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Copper Alloy C15500-H01

Supply condition

UNS C15500

H01 = quarter hard

Light temper for parts that still need moderate bending but more stiffness than soft strip.

High cost $$$$

Values for the H01 condition

Other C15500 tempers and conditions

C15500 is listed in 8 conditions; see the grade overview at C15500.

Compare all 8 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Light annealed
Softest supply condition — pick it for deep drawing, severe bending or when maximum conductivity and formability matter.802354245 HB93 % IACS
H01This page
Quarter hard
Light temper for parts that still need moderate bending but more stiffness than soft strip.2052702570 HB92 % IACS
Half hard
Best all-round strip temper: usable bend radii with roughly double the annealed yield strength.2703101488 HB92 % IACS
H04Default
Full hard
Standard stocked temper for lead frames, commutator segments and contacts that must survive solder/braze heat with strength retained.3103456100 HB92 % IACS
Spring hard
Choose for flat springs and press contacts where elastic limit matters more than bendability.3453804108 HB91 % IACS
Extra spring hard
Higher cold-work level for thin contact springs needing extra elastic deflection.3654003112 HB91 % IACS
Strain hardened, quarter hard
Very heavily rolled strip for high-force miniature springs; bends only with the grain and generous radii.3804152.5116 HB91 % IACS
Strain hardened, half hard
Maximum strength temper of the C15500 strip range — flat parts, minimal forming, highest spring rate.4004302120 HB90 % IACS

What is C15500-H01?

C15500-H01 is C15500 supplied in the H01 condition — light temper for parts that still need moderate bending but more stiffness than soft strip. C15500-H01 has a yield strength of 205 MPa (29.7 ksi) and a tensile strength of 270 MPa (39.2 ksi) — weaker than 53% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 117 GPa (17 Msi). C15500-H01 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F). H04 is the default condition FabDigit quotes; H01 is available on request or by drawing note.

Advantages

  • High electrical conductivity — 92 % IACS, better than 89% of copper alloy grades
  • Conducts heat well — 344 W/m·K (198.8 BTU/hr·ft·°F), better than 86% of copper alloy grades
  • High service temperature — 300°C (572 °F), better than 85% of copper alloy grades
  • Forms and bends easily — 75/100, better than 82% of copper alloy grades

Limitations

  • Difficult to machine — 20/100, worse than 98% of copper alloy grades

C15500-H01 properties

Typical room-temperature values for C15500-H01; 12 are specific to this condition. Other listed values are C15500 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C15500-H01 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).

Density8.94 g/cm³0.32 lb/in³
Melting Point (Solidus)1,065°C1,949 °F
Liquidus Temperature1,083°C1,981 °F

Mechanical12

C15500-H01 has a yield strength of 205 MPa (29.7 ksi) and a tensile strength of 270 MPa (39.2 ksi) — weaker than 53% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 117 GPa (17 Msi).

Elastic (Young's) Modulus117 GPa17 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus140 GPa20.3 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)270 MPa39.2 ksi
Yield Strength (0.2% offset)205 MPa29.7 ksi
Elongation at Break25%
Shear Strength175 MPa25.4 ksi
Fatigue Strength (Endurance Limit)90 MPa13.1 ksi
Hardness, Brinell70 HB
Hardness, Rockwell B25 HRB
Hardness, Vickers105 HV

Thermal6

C15500-H01 is rated for continuous service to 300°C (572 °F). It conducts heat at 344 W/m·K (198.8 BTU/hr·ft·°F), better than 86% of copper alloy grades. Thermal expansion is 17.6 µm/m·K (9.78 µin/in·°F).

Thermal Conductivity344 W/m·K199 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.6 µm/m·K9.8 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)300°C572 °F
Min Service Temperature-200°C-328 °F

Electrical3

C15500-H01 conducts electricity at 92 % IACS, better than 89% of copper alloy grades.

Electrical Conductivity92 % IACS
Electrical Resistivity1.87×10⁻⁸ Ω·m0.736 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (68/100), better than 69% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.25 V
Corrosion ResistanceGood68/100
Chemical Resistance SummaryGood in fresh/sea water, non-oxidising acids and neutral atmospheres; attacked by ammonia and amines (SCC risk), oxidising acids (HNO₃), sulphides and moist H₂S; forms protective patina outdoors.

