Copper Alloy CuAg0.07(OF)-R200
Temper · default condition
EN CuAg0.07(OF)
Choose for maximum ductility, deep drawing, bending and forming, and for maximum conductivity after brazing.
Values for the R200 condition
Other CuAg0.07(OF) tempers and conditions
CuAg0.07(OF) is listed in 7 conditions; see the grade overview at CuAg0.07(OF).
Compare all 7 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
R200DefaultThis page annealed, soft | Choose for maximum ductility, deep drawing, bending and forming, and for maximum conductivity after brazing. | 70 | 225 | 45 | 45 HB | 100.5 % IACS |
Thermomechanically controlled processed | Mill stock supplied without specified mechanical properties, for customers who will draw, forge or anneal it themselves. | 70 | 210 | 40 | 42 HB | 100 % IACS |
quarter hard, lightly drawn | Light cold work for straight, dimensionally stable rod that still bends without cracking. | 150 | 240 | 30 | 58 HB | 100 % IACS |
half hard | Best balance of strength and formability for busbar, commutator segments and machined electrical parts. | 200 | 265 | 20 | 80 HB | 99.5 % IACS |
drawn, medium hard | Standard drawn rod temper for machined contacts and screw-machine parts needing straightness and chip control. | 220 | 275 | 15 | 88 HB | 99 % IACS |
hard drawn | Hard-drawn rod/section where strength and softening resistance at 200–300 °C matter most (commutators, contact-wire sections). | 280 | 320 | 8 | 100 HB | 98.5 % IACS |
extra hard / spring drawn wire | Heavily drawn wire and fine sections for windings and springs that must resist stress relaxation after soldering. | 340 | 380 | 3 | 68 HRB | 97.5 % IACS |
What is CuAg0.07(OF)-R200?
CuAg0.07(OF)-R200 is CuAg0.07(OF) in the R200 temper — choose for maximum ductility, deep drawing, bending and forming, and for maximum conductivity after brazing. CuAg0.07(OF)-R200 has a yield strength of 70 MPa (10.2 ksi) and a tensile strength of 225 MPa (32.6 ksi) — weaker than 93% of copper alloy grades. Elongation at break is 45% and the elastic modulus is 120 GPa (17.4 Msi). CuAg0.07(OF)-R200 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).
Advantages
- Conducts heat well — 391 W/m·K (225.9 BTU/hr·ft·°F), better than 98% of copper alloy grades
- High electrical conductivity — 100.5 % IACS, better than 97% of copper alloy grades
- Forms and bends easily — 97/100, better than 97% of copper alloy grades
- Ductile — tolerates forming and impact — 45%, better than 91% of copper alloy grades
- High service temperature — 300°C (572 °F), better than 85% of copper alloy grades
Limitations
- Difficult to machine — 22/100, worse than 94% of copper alloy grades
- Low strength — 70 MPa (10.2 ksi), worse than 93% of copper alloy grades
CuAg0.07(OF)-R200 properties
Typical room-temperature values for CuAg0.07(OF)-R200; 14 are specific to this condition. Other listed values are CuAg0.07(OF) reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
CuAg0.07(OF)-R200 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).
Mechanical12
CuAg0.07(OF)-R200 has a yield strength of 70 MPa (10.2 ksi) and a tensile strength of 225 MPa (32.6 ksi) — weaker than 93% of copper alloy grades. Elongation at break is 45% and the elastic modulus is 120 GPa (17.4 Msi).
Thermal6
CuAg0.07(OF)-R200 is rated for continuous service to 300°C (572 °F). It conducts heat at 391 W/m·K (225.9 BTU/hr·ft·°F), better than 98% of copper alloy grades. Thermal expansion is 17.7 µm/m·K (9.83 µin/in·°F).
Electrical3
CuAg0.07(OF)-R200 conducts electricity at 100.5 % IACS, better than 97% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (58/100), worse than 76% of copper alloy grades.
Sustainability4
Producing a kilogram of CuAg0.07(OF)-R200 takes about 57 MJ of energy and emits 3.9 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 5%.
Manufacturability8
CuAg0.07(OF)-R200's machinability is poor (22/100, worse than 94% of copper alloy grades); weldability good (60/100); formability excellent (97/100).
Common Calculations5
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with CuAg0.07(OF)-R200
Is CuAg0.07(OF) easy to machine?
