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Copper Alloy Cu-FRTP-H01

Supply condition

EN CR006A

H01 = quarter hard

Light draw/roll for parts that still need bending but a bit more stiffness than soft copper.

High cost $$$$

Values for the H01 condition

Other Cu-FRTP tempers and conditions

Cu-FRTP is listed in 6 conditions; see the grade overview at Cu-FRTP.

Compare all 6 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Soft annealed
Pick for maximum ductility and conductivity: flexible wire, gaskets, formed/bent parts and rivets.702254545 HB98 % IACS
As hot rolled
Hot-rolled redraw rod and wire bar as it leaves the rolling mill; the feedstock for drawing.752204248 HB97 % IACS
H01This page
Quarter hard
Light draw/roll for parts that still need bending but a bit more stiffness than soft copper.2002652570 HB97 % IACS
Half hard
The usual compromise temper for bus bars, terminals and machined fittings needing moderate strength.2503001485 HB96.5 % IACS
H04Default
Full hard
Standard stock condition for drawn rod, bar and overhead/hard-drawn wire — best strength-to-conductivity balance.3053458100 HB96 % IACS
Spring hard
Maximum cold-work strength for fine wire, springs and brush wire where ductility is not needed.3604003112 HB95.5 % IACS

What is Cu-FRTP-H01?

Cu-FRTP-H01 is Cu-FRTP supplied in the H01 condition — light draw/roll for parts that still need bending but a bit more stiffness than soft copper. Cu-FRTP-H01 has a yield strength of 200 MPa (29 ksi) and a tensile strength of 265 MPa (38.4 ksi) — weaker than 54% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 122 GPa (17.7 Msi). Cu-FRTP-H01 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F). H04 is the default condition FabDigit quotes; H01 is available on request or by drawing note.

Advantages

  • High electrical conductivity — 97 % IACS, better than 92% of copper alloy grades
  • Conducts heat well — 380 W/m·K (219.6 BTU/hr·ft·°F), better than 91% of copper alloy grades
  • Forms and bends easily — 75/100, better than 82% of copper alloy grades

Limitations

  • Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades

Cu-FRTP-H01 properties

Typical room-temperature values for Cu-FRTP-H01; 10 are specific to this condition. Other listed values are Cu-FRTP reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

Cu-FRTP-H01 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).

Density8.94 g/cm³0.32 lb/in³
Melting Point (Solidus)1,065°C1,949 °F
Liquidus Temperature1,083°C1,981 °F

Mechanical13

Cu-FRTP-H01 has a yield strength of 200 MPa (29 ksi) and a tensile strength of 265 MPa (38.4 ksi) — weaker than 54% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 122 GPa (17.7 Msi).

Elastic (Young's) Modulus122 GPa17.7 Msi
Shear Modulus45 GPa6.5 Msi
Bulk Modulus140 GPa20.3 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)265 MPa38.4 ksi
Yield Strength (0.2% offset)200 MPa29 ksi
Elongation at Break25%
Reduction in Area55%
Shear Strength200 MPa29 ksi
Fatigue Strength (Endurance Limit)90 MPa13.1 ksi
Hardness, Brinell70 HB
Hardness, Rockwell B32 HRB
Hardness, Vickers75 HV

Thermal6

Cu-FRTP-H01 is rated for continuous service to 150°C (302 °F). It conducts heat at 380 W/m·K (219.6 BTU/hr·ft·°F), better than 91% of copper alloy grades. Thermal expansion is 17 µm/m·K (9.44 µin/in·°F).

Thermal Conductivity380 W/m·K220 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17 µm/m·K9.4 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)150°C302 °F
Min Service Temperature-200°C-328 °F

Electrical3

Cu-FRTP-H01 conducts electricity at 97 % IACS, better than 92% of copper alloy grades.

Electrical Conductivity97 % IACS
Electrical Resistivity1.8×10⁻⁸ Ω·m0.709 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (65/100), better than 58% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.25 V
Corrosion ResistanceGood65/100
Chemical Resistance SummaryGood in fresh and salt water, non-oxidising acids and most organics; attacked by oxidising acids (nitric), ammonia/amines (stress-corrosion), sulphur compounds and strong oxidisers; embrittled by hydrogen above ~400 °C because of its oxygen content.

Sustainability4

Producing a kilogram of Cu-FRTP-H01 takes about 57 MJ of energy and emits 3.8 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 70%.