Sustainability4

Producing a kilogram of C15500-H01 takes about 55 MJ of energy and emits 3.6 kg of CO₂ — less than 72% of copper alloy grades. Typical recycled content is 30%.

Embodied Energy (primary production)55 MJ/kg23,646 BTU/lb
Embodied Carbon (primary production)3.6 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content30%

Manufacturability8

C15500-H01's machinability is poor (20/100, worse than 98% of copper alloy grades); weldability good (55/100); formability very good (75/100).

MachinabilityPoor20/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityGood55/100
Formability (cold)Very good75/100
CastabilityFair40/100
Brazeability / SolderabilityExcellent95/100
PolishabilityVery good80/100
Anodizing Responsen/a — copper is not anodised; use tin, silver or nickel plating for solderability and tarnish control.

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C15500-H01

Is C15500 easy to machine?

Gummy like pure copper (≈20 % of AISI 1212); use sharp positive-rake tools, high speed, low feed and flood coolant, or specify H04+ temper to reduce built-up edge.

Can C15500 be welded?

Excellent for soldering and brazing; GTAW/resistance welding are workable but the very high thermal conductivity demands preheat and high heat input — welding destroys the cold-worked strength locally.

Can C15500 be formed, bent or molded?

Anneals softly and cold-works readily; O50/H01 for deep draws and tight bends, H04 and above only for gentle bends with the grain.

What surface finishes work on C15500?

Not anodisable; tin, silver or nickel plate for solderability and tarnish resistance, or apply benzotriazole/lacquer to keep bright copper.

C15500 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Ag8–25 troy oz/ton silver addition; raises softening temperature0.03 – 0.10.06
Pdeoxidiser0.04 – 0.080.06
Mg0.08 – 0.130.1
CuCu + Ag ≥ 99.75 % minbalance—

C15500-H01 — frequently asked

What is C15500-H01 used for?

C15500-H01 is typically used for commutator bars, motor windings and lead frames requiring soldering resistance. In short: anneal-resistant high-conductivity copper; holds temper through soldering; 92% IACS, 250 °C service.

What is the yield strength of C15500-H01?

C15500-H01 has a typical yield strength of 205 MPa (29.7 ksi) and a tensile strength of 270 MPa (39.2 ksi) — weaker than 53% of copper alloy grades. Strength varies by condition: see the 8 listed tempers.

Is C15500-H01 easy to machine?

Not especially — machinability is rated poor (20/100, worse than 98% of copper alloy grades). Gummy like pure copper (≈20 % of AISI 1212); use sharp positive-rake tools, high speed, low feed and flood coolant, or specify H04+ temper to reduce built-up edge.

Can C15500-H01 be welded?

Yes — weldability is rated good (55/100). Excellent for soldering and brazing; GTAW/resistance welding are workable but the very high thermal conductivity demands preheat and high heat input — welding destroys the cold-worked strength locally.

What surface finishes work on C15500-H01?

Not anodisable; tin, silver or nickel plate for solderability and tarnish resistance, or apply benzotriazole/lacquer to keep bright copper.

Can C15500-H01 be formed, bent or molded?

Anneals softly and cold-works readily; O50/H01 for deep draws and tight bends, H04 and above only for gentle bends with the grain.

What is the maximum service temperature of C15500-H01?

C15500-H01 is rated for continuous use to about 300°C (572 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C15500-H04 and C15500-O50?

H04 is the default condition — standard stocked temper for lead frames, commutator segments and contacts that must survive solder/braze heat with strength retained. O50: softest supply condition — pick it for deep drawing, severe bending or when maximum conductivity and formability matter. Yield strength is 310 MPa in H04 versus 80 MPa in O50.

Sources

  1. ASTM B747 / B152 (copper sheet, strip, plate and rolled bar) — ASTM International (2019)
  2. CDA UNS C15500 alloy datasheet (silver-bearing phosphorus-deoxidized copper) — Copper Development Association (2023)
  3. ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  4. ASM Handbook Vol.13B — Corrosion: Materials — ASM International (2005)
  5. GB/T 2059 / GB/T 2040 (2017)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.