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Copper Alloy C11600-H01

Supply condition

UNS C11600 · EN CW013A

H01 = quarter hard

Good compromise for formed contacts and gaskets that still need 90° bends.

High cost $$$$

Values for the H01 condition

Other C11600 tempers and conditions

C11600 is listed in 11 conditions; see the grade overview at C11600.

Compare all 11 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Hot rolled and annealed
Pick for maximum ductility and deep forming/spinning where strength is not required.762214545 HB100 % IACS
Soft annealed
Standard soft strip/wire temper for stamping, riveting and coil winding.802254247 HB100 % IACS
As hot rolled
Cheapest heavy plate/bar condition when only moderate strength and full conductivity are needed.902354048 HB100 % IACS
1/8 hard
Slight stiffening over annealed while keeping near-full bend ductility.1702503060 HB99 % IACS
H01This page
Quarter hard
Good compromise for formed contacts and gaskets that still need 90° bends.2052622570 HB98 % IACS
H02Default
Half hard
Most stocked strip/bar temper: useful strength retained after soldering plus workable formability.2502901480 HB98 % IACS
Three-quarter hard
Higher strength for lightly formed conductive parts and commutator segments.2753151088 HB97 % IACS
Full hard
Standard hard temper for busbar, commutator strip and connectors that see soldering heat.310345695 HB97 % IACS
Extra hard
For flat parts needing stiffness with only minor forming after rolling.3303655100 HB97 % IACS
Spring hard
Spring strip for conductive contacts and shielding clips retaining temper after soldering.3453794105 HB96 % IACS
Extra spring hard
Maximum cold-worked strength/stiffness for thin conductive springs; essentially no formability left.3603933110 HB96 % IACS

What is C11600-H01?

C11600-H01 is C11600 supplied in the H01 condition — good compromise for formed contacts and gaskets that still need 90° bends. C11600-H01 has a yield strength of 205 MPa (29.7 ksi) and a tensile strength of 262 MPa (38 ksi) — weaker than 53% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 117 GPa (17 Msi). C11600-H01 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F). H02 is the default condition FabDigit quotes; H01 is available on request or by drawing note.

Advantages

  • High electrical conductivity — 98 % IACS, better than 94% of copper alloy grades
  • Conducts heat well — 386 W/m·K (223 BTU/hr·ft·°F), better than 93% of copper alloy grades
  • Forms and bends easily — 75/100, better than 82% of copper alloy grades

Limitations

  • Difficult to machine — 25/100, worse than 86% of copper alloy grades

C11600-H01 properties

Typical room-temperature values for C11600-H01; 12 are specific to this condition. Other listed values are C11600 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C11600-H01 has a density of 8.94 g/cm³ (0.323 lb/in³), heavier than 90% of copper alloy grades. It melts at 1,065°C (1,949 °F).

Density8.94 g/cm³0.32 lb/in³
Melting Point (Solidus)1,065°C1,949 °F
Liquidus Temperature1,083°C1,981 °F

Mechanical13

C11600-H01 has a yield strength of 205 MPa (29.7 ksi) and a tensile strength of 262 MPa (38 ksi) — weaker than 53% of copper alloy grades. Elongation at break is 25% and the elastic modulus is 117 GPa (17 Msi).

Elastic (Young's) Modulus117 GPa17 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus140 GPa20.3 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)262 MPa38 ksi
Yield Strength (0.2% offset)205 MPa29.7 ksi
Elongation at Break25%
Reduction in Area60%
Shear Strength175 MPa25.4 ksi
Fatigue Strength (Endurance Limit)100 MPa14.5 ksi
Hardness, Brinell70 HB
Hardness, Rockwell B32 HRB
Hardness, Vickers90 HV

Thermal6

C11600-H01 is rated for continuous service to 250°C (482 °F). It conducts heat at 386 W/m·K (223 BTU/hr·ft·°F), better than 93% of copper alloy grades. Thermal expansion is 17.7 µm/m·K (9.83 µin/in·°F).

Thermal Conductivity386 W/m·K223 BTU/hr·ft·°F
Specific Heat Capacity385 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)17.7 µm/m·K9.8 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)250°C482 °F
Min Service Temperature-200°C-328 °F

Electrical3

C11600-H01 conducts electricity at 98 % IACS, better than 94% of copper alloy grades.

