Copper Alloy Cu-HCP-O50
Temper
EN CR021A
O50 = light annealed
Choose when tube must still bend readily but needs a little more collapse resistance than fully soft.
Values for the O50 condition
Other Cu-HCP tempers and conditions
Cu-HCP is listed in 12 conditions; see the grade overview at Cu-HCP.
Compare all 12 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
CR021A | Cast bar, cake or billet form of Cu-HCP supplied for remelting or further hot working, not for structural use as-cast. | 60 | 170 | 30 | 40 HB | 98 % IACS |
O60Default Soft annealed | Default stock condition for tube and strip: maximum ductility and conductivity for bending, expanding and brazing. | 70 | 230 | 45 | 42 HB | 98 % IACS |
As hot rolled | Cheapest heavy bar, plate and busbar section straight from hot working; strength between annealed and light drawn. | 90 | 235 | 40 | 45 HB | 98 % IACS |
O50This page Light annealed | Choose when tube must still bend readily but needs a little more collapse resistance than fully soft. | 110 | 245 | 40 | 50 HB | 98 % IACS |
Quarter hard | Light cold-rolled strip for stamped parts needing more spring-back resistance than soft but still deep-bendable. | 195 | 260 | 25 | 60 HB | 97 % IACS |
Light drawn | Light draw for straight tube lengths that must stay reasonably bendable while resisting handling damage. | 205 | 265 | 25 | 60 HB | 97 % IACS |
Drawn, general purpose | The standard hard-temper plumbing / refrigeration tube temper: rigid straight lengths, still brazeable. | 250 | 290 | 18 | 75 HB | 97 % IACS |
Half hard | Common strip temper for electrical contacts, gaskets and roll-formed profiles with moderate bending. | 250 | 295 | 14 | 78 HB | 97 % IACS |
Hard drawn | Maximum drawn strength for pressure tube and straight rod where no further forming is needed. | 310 | 345 | 8 | 90 HB | 97 % IACS |
Full hard | Full hard rolled condition for flat springs, clips and busbar needing stiffness with near-full conductivity. | 310 | 345 | 6 | 95 HB | 97 % IACS |
Spring hard | Heavily cold-rolled spring strip/wire where elastic stiffness matters more than formability. | 350 | 380 | 4 | 100 HB | 96 % IACS |
Extra spring hard | Highest cold-worked strength available in this copper; only simple flat or coiled shapes. | 370 | 400 | 3 | 105 HB | 96 % IACS |
What is Cu-HCP-O50?
Cu-HCP-O50 is Cu-HCP in the O50 temper — choose when tube must still bend readily but needs a little more collapse resistance than fully soft. Cu-HCP-O50 has a yield strength of 110 MPa (16 ksi) and a tensile strength of 245 MPa (35.5 ksi) — weaker than 82% of copper alloy grades. Elongation at break is 40% and the elastic modulus is 117 GPa (17 Msi). Cu-HCP-O50 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F). O60 is the default condition FabDigit quotes; O50 is available on request or by drawing note.
Advantages
- High electrical conductivity — 98 % IACS, better than 94% of copper alloy grades
- Conducts heat well — 385 W/m·K (222.4 BTU/hr·ft·°F), better than 92% of copper alloy grades
- Readily welded — 75/100, better than 89% of copper alloy grades
- Forms and bends easily — 88/100, better than 87% of copper alloy grades
- Ductile — tolerates forming and impact — 40%, better than 84% of copper alloy grades
Limitations
- Difficult to machine — 25/100, worse than 86% of copper alloy grades
- Low strength — 110 MPa (16 ksi), worse than 82% of copper alloy grades
Cu-HCP-O50 properties
Typical room-temperature values for Cu-HCP-O50; 19 are specific to this condition. Other listed values are Cu-HCP reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
Cu-HCP-O50 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).
Mechanical11
Cu-HCP-O50 has a yield strength of 110 MPa (16 ksi) and a tensile strength of 245 MPa (35.5 ksi) — weaker than 82% of copper alloy grades. Elongation at break is 40% and the elastic modulus is 117 GPa (17 Msi).
Thermal6
Cu-HCP-O50 is rated for continuous service to 200°C (392 °F). It conducts heat at 385 W/m·K (222.4 BTU/hr·ft·°F), better than 92% of copper alloy grades. Thermal expansion is 17.6 µm/m·K (9.78 µin/in·°F).
