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Copper Alloy C19210-H08

Supply condition

UNS C19210

H08 = spring hard

Pick for flat springs and pressure contacts where conductivity matters more than relaxation life.

High cost $$$$

Values for the H08 condition

Other C19210 tempers and conditions

C19210 is listed in 9 conditions; see the grade overview at C19210.

Compare all 9 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Soft annealed
Pick for deep-formed or severely bent parts and for maximum conductivity.802403815 HRB92 % IACS
Quarter hard
Pick when moderate strength must be combined with tight-radius forming.2252801590 HB91 % IACS
Half hard
The standard compromise temper for stamped terminals and lead frames needing 90° bends.2853209104 HB90 % IACS
Three-quarter hard
Intermediate step when H02 is too soft but H04 cracks on the bend line.3153457112 HB90 % IACS
Stress-relief / stabilizing anneal after cold rolling
Pick when flatness and dimensional stability of stamped lead frames through die-attach bakes are critical.3403606112 HB91 % IACS
H04Default
Full hard
Default stocked lead-frame / terminal strip temper: best strength-to-formability balance at 90 % IACS.345370560 HRB90 % IACS
Extra hard
Pick for flat stamped contacts needing higher yield with only gentle forming.3804004126 HB89 % IACS
H08This page
Spring hard
Pick for flat springs and pressure contacts where conductivity matters more than relaxation life.4104303134 HB88 % IACS
Extra spring hard
Maximum cold-rolled strength for thin flat springs; essentially no forming capability across the grain.4454602142 HB88 % IACS

What is C19210-H08?

C19210-H08 is C19210 supplied in the H08 condition — pick for flat springs and pressure contacts where conductivity matters more than relaxation life. C19210-H08 has a yield strength of 410 MPa (59.5 ksi) and a tensile strength of 430 MPa (62.4 ksi) — stronger than 81% of copper alloy grades. Elongation at break is 3% and the elastic modulus is 122 GPa (17.7 Msi). C19210-H08 has a density of 8.91 g/cm³ (0.322 lb/in³), heavier than 80% of copper alloy grades. It melts at 1,080°C (1,976 °F). H04 is the default condition FabDigit quotes; H08 is available on request or by drawing note.

Advantages

  • Conducts heat well — 350 W/m·K (202.2 BTU/hr·ft·°F), better than 88% of copper alloy grades
  • High electrical conductivity — 88 % IACS, better than 86% of copper alloy grades
  • High strength — 410 MPa (59.5 ksi), better than 81% of copper alloy grades

Limitations

  • Limited ductility — 3%, worse than 97% of copper alloy grades
  • Limited service temperature — 175°C (347 °F), worse than 92% of copper alloy grades

C19210-H08 properties

Typical room-temperature values for C19210-H08; 18 are specific to this condition. Other listed values are C19210 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C19210-H08 has a density of 8.91 g/cm³ (0.322 lb/in³), heavier than 80% of copper alloy grades. It melts at 1,080°C (1,976 °F).

Density8.91 g/cm³0.32 lb/in³
Melting Point (Solidus)1,080°C1,976 °F
Liquidus Temperature1,084°C1,983 °F

Mechanical11

C19210-H08 has a yield strength of 410 MPa (59.5 ksi) and a tensile strength of 430 MPa (62.4 ksi) — stronger than 81% of copper alloy grades. Elongation at break is 3% and the elastic modulus is 122 GPa (17.7 Msi).

Elastic (Young's) Modulus122 GPa17.7 Msi
Shear Modulus45 GPa6.5 Msi
Bulk Modulus138 GPa20 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)430 MPa62.4 ksi
Yield Strength (0.2% offset)410 MPa59.5 ksi
Elongation at Break3%
Shear Strength265 MPa38.4 ksi
Fatigue Strength (Endurance Limit)150 MPa21.8 ksi
Hardness, Rockwell B72 HRB
Hardness, Vickers142 HV

Thermal6

C19210-H08 is rated for continuous service to 175°C (347 °F). It conducts heat at 350 W/m·K (202.2 BTU/hr·ft·°F), better than 88% of copper alloy grades. Thermal expansion is 17.6 µm/m·K (9.78 µin/in·°F).

Thermal Conductivity350 W/m·K202 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.6 µm/m·K9.8 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)175°C347 °F
Min Service Temperature-200°C-328 °F

Electrical3

C19210-H08 conducts electricity at 88 % IACS, better than 86% of copper alloy grades.

