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Copper Alloy C12900-H02

Supply condition

UNS C12900

H02 = half hard

General-purpose semi-rigid temper for bus bar, gaskets and formed conductive hardware.

High cost $$$$

Values for the H02 condition

Other C12900 tempers and conditions

C12900 is listed in 11 conditions; see the grade overview at C12900.

Compare all 11 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Annealed to 0.050 mm grain size
Softest commercial anneal — pick for deep drawing, severe forming and maximum conductivity.692214542 HB101 % IACS
As hot extruded
As-extruded bar, rod, bus bar and commutator sections before any drawing or annealing.692205042 HB100 % IACS
Annealed to 0.025 mm grain size
Fine-grain anneal — forming with better surface finish (less orange peel) than OS050.762354248 HB100 % IACS
As hot rolled
Mill temper for hot-rolled plate and bus plate where soft, formable copper is acceptable.762284545 HB100 % IACS
1/8 hard
Slight stiffening while keeping most forming ductility — good for lightly formed conductive parts.1902503060 HB100 % IACS
Quarter hard
Balanced temper for moderate bending with useful spring-back resistance.2052622570 HB99 % IACS
H02This page
Half hard
General-purpose semi-rigid temper for bus bar, gaskets and formed conductive hardware.2302761480 HB98 % IACS
H04Default
Full hard
Standard stocked hard temper for bus bar, commutator segments and hard-drawn conductor parts.280315695 HB98 % IACS
Extra hard
Between full hard and spring; used where extra stiffness is needed without spring-temper flatness.2953305100 HB97 % IACS
Spring hard
Spring-hard strip for contacts, clips and gaskets that must resist set at slightly elevated temperature.3103454105 HB97 % IACS
Extra spring hard
Maximum cold-worked strength for thin strip springs; essentially no further forming possible.3253654110 HB97 % IACS

What is C12900-H02?

C12900-H02 is C12900 supplied in the H02 condition — general-purpose semi-rigid temper for bus bar, gaskets and formed conductive hardware. C12900-H02 has a yield strength of 230 MPa (33.4 ksi) and a tensile strength of 276 MPa (40 ksi) — stronger than 51% of copper alloy grades. Elongation at break is 14% and the elastic modulus is 120 GPa (17.4 Msi). C12900-H02 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F). H04 is the default condition FabDigit quotes; H02 is available on request or by drawing note.

Advantages

  • Conducts heat well — 387 W/m·K (223.6 BTU/hr·ft·°F), better than 94% of copper alloy grades
  • High electrical conductivity — 98 % IACS, better than 94% of copper alloy grades

Limitations

  • Difficult to machine — 22/100, worse than 94% of copper alloy grades

C12900-H02 properties

Typical room-temperature values for C12900-H02; 15 are specific to this condition. Other listed values are C12900 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C12900-H02 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).

Density8.94 g/cm³0.32 lb/in³
Melting Point (Solidus)1,065°C1,949 °F
Liquidus Temperature1,083°C1,981 °F

Mechanical13

C12900-H02 has a yield strength of 230 MPa (33.4 ksi) and a tensile strength of 276 MPa (40 ksi) — stronger than 51% of copper alloy grades. Elongation at break is 14% and the elastic modulus is 120 GPa (17.4 Msi).

Elastic (Young's) Modulus120 GPa17.4 Msi
Shear Modulus45 GPa6.5 Msi
Bulk Modulus140 GPa20.3 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)276 MPa40 ksi
Yield Strength (0.2% offset)230 MPa33.4 ksi
Elongation at Break14%
Reduction in Area62%
Shear Strength186 MPa27 ksi
Fatigue Strength (Endurance Limit)105 MPa15.2 ksi
Hardness, Brinell80 HB
Hardness, Rockwell B40 HRB
Hardness, Vickers90 HV

Thermal6

C12900-H02 is rated for continuous service to 200°C (392 °F). It conducts heat at 387 W/m·K (223.6 BTU/hr·ft·°F), better than 94% of copper alloy grades. Thermal expansion is 17 µm/m·K (9.44 µin/in·°F).

Thermal Conductivity387 W/m·K224 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17 µm/m·K9.4 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)200°C392 °F
Min Service Temperature-200°C-328 °F

Electrical3

C12900-H02 conducts electricity at 98 % IACS, better than 94% of copper alloy grades.

Electrical Conductivity98 % IACS
Electrical Resistivity1.76×10⁻⁸ Ω·m0.693 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (60/100), worse than 68% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.25 V
Corrosion ResistanceGood60/100
Chemical Resistance SummaryGood in atmosphere, fresh and potable water, non-oxidising acids and most organics; attacked by ammonia/amines (stress-corrosion), oxidising acids (nitric, hot concentrated sulfuric), sulfides, mercury and high-velocity aerated seawater.

