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Copper Alloy C15100-H01

Supply condition

UNS C15100 · ASTM B99

H01 = quarter hard

Light cold work for parts still needing appreciable bending while gaining stiffness over annealed stock.

High cost $$$$

Values for the H01 condition

Other C15100 tempers and conditions

C15100 is listed in 8 conditions; see the grade overview at C15100.

Compare all 8 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Annealed to 0.015 mm grain size
Softest condition — choose for deep drawing, severe bending or when maximum conductivity is required.802354050 HB95 % IACS
H01This page
Quarter hard
Light cold work for parts still needing appreciable bending while gaining stiffness over annealed stock.2152752570 HB94 % IACS
Half hard
Balanced strength/formability temper for stamped conductive contacts and terminals.2703101488 HB93 % IACS
Three-quarter hard
Use when H02 lacks yield strength but full-hard is too brittle for the required bend radius.305335998 HB92 % IACS
H04Default
Full hard
Most commonly stocked strip/rod condition — best general compromise of strength, conductivity and softening resistance.3303606105 HB92 % IACS
TD04 and precipitation hardened
Age the cold-worked strip/rod to recover conductivity and add ~10 % strength for resistance-welding electrodes and rotor bars.3704008115 HB95 % IACS
Extra hard
Heavier cold work for high-strength conductors and blades where forming is limited to flat work.3754004118 HB91 % IACS
Spring hard
Maximum as-drawn strength for conductive springs, clips and commutator/contact strip.4054303128 HB90 % IACS

What is C15100-H01?

C15100-H01 is C15100 supplied in the H01 condition — light cold work for parts still needing appreciable bending while gaining stiffness over annealed stock. C15100-H01 has a yield strength of 215 MPa (31.2 ksi) and a tensile strength of 275 MPa (39.9 ksi) — weaker than 52% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 120 GPa (17.4 Msi). C15100-H01 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,080°C (1,976 °F). H04 is the default condition FabDigit quotes; H01 is available on request or by drawing note.

Advantages

  • High service temperature — 420°C (788 °F), better than 98% of copper alloy grades
  • Conducts heat well — 362 W/m·K (209.2 BTU/hr·ft·°F), better than 91% of copper alloy grades
  • High electrical conductivity — 94 % IACS, better than 90% of copper alloy grades
  • Forms and bends easily — 75/100, better than 82% of copper alloy grades

Limitations

  • Difficult to machine — 20/100, worse than 98% of copper alloy grades

C15100-H01 properties

Typical room-temperature values for C15100-H01; 14 are specific to this condition. Other listed values are C15100 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C15100-H01 has a density of 8.89 g/cm³ (0.321 lb/in³), heavier than 72% of copper alloy grades. It melts at 1,080°C (1,976 °F).

Density8.89 g/cm³0.32 lb/in³
Melting Point (Solidus)1,080°C1,976 °F
Liquidus Temperature1,085°C1,985 °F

Mechanical12

C15100-H01 has a yield strength of 215 MPa (31.2 ksi) and a tensile strength of 275 MPa (39.9 ksi) — weaker than 52% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 120 GPa (17.4 Msi).

Elastic (Young's) Modulus120 GPa17.4 Msi
Shear Modulus45 GPa6.5 Msi
Bulk Modulus140 GPa20.3 Msi
Poisson's Ratio0.33
Tensile Strength (Ultimate)275 MPa39.9 ksi
Yield Strength (0.2% offset)215 MPa31.2 ksi
Elongation at Break25%
Shear Strength175 MPa25.4 ksi
Fatigue Strength (Endurance Limit)115 MPa16.7 ksi
Hardness, Brinell70 HB
Hardness, Rockwell B35 HRB
Hardness, Vickers78 HV

Thermal6

C15100-H01 is rated for continuous service to 420°C (788 °F). It conducts heat at 362 W/m·K (209.2 BTU/hr·ft·°F), better than 91% of copper alloy grades. Thermal expansion is 17.6 µm/m·K (9.78 µin/in·°F).

Thermal Conductivity362 W/m·K209 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.6 µm/m·K9.8 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)420°C788 °F
Min Service Temperature-200°C-328 °F

Electrical3

C15100-H01 conducts electricity at 94 % IACS, better than 90% of copper alloy grades.

