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Copper Alloy C12500-H08

Supply condition

UNS C12500

H08 = spring hard

Spring-rolled strip for gaskets, shim and low-stress spring contacts.

High cost $$$$

Values for the H08 condition

Other C12500 tempers and conditions

C12500 is listed in 12 conditions; see the grade overview at C12500.

Compare all 12 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Annealed to 0.050 mm grain size
Soft, coarse-grain anneal for deep drawing and severe forming.692204542 HB100 % IACS
As hot extruded
Standard as-extruded condition for bus bar, forging stock and machined fittings.702155042 HB99 % IACS
Annealed to 0.025 mm grain size
Fine-grain soft temper — better surface finish after forming than OS050.762354545 HB100 % IACS
As hot rolled
Cheapest mill condition for heavy plate and roofing sheet where temper control is not critical.852354548 HB99 % IACS
1/8 hard
Slight stiffening while keeping near-soft formability; good for roll-formed profiles.1702503062 HB98 % IACS
Quarter hard
Balanced temper for bent brackets, gutters and moderately formed parts.2052652570 HB98 % IACS
Half hard
Most common cold-worked sheet/strip temper — usable strength with some bendability.2502901482 HB97 % IACS
Three-quarter hard
Stiffer flat product for gaskets, washers and lightly formed hardware.2753151089 HB97 % IACS
H04Default
Full hard
Default stocked temper for bar, bus bar and hard sheet where strength and straightness matter.310345695 HB97 % IACS
Extra hard
Higher cold reduction for flat springs, contacts and stiff strip; very limited bending.3403654100 HB97 % IACS
H08This page
Spring hard
Spring-rolled strip for gaskets, shim and low-stress spring contacts.3503804105 HB96 % IACS
Extra spring hard
Maximum cold-worked strength available in thin strip/wire; essentially no formability.3653953110 HB96 % IACS

What is C12500-H08?

C12500-H08 is C12500 supplied in the H08 condition — spring-rolled strip for gaskets, shim and low-stress spring contacts. C12500-H08 has a yield strength of 350 MPa (50.8 ksi) and a tensile strength of 380 MPa (55.1 ksi) — stronger than 74% of copper alloy grades. Elongation at break is 4% and the elastic modulus is 117 GPa (17 Msi). C12500-H08 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F). H04 is the default condition FabDigit quotes; H08 is available on request or by drawing note.

Advantages

  • Conducts heat well — 382 W/m·K (220.7 BTU/hr·ft·°F), better than 91% of copper alloy grades
  • High electrical conductivity — 96 % IACS, better than 91% of copper alloy grades
  • Low embodied carbon — 3.3 kg CO₂/kg, better than 90% of copper alloy grades

Limitations

  • Limited service temperature — 130°C (266 °F), worse than 100% of copper alloy grades
  • Limited ductility — 4%, worse than 96% of copper alloy grades
  • Difficult to machine — 23/100, worse than 91% of copper alloy grades

C12500-H08 properties

Typical room-temperature values for C12500-H08; 13 are specific to this condition. Other listed values are C12500 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C12500-H08 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).

Density8.94 g/cm³0.32 lb/in³
Melting Point (Solidus)1,065°C1,949 °F
Liquidus Temperature1,083°C1,981 °F

Mechanical12

C12500-H08 has a yield strength of 350 MPa (50.8 ksi) and a tensile strength of 380 MPa (55.1 ksi) — stronger than 74% of copper alloy grades. Elongation at break is 4% and the elastic modulus is 117 GPa (17 Msi).

Elastic (Young's) Modulus117 GPa17 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus140 GPa20.3 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)380 MPa55.1 ksi
Yield Strength (0.2% offset)350 MPa50.8 ksi
Elongation at Break4%
Reduction in Area55%
Shear Strength220 MPa31.9 ksi
Fatigue Strength (Endurance Limit)120 MPa17.4 ksi
Hardness, Brinell105 HB
Hardness, Rockwell B55 HRB

Thermal6

C12500-H08 is rated for continuous service to 130°C (266 °F). It conducts heat at 382 W/m·K (220.7 BTU/hr·ft·°F), better than 91% of copper alloy grades. Thermal expansion is 17.7 µm/m·K (9.83 µin/in·°F).

Thermal Conductivity382 W/m·K221 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.7 µm/m·K9.8 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)130°C266 °F
Min Service Temperature-250°C-418 °F

Electrical3

C12500-H08 conducts electricity at 96 % IACS, better than 91% of copper alloy grades.

Electrical Conductivity96 % IACS
Electrical Resistivity1.8×10⁻⁸ Ω·m0.709 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (68/100), better than 69% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.2 V
Corrosion ResistanceGood68/100
Chemical Resistance SummaryExcellent in fresh/sea water, neutral salts and non-oxidising acids; attacked by nitric acid, ammonia/amines, sulphur compounds and oxidising media; hydrogen-embrittles above ~400 °C in reducing atmospheres.

