Copper Alloy C11300-H02
Supply condition
UNS C11300 · ASTM B48 · EN CW011A, CR013A
H02 = half hard
General-purpose semi-rigid strip/bar: busbar links, commutator risers, moderate 90° bends across grain.
Values for the H02 condition
Other C11300 tempers and conditions
C11300 is listed in 13 conditions; see the grade overview at C11300.
Compare all 13 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Hot rolled and annealed | Soft heavy plate/bar for deep forming, bending of busbars and welded fabrications. | 62 | 220 | 48 | 42 HB | 101 % IACS |
Soft annealed | Standard fully annealed condition for maximum ductility, drawing, spinning and gasket/roofing use. | 76 | 235 | 45 | 45 HB | 101 % IACS |
As hot rolled | Mill product taken straight off the hot mill — cheapest heavy plate/bar for busbar and grounding parts where temper is not critical. | 90 | 235 | 42 | 50 HB | 100 % IACS |
1/8 hard | Lightly stiffened strip that still bends freely — good for formed terminals needing slight springback control. | 170 | 250 | 32 | 60 HB | 100 % IACS |
Light drawn | Lightly drawn tube/rod that still bends and flares, common for conductive tubing and machined blanks. | 205 | 260 | 25 | 68 HB | 99 % IACS |
Quarter hard | Best compromise of formability and strength for stamped, bent contacts and clips. | 215 | 275 | 25 | 70 HB | 99 % IACS |
H02This page Half hard | General-purpose semi-rigid strip/bar: busbar links, commutator risers, moderate 90° bends across grain. | 255 | 300 | 14 | 85 HB | 99 % IACS |
Three-quarter hard | Higher stiffness with limited bending — used for flat springs and stiff conductor strip. | 285 | 320 | 10 | 93 HB | 98 % IACS |
H04Default Full hard | The workhorse stocked temper: full-hard strip/bar/rod that keeps its hardness through soldering thanks to the silver addition. | 310 | 345 | 6 | 100 HB | 98 % IACS |
Extra hard | Extra-hard strip for stiff, flat-formed parts and blanking where minimal bending is required. | 330 | 365 | 5 | 105 HB | 97.5 % IACS |
Spring hard | Spring temper strip for conductive leaf springs and contacts that must not soften during reflow soldering. | 345 | 380 | 4 | 110 HB | 97 % IACS |
Hard drawn | Hard-drawn wire/rod for magnet-wire, commutator bars and windings that must resist softening during soldering or short-term overload. | 350 | 400 | 3 | 105 HB | 97.5 % IACS |
Extra spring hard | Maximum cold-worked strength available in the grade; for thin flat springs and shims with essentially no forming. | 360 | 395 | 3.5 | 115 HB | 97 % IACS |
What is C11300-H02?
C11300-H02 is C11300 supplied in the H02 condition — general-purpose semi-rigid strip/bar: busbar links, commutator risers, moderate 90° bends across grain. C11300-H02 has a yield strength of 255 MPa (37 ksi) and a tensile strength of 300 MPa (43.5 ksi) — stronger than 55% of copper alloy grades. Elongation at break is 14% and the elastic modulus is 117 GPa (17 Msi). C11300-H02 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F). H04 is the default condition FabDigit quotes; H02 is available on request or by drawing note.
Advantages
- Conducts heat well — 388 W/m·K (224.2 BTU/hr·ft·°F), better than 95% of copper alloy grades
- High electrical conductivity — 99 % IACS, better than 95% of copper alloy grades
- Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
- Forms and bends easily — 62/100, better than 77% of copper alloy grades
C11300-H02 properties
Typical room-temperature values for C11300-H02; 14 are specific to this condition. Other listed values are C11300 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C11300-H02 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).
Mechanical13
C11300-H02 has a yield strength of 255 MPa (37 ksi) and a tensile strength of 300 MPa (43.5 ksi) — stronger than 55% of copper alloy grades. Elongation at break is 14% and the elastic modulus is 117 GPa (17 Msi).
Thermal6
C11300-H02 is rated for continuous service to 200°C (392 °F). It conducts heat at 388 W/m·K (224.2 BTU/hr·ft·°F), better than 95% of copper alloy grades. Thermal expansion is 17 µm/m·K (9.44 µin/in·°F).