Electrical Conductivity94 % IACS
Electrical Resistivity1.83×10⁻⁸ Ω·m0.72 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (60/100), worse than 68% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.2 V
Corrosion ResistanceGood60/100
Chemical Resistance SummaryGood in fresh/sea water, neutral salts and non-oxidising acids; attacked by ammonia and amines, nitric acid, oxidising acids and sulphur compounds; tarnishes in air above ~200 °C.

Sustainability4

Producing a kilogram of C15100-H01 takes about 55 MJ of energy and emits 3.8 kg of CO₂ — less than 72% of copper alloy grades. Typical recycled content is 25%.

Embodied Energy (primary production)55 MJ/kg23,646 BTU/lb
Embodied Carbon (primary production)3.8 kg CO₂/kg
Embodied Water250 L/kg30 gal/lb
Typical Recycled Content25%

Manufacturability8

C15100-H01's machinability is poor (20/100, worse than 98% of copper alloy grades); weldability fair (45/100); formability very good (75/100).

MachinabilityPoor20/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityFair45/100
Formability (cold)Very good75/100
CastabilityFair45/100
Brazeability / SolderabilityVery good70/100
PolishabilityVery good70/100
Anodizing Responsen/a — copper alloy; use bright dip, tin/silver/nickel plating or chromate passivation instead

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C15100-H01

Is C15100 easy to machine?

Gummy like OFHC copper (~20 % of free-cutting brass) — use sharp positive-rake carbide, high speed, generous coolant and chip breaking.

Can C15100 be welded?

GTAW/EB/laser possible with matching or Cu-Si filler but the HAZ anneals and loses cold-work strength; resistance welding is poor because of high conductivity.

Can C15100 be formed, bent or molded?

Excellent cold formability in OS015/H01; keep bend radii ≥1–2t in H04 and above, and inter-anneal at 500–600 °C for deep-drawn parts.

What surface finishes work on C15100?

Not anodisable; bright-dip or pickle then silver, nickel or tin plate for contacts; polishes well but tarnishes without a lacquer or passivation.

C15100 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Zrzirconium is the sole intentional addition0.05 – 0.150.1
CuCu + Ag + Zr ≥ 99.9 % typical; oxygen-free base≥ 99.8 (balance)—

C15100-H01 — frequently asked

What is C15100-H01 used for?

C15100-H01 is typically used for electrical connectors, lead frames and commutator segments. In short: near-pure copper conductivity; higher conductivity than C15000; holds strength to 450 °C.

What is the yield strength of C15100-H01?

C15100-H01 has a typical yield strength of 215 MPa (31.2 ksi) and a tensile strength of 275 MPa (39.9 ksi) — weaker than 52% of copper alloy grades. Strength varies by condition: see the 8 listed tempers.

Is C15100-H01 easy to machine?

Not especially — machinability is rated poor (20/100, worse than 98% of copper alloy grades). Gummy like OFHC copper (~20 % of free-cutting brass) — use sharp positive-rake carbide, high speed, generous coolant and chip breaking.

Can C15100-H01 be welded?

With care — weldability is rated fair (45/100). GTAW/EB/laser possible with matching or Cu-Si filler but the HAZ anneals and loses cold-work strength; resistance welding is poor because of high conductivity.

What surface finishes work on C15100-H01?

Not anodisable; bright-dip or pickle then silver, nickel or tin plate for contacts; polishes well but tarnishes without a lacquer or passivation.

Can C15100-H01 be formed, bent or molded?

Excellent cold formability in OS015/H01; keep bend radii ≥1–2t in H04 and above, and inter-anneal at 500–600 °C for deep-drawn parts.

What is the maximum service temperature of C15100-H01?

C15100-H01 is rated for continuous use to about 420°C (788 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C15100-H04 and C15100-OS015?

H04 is the default condition — most commonly stocked strip/rod condition — best general compromise of strength, conductivity and softening resistance. OS015: softest condition — choose for deep drawing, severe bending or when maximum conductivity is required. Yield strength is 330 MPa in H04 versus 80 MPa in OS015.

Sources

  1. ASTM B937 / UNS C15100 registered composition (CDA) — ASTM / Copper Development Association (2021)
  2. CDA alloy datasheet C15100 (zirconium copper) property and temper tables — copper.org (2023)
  3. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  4. GB/T 5231 / GB/T 21652 (2022)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.