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Copper Alloy C1100-O (Annealed)

Temper · default condition

JIS C1100 · UNS C11000 · EN CR004A, Cu-ETP · GB T2

Pick for deep drawing, bending, gaskets, flexible busbar laminates and anywhere maximum conductivity and ductility are wanted.

High cost $$$$

Values for the O condition

Other C1100 tempers and conditions

C1100 is listed in 9 conditions; see the grade overview at C1100.

Compare all 9 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
ODefaultThis page
Annealed
Pick for deep drawing, bending, gaskets, flexible busbar laminates and anywhere maximum conductivity and ductility are wanted.692254545 HB101 % IACS
As fabricated
Economical thick plate and extruded bar stock; properties near annealed, used where the part will be machined or re-formed.752154245 HB100 % IACS
Light-annealed
Use when soft-temper formability is needed but with straighter, less springy strip and a slightly better surface than full O.1102404057 HB100 % IACS
Quarter hard
Choose for mild forming plus a stiffer part — clips, shields, moderately bent terminals.1802603025 HRB100 % IACS
Half hard
The workhorse strip/bar temper: enough strength for busbars, terminals and stamped contacts while still bendable to ~1t.2402951440 HRB99 % IACS
Three-quarter hard
Intermediate temper for flat springs and stamped parts needing more yield than 1/2H with limited forming.27532010100 HB98 % IACS
Hardened
Standard hard temper for rigid busbar, commutator bar, hard-drawn wire and machined parts where strength beats formability.305345652 HRB98 % IACS
Extra hard
Heavily cold-worked strip/wire for springy contacts and high-tension conductors; forming is essentially limited to gentle bends.3403804115 HB97 % IACS
Spring hard
Maximum cold-worked strength for flat springs, shield fingers and fine hard wire; not formable beyond shallow bends.3704053124 HB97 % IACS

What is C1100-O?

C1100-O is C1100 in the O temper — pick for deep drawing, bending, gaskets, flexible busbar laminates and anywhere maximum conductivity and ductility are wanted. C1100-O has a yield strength of 69 MPa (10 ksi) and a tensile strength of 225 MPa (32.6 ksi) — weaker than 96% of copper alloy grades. Elongation at break is 45% and the elastic modulus is 117 GPa (17 Msi). C1100-O has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).

Advantages

  • Forms and bends easily — 98/100, better than 99% of copper alloy grades
  • Conducts heat well — 391 W/m·K (225.9 BTU/hr·ft·°F), better than 98% of copper alloy grades
  • High electrical conductivity — 101 % IACS, better than 98% of copper alloy grades
  • Ductile — tolerates forming and impact — 45%, better than 91% of copper alloy grades

Limitations

  • Difficult to machine — 18/100, worse than 100% of copper alloy grades
  • Low strength — 69 MPa (10 ksi), worse than 96% of copper alloy grades

C1100-O properties

Typical room-temperature values for C1100-O; 12 are specific to this condition. Other listed values are C1100 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C1100-O has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).

Density8.94 g/cm³0.32 lb/in³
Melting Point (Solidus)1,065°C1,949 °F
Liquidus Temperature1,083°C1,981 °F

Mechanical13

C1100-O has a yield strength of 69 MPa (10 ksi) and a tensile strength of 225 MPa (32.6 ksi) — weaker than 96% of copper alloy grades. Elongation at break is 45% and the elastic modulus is 117 GPa (17 Msi).

Elastic (Young's) Modulus117 GPa17 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus140 GPa20.3 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)225 MPa32.6 ksi
Yield Strength (0.2% offset)69 MPa10 ksi
Elongation at Break45%
Reduction in Area70%
Shear Strength150 MPa21.8 ksi
Fatigue Strength (Endurance Limit)70 MPa10.2 ksi
Charpy V-Notch Impact (RT)90 J66.4 ft·lbf
Hardness, Brinell45 HB
Hardness, Vickers48 HV

Thermal6

C1100-O is rated for continuous service to 200°C (392 °F). It conducts heat at 391 W/m·K (225.9 BTU/hr·ft·°F), better than 98% of copper alloy grades. Thermal expansion is 17.7 µm/m·K (9.83 µin/in·°F).

Thermal Conductivity391 W/m·K226 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.7 µm/m·K9.8 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)200°C392 °F
Min Service Temperature-200°C-328 °F

Electrical3

C1100-O conducts electricity at 101 % IACS, better than 98% of copper alloy grades.

Electrical Conductivity101 % IACS
Electrical Resistivity1.71×10⁻⁸ Ω·m0.673 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (62/100), worse than 57% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.3 V
Corrosion ResistanceGood62/100
Chemical Resistance SummaryGood in fresh/sea water, neutral salts, most organics and non-oxidising acids; attacked by ammonia and amines (stress-corrosion), oxidising acids (HNO3), sulphides, and moist halogen/acid gases; tarnishes readily in air.