Sustainability4

Producing a kilogram of C12900-H02 takes about 57 MJ of energy and emits 3.9 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 50%.

Embodied Energy (primary production)57 MJ/kg24,506 BTU/lb
Embodied Carbon (primary production)3.9 kg CO₂/kg
Embodied Water270 L/kg32.4 gal/lb
Typical Recycled Content50%

Manufacturability8

C12900-H02's machinability is poor (22/100, worse than 94% of copper alloy grades); weldability fair (40/100); formability good (55/100).

MachinabilityPoor22/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityFair40/100
Formability (cold)Good55/100
CastabilityFair45/100
Brazeability / SolderabilityExcellent90/100
PolishabilityVery good80/100
Anodizing Responsen/a — copper is not anodised; use tin, nickel or silver plating, or clear lacquer to control tarnish.

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C12900-H02

Is C12900 easy to machine?

Gummy and stringy (rating ≈20 % of free-cutting brass) — use sharp positive-rake carbide, high speed, generous soluble-oil coolant; hard tempers cut cleaner than annealed.

Can C12900 be welded?

Oxygen-bearing tough pitch copper: use GTAW/GMAW with low heat input or resistance welding; avoid oxyacetylene and any hydrogen-containing atmosphere above ~370 °C to prevent hydrogen embrittlement.

Can C12900 be formed, bent or molded?

Excellent cold formability in OS tempers (deep draw, roll form, bend to 0T); hard and spring tempers need generous bend radii and interstage anneals at 375–650 °C.

What surface finishes work on C12900?

Solders and brazes readily; can be tin-, nickel- or silver-plated, mechanically polished to bright lustre, or lacquered/patinated — tarnishes in air if left bare.

C12900 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Ag≈16 troy oz per short ton silver minimum — the defining addition of C12900≥ 0.050.06
Otough pitch oxygen, typically 0.02–0.05 % as Cu2O; not a specification limit≈ 0.030.03
CuCu + Ag combined, minimum per ASTM B5 / CDA registration for fire-refined tough pitch copper≥ 99.88 (balance)—

C12900-H02 — frequently asked

What is C12900-H02 used for?

C12900-H02 is typically used for commutator bars and segments, general electrical hardware, busbar and connector stock, brazed electrical assemblies, motor and generator components and formed terminals and lugs. In short: silver-bearing softening resistance; 98 % IACS conductivity; 200 °C service copper.

What is the yield strength of C12900-H02?

C12900-H02 has a typical yield strength of 230 MPa (33.4 ksi) and a tensile strength of 276 MPa (40 ksi) — stronger than 51% of copper alloy grades. Strength varies by condition: see the 11 listed tempers.

Is C12900-H02 easy to machine?

Not especially — machinability is rated poor (22/100, worse than 94% of copper alloy grades). Gummy and stringy (rating ≈20 % of free-cutting brass) — use sharp positive-rake carbide, high speed, generous soluble-oil coolant; hard tempers cut cleaner than annealed.

Can C12900-H02 be welded?

With care — weldability is rated fair (40/100). Oxygen-bearing tough pitch copper: use GTAW/GMAW with low heat input or resistance welding; avoid oxyacetylene and any hydrogen-containing atmosphere above ~370 °C to prevent hydrogen embrittlement.

What surface finishes work on C12900-H02?

Solders and brazes readily; can be tin-, nickel- or silver-plated, mechanically polished to bright lustre, or lacquered/patinated — tarnishes in air if left bare.

Can C12900-H02 be formed, bent or molded?

Excellent cold formability in OS tempers (deep draw, roll form, bend to 0T); hard and spring tempers need generous bend radii and interstage anneals at 375–650 °C.

What is the maximum service temperature of C12900-H02?

C12900-H02 is rated for continuous use to about 200°C (392 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C12900-H04 and C12900-OS050?

H04 is the default condition — standard stocked hard temper for bus bar, commutator segments and hard-drawn conductor parts. OS050: softest commercial anneal — pick for deep drawing, severe forming and maximum conductivity. Yield strength is 280 MPa in H04 versus 69 MPa in OS050.

Sources

  1. ASTM B5 — Electrolytic Tough Pitch / fire-refined copper refinery shapes — ASTM International (2021)
  2. CDA Alloy Database — C12900 fire-refined tough pitch copper with silver — Copper Development Association (2023)
  3. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  4. ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM International (2019)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.