Sustainability4

Producing a kilogram of C12500-H08 takes about 53 MJ of energy and emits 3.3 kg of CO₂ — less than 85% of copper alloy grades. Typical recycled content is 45%.

Embodied Energy (primary production)53 MJ/kg22,786 BTU/lb
Embodied Carbon (primary production)3.3 kg CO₂/kg
Embodied Water300 L/kg35.9 gal/lb
Typical Recycled Content45%

Manufacturability8

C12500-H08's machinability is poor (23/100, worse than 91% of copper alloy grades); weldability fair (35/100); formability poor (20/100).

MachinabilityPoor23/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityFair35/100
Formability (cold)Poor20/100
CastabilityFair45/100
Brazeability / SolderabilityExcellent92/100
PolishabilityVery good80/100
Anodizing Responsen/a — copper is not anodised; use chemical patination, tin/nickel plating or clear lacquer

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C12500-H08

Is C12500 easy to machine?

Gummy and low-rated (~20 % of free-cutting brass): use sharp positive-rake tools, high speed, generous coolant, or switch to C14500/C36000 for screw-machine work.

Can C12500 be welded?

Oxygen-bearing copper — prefer brazing/soldering or friction/resistance joining; GTAW/GMAW is possible with deoxidised filler (ERCu) but risks hydrogen embrittlement and porosity, and heating above 400 °C in reducing atmospheres must be avoided.

Can C12500 be formed, bent or molded?

Excellent cold formability in OS tempers (deep draw, spin, roll-form); interanneal at 400–600 °C when total cold reduction exceeds ~50 %.

What surface finishes work on C12500?

Not anodisable; takes bright polishing, chemical patina/oxidation blackening, tin, nickel or silver plating, and clear lacquer to slow natural tarnish.

C12500 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance.

ElementSpec limit (wt %)
Ooxygen present as Cu2O (tough pitch); typically 0.02–0.05 %, not a specified limit≈ 0.04
Sb≤ 0.01
As≤ 0.01
Bi≤ 0
Fe≤ 0.01
Pb≤ 0.01
Ni≤ 0.05
Se≤ 0
S≤ 0
Sn≤ 0.05
Te≤ 0.03
Zn≤ 0.05
CuCu + Ag, fire-refined tough pitch≥ 99.88 (balance)

C12500-H08 — frequently asked

What is C12500-H08 used for?

C12500-H08 is typically used for builder's hardware, general sheet and wire products and roofing. In short: low-cost general-purpose copper; 97 % IACS without ETP purity; excellent cold formability.

What is the yield strength of C12500-H08?

C12500-H08 has a typical yield strength of 350 MPa (50.8 ksi) and a tensile strength of 380 MPa (55.1 ksi) — stronger than 74% of copper alloy grades. Strength varies by condition: see the 12 listed tempers.

Is C12500-H08 easy to machine?

Not especially — machinability is rated poor (23/100, worse than 91% of copper alloy grades). Gummy and low-rated (~20 % of free-cutting brass): use sharp positive-rake tools, high speed, generous coolant, or switch to C14500/C36000 for screw-machine work.

Can C12500-H08 be welded?

With care — weldability is rated fair (35/100). Oxygen-bearing copper — prefer brazing/soldering or friction/resistance joining; GTAW/GMAW is possible with deoxidised filler (ERCu) but risks hydrogen embrittlement and porosity, and heating above 400 °C in reducing atmospheres must be avoided.

What surface finishes work on C12500-H08?

Not anodisable; takes bright polishing, chemical patina/oxidation blackening, tin, nickel or silver plating, and clear lacquer to slow natural tarnish.

Can C12500-H08 be formed, bent or molded?

Excellent cold formability in OS tempers (deep draw, spin, roll-form); interanneal at 400–600 °C when total cold reduction exceeds ~50 %.

What is the maximum service temperature of C12500-H08?

C12500-H08 is rated for continuous use to about 130°C (266 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C12500-H04 and C12500-OS050?

H04 is the default condition — default stocked temper for bar, bus bar and hard sheet where strength and straightness matter. OS050: soft, coarse-grain anneal for deep drawing and severe forming. Yield strength is 310 MPa in H04 versus 69 MPa in OS050.

Sources

  1. ASTM B5 — Electrolytic Tough Pitch / Fire-Refined Copper Refinery Shapes — ASTM International (2021)
  2. ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM International (2019)
  3. CDA Alloy Datasheet C12500 (Fire-Refined Tough Pitch Copper) — Copper Development Association (2023)
  4. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.