Gummy and stringy like pure copper (≈20 % of AISI 1212) — use sharp positive-rake polished tools, high speed, generous feed and flood coolant; cold-worked tempers (R250/R290) chip much better than annealed.
Can CuAg0.07(OF) be welded?
Excellent for GTAW/EBW/laser and resistance welding with no hydrogen embrittlement risk, but the 390 W/m·K conductivity demands high heat input and 200–400 °C preheat on thick sections; the weld/HAZ reverts to annealed strength.
Can CuAg0.07(OF) be formed, bent or molded?
Outstanding cold formability in R200 — deep drawing, heading, bending to 0T; anneal at 400–600 °C between severe steps, and expect a higher recrystallisation temperature than Cu-ETP because of the silver.
What surface finishes work on CuAg0.07(OF)?
Solders and brazes readily with mild fluxes; electroplate Ni/Ag/Sn for contacts, or passivate/lacquer bright-polished parts since bare copper tarnishes quickly in air.
CuAg0.07(OF) chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Agsilver raises softening/recrystallisation temperature ~100 °C | 0.06 – 0.08 | 0.07 |
| Ooxygen-free, ≤10 ppm | ≤ 0 | 5×10⁻⁴ |
| Pkept low to protect conductivity | ≤ 3×10⁻⁴ | — |
| Bi | ≤ 5×10⁻⁴ | — |
| Pb | ≤ 5×10⁻⁴ | — |
| S | ≤ 0 | — |
| CuCu + Ag ≥ 99.95 %, from Cu-CATH-1 grade cathode | ≥ 99.95 (balance) | — |
CuAg0.07(OF)-R200 — frequently asked
What is CuAg0.07(OF)-R200 used for?
CuAg0.07(OF)-R200 is typically used for vacuum electronic components, high-reliability brazed conductors and aerospace electrical parts. In short: oxygen-free, hydrogen-embrittlement free; 100.5 % IACS rod grade; higher recrystallisation than Cu-ETP.
What is the yield strength of CuAg0.07(OF)-R200?
CuAg0.07(OF)-R200 has a typical yield strength of 70 MPa (10.2 ksi) and a tensile strength of 225 MPa (32.6 ksi) — weaker than 93% of copper alloy grades. Strength varies by condition: see the 7 listed tempers.
Is CuAg0.07(OF)-R200 easy to machine?
Not especially — machinability is rated poor (22/100, worse than 94% of copper alloy grades). Gummy and stringy like pure copper (≈20 % of AISI 1212) — use sharp positive-rake polished tools, high speed, generous feed and flood coolant; cold-worked tempers (R250/R290) chip much better than annealed.
Can CuAg0.07(OF)-R200 be welded?
Yes — weldability is rated good (60/100). Excellent for GTAW/EBW/laser and resistance welding with no hydrogen embrittlement risk, but the 390 W/m·K conductivity demands high heat input and 200–400 °C preheat on thick sections; the weld/HAZ reverts to annealed strength.
What surface finishes work on CuAg0.07(OF)-R200?
Solders and brazes readily with mild fluxes; electroplate Ni/Ag/Sn for contacts, or passivate/lacquer bright-polished parts since bare copper tarnishes quickly in air.
Can CuAg0.07(OF)-R200 be formed, bent or molded?
Outstanding cold formability in R200 — deep drawing, heading, bending to 0T; anneal at 400–600 °C between severe steps, and expect a higher recrystallisation temperature than Cu-ETP because of the silver.
What is the maximum service temperature of CuAg0.07(OF)-R200?
CuAg0.07(OF)-R200 is rated for continuous use to about 300°C (572 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between CuAg0.07(OF)-R200 and CuAg0.07(OF)-R360?
R200 is the default condition — choose for maximum ductility, deep drawing, bending and forming, and for maximum conductivity after brazing. R360: heavily drawn wire and fine sections for windings and springs that must resist stress relaxation after soldering. Yield strength is 70 MPa in R200 versus 340 MPa in R360.
Sources
- EN 1977 — Copper and copper alloys: copper drawing stock (wire rod) — CEN (2013)
- EN 13601 — Copper and copper alloys: copper rod, bar and wire for general electrical purposes — CEN (2021)
- ASTM B152/B187 and CDA alloy sheet C10700 (silver-bearing oxygen-free copper) — ASTM / Copper Development Association (2019)
- ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
- ASM Handbook Vol.13B — Corrosion: Materials (copper alloys) — ASM International (2005)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.