Sustainability4

Producing a kilogram of C1100-O takes about 55 MJ of energy and emits 3.8 kg of CO₂ — less than 72% of copper alloy grades. Typical recycled content is 35%.

Embodied Energy (primary production)55 MJ/kg23,646 BTU/lb
Embodied Carbon (primary production)3.8 kg CO₂/kg
Embodied Water320 L/kg38.3 gal/lb
Typical Recycled Content35%

Manufacturability7

C1100-O's machinability is poor (18/100, worse than 100% of copper alloy grades); weldability fair (45/100); formability excellent (98/100).

MachinabilityPoor18/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityFair45/100
Formability (cold)Excellent98/100
Brazeability / SolderabilityExcellent92/100
PolishabilityVery good80/100
Anodizing Responsen/a — copper is not anodised; use tin, nickel or silver plating, or clear lacquer for tarnish control

Common Calculations5

Specific Strength (UTS / density)calculated25 kN·m/kg
Specific Stiffness (E / density)calculated13.1 MN·m/kg
Modulus of Resiliencecalculated20 kJ/m³
Thermal Diffusivitycalculated113.6 mm²/s
Thermal Shock Resistance Indexcalculated42

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C1100-O

Is C1100 easy to machine?

Gummy and prone to built-up edge — use sharp positive-rake tools, high speed, low feed, generous soluble-oil coolant; harder tempers cut and chip-break much better than annealed.

Can C1100 be welded?

GTAW/GMAW with high preheat and pure-argon or Ar-He shielding works, but the 0.02–0.05 % oxygen makes C1100 vulnerable to hydrogen embrittlement — avoid reducing flames/atmospheres and prefer OF copper (C1020) for critical welds; brazing and soldering are excellent.

Can C1100 be formed, bent or molded?

Outstanding cold formability in O temper (deep draw, bend 0t, coin, spin); work-hardens fast so interstage anneals at 400–600 °C are usual, and hot working is done at 750–950 °C.

What surface finishes work on C1100?

Not anodisable; tin, nickel, silver or gold plating for contacts, chemical bright dip plus lacquer or benzotriazole for decorative/tarnish protection, and easy mirror polishing.

C1100 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Oresidual oxygen as Cu2O; typical tough-pitch range, not specified in JIS0.02 – 0.050.03
Agcounted with Cu≈ 00
Pbtypical cathode impurity level≤ 0.010
Bi≤ 05×10⁻⁴
S≤ 00
CuCu + Ag ≥ 99.90 % per JIS H3100 (oxygen not counted)≥ 99.9 (balance)—

C1100-O — frequently asked

What is C1100-O used for?

C1100-O is typically used for electrical bus and terminals, wire and cable and general electrical fabrication. In short: asian-stock ETP equivalent; 101 % IACS conductivity; formability score 98.

What is the yield strength of C1100-O?

C1100-O has a typical yield strength of 69 MPa (10 ksi) and a tensile strength of 225 MPa (32.6 ksi) — weaker than 96% of copper alloy grades. Strength varies by condition: see the 9 listed tempers.

Is C1100-O easy to machine?

Not especially — machinability is rated poor (18/100, worse than 100% of copper alloy grades). Gummy and prone to built-up edge — use sharp positive-rake tools, high speed, low feed, generous soluble-oil coolant; harder tempers cut and chip-break much better than annealed.

Can C1100-O be welded?

With care — weldability is rated fair (45/100). GTAW/GMAW with high preheat and pure-argon or Ar-He shielding works, but the 0.02–0.05 % oxygen makes C1100 vulnerable to hydrogen embrittlement — avoid reducing flames/atmospheres and prefer OF copper (C1020) for critical welds; brazing and soldering are excellent.

What surface finishes work on C1100-O?

Not anodisable; tin, nickel, silver or gold plating for contacts, chemical bright dip plus lacquer or benzotriazole for decorative/tarnish protection, and easy mirror polishing.

Can C1100-O be formed, bent or molded?

Outstanding cold formability in O temper (deep draw, bend 0t, coin, spin); work-hardens fast so interstage anneals at 400–600 °C are usual, and hot working is done at 750–950 °C.

What is the maximum service temperature of C1100-O?

C1100-O is rated for continuous use to about 200°C (392 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C1100-O and C1100-SH?

O is the default condition — pick for deep drawing, bending, gaskets, flexible busbar laminates and anywhere maximum conductivity and ductility are wanted. SH: maximum cold-worked strength for flat springs, shield fingers and fine hard wire; not formable beyond shallow bends. Yield strength is 69 MPa in O versus 370 MPa in SH.

Sources

  1. JIS H3100 — Copper and copper alloy sheets, plates and strips — JSA (2018)
  2. JIS H3250 — Copper and copper alloy rods and bars — JSA (2021)
  3. ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM (2019)
  4. CDA Alloy C11000 (ETP) property datasheet — Copper Development Association (2023)
  5. ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.