Electrical Conductivity88 % IACS
Electrical Resistivity1.96×10⁻⁸ Ω·m0.771 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (55/100), worse than 86% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.22 V
Corrosion ResistanceGood55/100
Chemical Resistance SummaryGood in fresh water, neutral atmospheres and most organics; tarnishes readily in sulfur-bearing air, attacked by ammonia/amines, oxidizing acids and strong oxidizers.

Sustainability4

Producing a kilogram of C19210-H08 takes about 58 MJ of energy and emits 3.6 kg of CO₂ — more than 61% of copper alloy grades. Typical recycled content is 25%.

Embodied Energy (primary production)58 MJ/kg24,936 BTU/lb
Embodied Carbon (primary production)3.6 kg CO₂/kg
Embodied Water320 L/kg38.3 gal/lb
Typical Recycled Content25%

Manufacturability7

C19210-H08's machinability is poor (30/100, worse than 67% of copper alloy grades); weldability fair (40/100); formability fair (45/100).

MachinabilityPoor30/100
Machinability Rating (AISI 1212 = 100 %)24%
WeldabilityFair40/100
Formability (cold)Fair45/100
Brazeability / SolderabilityExcellent90/100
PolishabilityVery good70/100
Anodizing Responsen/a — copper alloy; use tin, silver, nickel or gold plating instead

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C19210-H08

Is C19210 easy to machine?

Gummy like pure copper (≈20 % of AISI 1212): use sharp positive-rake tools, high speed, light feed and flood coolant; hard tempers machine and blank cleaner than annealed.

Can C19210 be welded?

Resistance, laser and ultrasonic joining work well on thin strip; fusion welding is difficult because of the very high thermal conductivity, and phosphorus-bearing filler is preferred.

Can C19210 be formed, bent or molded?

Excellent progressive-die stamping and bending; bend H04 with the fold across the rolling direction and anneal (350–500 °C) between severe forming steps.

What surface finishes work on C19210?

Solders and silver/tin/nickel-plates readily after acid pickling; no anodizing — apply an antitarnish or plated layer since bare surfaces oxidize during bake cycles.

C19210 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Fe0.05 – 0.150.1
P0.03 – 0.040.03
Pbimpurity limit≤ 0.03—
Znimpurity limit≤ 0.05—
other (each)residual elements≤ 0.03—
Cu99.8 % min including Agbalance—

C19210-H08 — frequently asked

What is C19210-H08 used for?

C19210-H08 is typically used for semiconductor lead frames, electrical terminals, connectors and relay parts. In short: 90 % IACS lead-frame copper; low-cost stamping strip; conductivity before strength.

What is the yield strength of C19210-H08?

C19210-H08 has a typical yield strength of 410 MPa (59.5 ksi) and a tensile strength of 430 MPa (62.4 ksi) — stronger than 81% of copper alloy grades. Strength varies by condition: see the 9 listed tempers.

Is C19210-H08 easy to machine?

Not especially — machinability is rated poor (30/100, worse than 67% of copper alloy grades). Gummy like pure copper (≈20 % of AISI 1212): use sharp positive-rake tools, high speed, light feed and flood coolant; hard tempers machine and blank cleaner than annealed.

Can C19210-H08 be welded?

With care — weldability is rated fair (40/100). Resistance, laser and ultrasonic joining work well on thin strip; fusion welding is difficult because of the very high thermal conductivity, and phosphorus-bearing filler is preferred.

What surface finishes work on C19210-H08?

Solders and silver/tin/nickel-plates readily after acid pickling; no anodizing — apply an antitarnish or plated layer since bare surfaces oxidize during bake cycles.

Can C19210-H08 be formed, bent or molded?

Excellent progressive-die stamping and bending; bend H04 with the fold across the rolling direction and anneal (350–500 °C) between severe forming steps.

What is the maximum service temperature of C19210-H08?

C19210-H08 is rated for continuous use to about 175°C (347 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C19210-H04 and C19210-O60?

H04 is the default condition — default stocked lead-frame / terminal strip temper: best strength-to-formability balance at 90 % IACS. O60: pick for deep-formed or severely bent parts and for maximum conductivity. Yield strength is 345 MPa in H04 versus 80 MPa in O60.

Sources

  1. CDA Alloy Datasheet C19210 (Cu-Fe-P) — Copper Development Association (2023)
  2. ASTM B888 / B888M — Copper Alloy Strip for Use in Manufacture of Electrical Connectors or Lead Frames — ASTM International (2020)
  3. ASTM B601 — Temper Designations for Copper and Copper Alloys — ASTM International (2019)
  4. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  5. GB/T 2059 / GB/T 2040 — SAC (2017)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.