Electrical3
C11300-H02 conducts electricity at 99 % IACS, better than 95% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (62/100), worse than 57% of copper alloy grades.
Sustainability4
Producing a kilogram of C11300-H02 takes about 57 MJ of energy and emits 3.6 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 35%.
Manufacturability8
C11300-H02's machinability is poor (30/100, worse than 67% of copper alloy grades); weldability fair (35/100); formability good (62/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C11300-H02
Is C11300 easy to machine?
Gummy and stringy like ETP copper (≈20 % of free-cutting brass) — use sharp positive-rake tools, high speed, generous coolant, and avoid dwelling; consider C14500/C36000 if heavy machining dominates.
Can C11300 be welded?
Resistance and brazing/soldering are excellent; fusion welding is compromised by the 0.02–0.05 % oxygen (porosity, hydrogen embrittlement) so prefer deoxidised C12200 filler, EB/laser or friction welding for critical joints.
Can C11300 be formed, bent or molded?
Annealed and 1/8–1/4 hard tempers deep draw, coin and bend to very tight radii; hard tempers need generous bend radii (≥1–2 t across grain) and interstage annealing at 400–600 °C.
What surface finishes work on C11300?
Not anodisable — tin, nickel or silver electroplate for solderability and tarnish control, or use chemical blackening/clear lacquer; polishes to a high lustre but oxidises quickly if unprotected.
C11300 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Ag8 troy oz/short ton minimum; C11400 = 10 oz, C11600 = 25 oz variants | ≥ 0.03 | 0.03 |
| Otypical tough-pitch oxygen level, not a specified limit | 0.02 – 0.05 | 0.03 |
| CuCu + Ag counted together, ASTM B152/B133; oxygen present as Cu2O | ≥ 99.9 (balance) | — |
C11300-H02 — frequently asked
What is C11300-H02 used for?
C11300-H02 is typically used for commutator bars, lead-in wires and motor conductors. In short: silver-bearing ETP copper; holds temper through soldering; full ETP conductivity.
What is the yield strength of C11300-H02?
C11300-H02 has a typical yield strength of 255 MPa (37 ksi) and a tensile strength of 300 MPa (43.5 ksi) — stronger than 55% of copper alloy grades. Strength varies by condition: see the 13 listed tempers.
Is C11300-H02 easy to machine?
Not especially — machinability is rated poor (30/100, worse than 67% of copper alloy grades). Gummy and stringy like ETP copper (≈20 % of free-cutting brass) — use sharp positive-rake tools, high speed, generous coolant, and avoid dwelling; consider C14500/C36000 if heavy machining dominates.
Can C11300-H02 be welded?
With care — weldability is rated fair (35/100). Resistance and brazing/soldering are excellent; fusion welding is compromised by the 0.02–0.05 % oxygen (porosity, hydrogen embrittlement) so prefer deoxidised C12200 filler, EB/laser or friction welding for critical joints.
What surface finishes work on C11300-H02?
Not anodisable — tin, nickel or silver electroplate for solderability and tarnish control, or use chemical blackening/clear lacquer; polishes to a high lustre but oxidises quickly if unprotected.
Can C11300-H02 be formed, bent or molded?
Annealed and 1/8–1/4 hard tempers deep draw, coin and bend to very tight radii; hard tempers need generous bend radii (≥1–2 t across grain) and interstage annealing at 400–600 °C.
What is the maximum service temperature of C11300-H02?
C11300-H02 is rated for continuous use to about 200°C (392 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C11300-H04 and C11300-O25?
H04 is the default condition — the workhorse stocked temper: full-hard strip/bar/rod that keeps its hardness through soldering thanks to the silver addition. O25: soft heavy plate/bar for deep forming, bending of busbars and welded fabrications. Yield strength is 310 MPa in H04 versus 62 MPa in O25.
Sources
- ASTM B152/B152M — Copper Sheet, Strip, Plate, and Rolled Bar — ASTM International (2019)
- ASTM B133 — Copper Rod, Bar, and Shapes — ASTM International (2020)
- CDA Alloy Database — C11300 Silver-Bearing Tough Pitch Copper — Copper Development Association (2023)
- ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
- EN 13601 / CW011A copper designations — CEN (2013)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.