF Copper) — Copper Development Association (2023)
- ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.