Embodied Energy (primary production)57 MJ/kg24,506 BTU/lb
Embodied Carbon (primary production)3.8 kg CO₂/kg
Embodied Water260 L/kg31.2 gal/lb
Typical Recycled Content70%

Manufacturability8

Cu-FRTP-H01's machinability is poor (28/100, worse than 78% of copper alloy grades); weldability fair (35/100); formability very good (75/100).

MachinabilityPoor28/100
Machinability Rating (AISI 1212 = 100 %)22%
WeldabilityFair35/100
Formability (cold)Very good75/100
CastabilityGood60/100
Brazeability / SolderabilityExcellent90/100
PolishabilityVery good80/100
Anodizing Responsen/a — copper is not anodised; use tin, nickel or silver plating, or a clear lacquer to stop tarnish

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with Cu-FRTP-H01

Is Cu-FRTP easy to machine?

Gummy and stringy — use sharp, high-rake, polished tools, high speed with generous coolant; hard-drawn temper machines better than annealed, but choose C14500/C14700 or leaded brass for screw-machine work.

Can Cu-FRTP be welded?

Weldable by TIG/MIG with high heat input and preheat, but the oxygen content causes hydrogen embrittlement and porosity — prefer brazing/soldering or use Cu-DHP/OF grades for welded assemblies.

Can Cu-FRTP be formed, bent or molded?

Excellent cold formability in the O60 temper (deep drawing, bending, riveting); anneal at 400–600 °C between heavy draws and avoid reducing-atmosphere furnaces.

What surface finishes work on Cu-FRTP?

Solders and brazes readily; tin, nickel or silver plating and clear lacquer are used to prevent tarnish — anodising does not apply.

Cu-FRTP chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Opresent as Cu2O; not a specified maximum but typical of tough-pitch copper0.02 – 0.060.04
Agcounted with Cu≤ 0.050.02
Bi≤ 0—
Pb≤ 0.01—
other impurities (total)As, Sb, Sn, Ni, Fe, S etc.; higher tolerance than Cu-ETP/Cu-FRHC≤ 0.15—
CuCu + Ag, oxygen-bearing (tough pitch); EN 1976 Cu-FRTP≥ 99.85 (balance)—

Cu-FRTP-H01 — frequently asked

What is Cu-FRTP-H01 used for?

Cu-FRTP-H01 is typically used for general electrical conductors, plumbing tube stock and roofing sheet. In short: commercial tough-pitch copper; 96 % IACS conductor stock; hard temper, low ductility.

What is the yield strength of Cu-FRTP-H01?

Cu-FRTP-H01 has a typical yield strength of 200 MPa (29 ksi) and a tensile strength of 265 MPa (38.4 ksi) — weaker than 54% of copper alloy grades. Strength varies by condition: see the 6 listed tempers.

Is Cu-FRTP-H01 easy to machine?

Not especially — machinability is rated poor (28/100, worse than 78% of copper alloy grades). Gummy and stringy — use sharp, high-rake, polished tools, high speed with generous coolant; hard-drawn temper machines better than annealed, but choose C14500/C14700 or leaded brass for screw-machine work.

Can Cu-FRTP-H01 be welded?

With care — weldability is rated fair (35/100). Weldable by TIG/MIG with high heat input and preheat, but the oxygen content causes hydrogen embrittlement and porosity — prefer brazing/soldering or use Cu-DHP/OF grades for welded assemblies.

What surface finishes work on Cu-FRTP-H01?

Solders and brazes readily; tin, nickel or silver plating and clear lacquer are used to prevent tarnish — anodising does not apply.

Can Cu-FRTP-H01 be formed, bent or molded?

Excellent cold formability in the O60 temper (deep drawing, bending, riveting); anneal at 400–600 °C between heavy draws and avoid reducing-atmosphere furnaces.

What is the maximum service temperature of Cu-FRTP-H01?

Cu-FRTP-H01 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between Cu-FRTP-H04 and Cu-FRTP-O60?

H04 is the default condition — standard stock condition for drawn rod, bar and overhead/hard-drawn wire — best strength-to-conductivity balance. O60: pick for maximum ductility and conductivity: flexible wire, gaskets, formed/bent parts and rivets. Yield strength is 305 MPa in H04 versus 70 MPa in O60.

Sources

  1. EN 1976 — Cast unwrought copper products (Cu-FRTP) — CEN (2012)
  2. EN 13601 — Copper rod, bar and wire for general electrical purposes — CEN (2021)
  3. ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  4. Copper alloy datasheets (tough-pitch copper) — Copper Development Association (2023)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.