Electrical3
Cu-HCP-O50 conducts electricity at 98 % IACS, better than 94% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (65/100), better than 58% of copper alloy grades.
Sustainability4
Producing a kilogram of Cu-HCP-O50 takes about 55 MJ of energy and emits 3.6 kg of CO₂ — less than 72% of copper alloy grades. Typical recycled content is 30%.
Manufacturability8
Cu-HCP-O50's machinability is poor (25/100, worse than 86% of copper alloy grades); weldability very good (75/100); formability excellent (88/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with Cu-HCP-O50
Is Cu-HCP easy to machine?
Gummy and low-rated (≈20 % of free-cutting brass): use sharp positive-rake tools, high speed, generous coolant, or specify H04/H80 temper to reduce tearing.
Can Cu-HCP be welded?
GTAW/GMAW with high preheat and ERCu/ERCuSi-A filler works well; being oxygen-free it is immune to the hydrogen embrittlement that afflicts ETP copper, but high thermal conductivity demands high heat input.
Can Cu-HCP be formed, bent or molded?
Excellent cold formability in O60 (deep drawing, tube bending, expanding); interanneal at 400–600 °C when heavy reductions cause work hardening.
What surface finishes work on Cu-HCP?
Not anodisable — tin, nickel or silver plate for contacts, or lacquer/clear-coat to prevent tarnish; polishes to a bright finish but oxidises quickly in air.
Cu-HCP chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| PEN Cu-HCP 0.001–0.006 %; ASTM C12000 0.004–0.012 % | 0 – 0.01 | 0.01 |
| BiEN 1652 impurity limit | ≤ 5×10⁻⁴ | — |
| PbEN 1652 impurity limit | ≤ 0.01 | — |
| other impurities (total)excluding Ag and P | ≤ 0.03 | — |
| CuCu + Ag, remainder; oxygen removed by phosphorus deoxidation | ≥ 99.9 (balance) | — |
Cu-HCP-O50 — frequently asked
What is Cu-HCP-O50 used for?
Cu-HCP-O50 is typically used for refrigeration/plumbing tube, welded and brazed copper fittings and general conductor rod. In short: weldable deoxidized copper; 98 % IACS conductivity; excellent cold formability.
What is the yield strength of Cu-HCP-O50?
Cu-HCP-O50 has a typical yield strength of 110 MPa (16 ksi) and a tensile strength of 245 MPa (35.5 ksi) — weaker than 82% of copper alloy grades. Strength varies by condition: see the 12 listed tempers.
Is Cu-HCP-O50 easy to machine?
Not especially — machinability is rated poor (25/100, worse than 86% of copper alloy grades). Gummy and low-rated (≈20 % of free-cutting brass): use sharp positive-rake tools, high speed, generous coolant, or specify H04/H80 temper to reduce tearing.
Can Cu-HCP-O50 be welded?
Yes — weldability is rated very good (75/100). GTAW/GMAW with high preheat and ERCu/ERCuSi-A filler works well; being oxygen-free it is immune to the hydrogen embrittlement that afflicts ETP copper, but high thermal conductivity demands high heat input.
What surface finishes work on Cu-HCP-O50?
Not anodisable — tin, nickel or silver plate for contacts, or lacquer/clear-coat to prevent tarnish; polishes to a bright finish but oxidises quickly in air.
Can Cu-HCP-O50 be formed, bent or molded?
Excellent cold formability in O60 (deep drawing, tube bending, expanding); interanneal at 400–600 °C when heavy reductions cause work hardening.
What is the maximum service temperature of Cu-HCP-O50?
Cu-HCP-O50 is rated for continuous use to about 200°C (392 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between Cu-HCP-O60 and Cu-HCP-H10?
O60 is the default condition — default stock condition for tube and strip: maximum ductility and conductivity for bending, expanding and brazing. H10: highest cold-worked strength available in this copper; only simple flat or coiled shapes. Yield strength is 70 MPa in O60 versus 370 MPa in H10.
Sources
- EN 1652 / EN 1976 — wrought and cast copper, designation Cu-HCP (CW021A / CR021A) — CEN (1998)
- ASTM B75/B75M — Seamless Copper Tube (C12000) — ASTM International (2020)
- ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM International (2019)
- CDA alloy datasheet C12000 (DLP copper) — Copper Development Association / copper.org (2023)
- ASM Handbook Vol. 2 — Properties of Nonferrous Alloys, Copper and Copper Alloys — ASM International (1990)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.