Electrical Conductivity98 % IACS
Electrical Resistivity1.75×10⁻⁸ Ω·m0.689 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (58/100), worse than 76% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.2 V
Corrosion ResistanceGood58/100
Chemical Resistance SummaryGood in fresh/sea water, neutral soils and non-oxidising acids; attacked by ammonia and amines (stress corrosion), oxidising acids, sulphides and mercury compounds.

Sustainability4

Producing a kilogram of C11600-H01 takes about 57 MJ of energy and emits 3.8 kg of CO₂ — less than 52% of copper alloy grades. Typical recycled content is 30%.

Embodied Energy (primary production)57 MJ/kg24,506 BTU/lb
Embodied Carbon (primary production)3.8 kg CO₂/kg
Embodied Water260 L/kg31.2 gal/lb
Typical Recycled Content30%

Manufacturability7

C11600-H01's machinability is poor (25/100, worse than 86% of copper alloy grades); weldability fair (35/100); formability very good (75/100).

MachinabilityPoor25/100
Machinability Rating (AISI 1212 = 100 %)20%
WeldabilityFair35/100
Formability (cold)Very good75/100
Brazeability / SolderabilityExcellent92/100
PolishabilityVery good80/100
Anodizing Responsen/a — copper is not anodised; use Ni/Sn/Ag plating, tin-lead coating or chemical patina/lacquer

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C11600-H01

Is C11600 easy to machine?

Gummy and low-rated (≈20 % of AISI 1212): use sharp positive-rake tools, high speed, low feed and generous coolant; hard tempers cut cleaner than annealed.

Can C11600 be welded?

Oxygen-bearing copper — avoid processes/atmospheres with hydrogen (risk of hydrogen embrittlement); prefer resistance welding, brazing or soldering, or switch to C10100/C10200 for fusion welding.

Can C11600 be formed, bent or molded?

Excellent cold formability in O25/O60 and H00–H02; hard tempers need generous bend radii or interstage annealing (300–500 °C), and silver delays softening so recovery anneals run hotter than for ETP.

What surface finishes work on C11600?

Solders and brazes readily; accepts Ni, Sn, Ag and Au plating; can be mechanically polished or chemically patinated/lacquered — copper cannot be anodised.

C11600 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Ag≥25 troy oz/short ton; raises softening/recrystallisation temperature≥ 0.090.09
Otough pitch oxygen, present as Cu2O0.02 – 0.050.04
CuCu + Ag ≥ 99.90 % (oxygen excluded per ASTM convention)≥ 99.9 (balance)—

C11600-H01 — frequently asked

What is C11600-H01 used for?

C11600-H01 is typically used for commutator segments, electrical contacts and high-temperature conductors. In short: highest softening resistance ETP; silver-bearing contact copper; 250 °C service temperature.

What is the yield strength of C11600-H01?

C11600-H01 has a typical yield strength of 205 MPa (29.7 ksi) and a tensile strength of 262 MPa (38 ksi) — weaker than 53% of copper alloy grades. Strength varies by condition: see the 11 listed tempers.

Is C11600-H01 easy to machine?

Not especially — machinability is rated poor (25/100, worse than 86% of copper alloy grades). Gummy and low-rated (≈20 % of AISI 1212): use sharp positive-rake tools, high speed, low feed and generous coolant; hard tempers cut cleaner than annealed.

Can C11600-H01 be welded?

With care — weldability is rated fair (35/100). Oxygen-bearing copper — avoid processes/atmospheres with hydrogen (risk of hydrogen embrittlement); prefer resistance welding, brazing or soldering, or switch to C10100/C10200 for fusion welding.

What surface finishes work on C11600-H01?

Solders and brazes readily; accepts Ni, Sn, Ag and Au plating; can be mechanically polished or chemically patinated/lacquered — copper cannot be anodised.

Can C11600-H01 be formed, bent or molded?

Excellent cold formability in O25/O60 and H00–H02; hard tempers need generous bend radii or interstage annealing (300–500 °C), and silver delays softening so recovery anneals run hotter than for ETP.

What is the maximum service temperature of C11600-H01?

C11600-H01 is rated for continuous use to about 250°C (482 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C11600-H02 and C11600-O25?

H02 is the default condition — most stocked strip/bar temper: useful strength retained after soldering plus workable formability. O25: pick for maximum ductility and deep forming/spinning where strength is not required. Yield strength is 250 MPa in H02 versus 76 MPa in O25.

Sources

  1. ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM (2019)
  2. ASTM B187/B187M — Copper Bar, Bus Bar, Rod and Shapes — ASTM (2020)
  3. EN 13601 / CW013A copper rod and bar for electrical purposes — CEN (2013)
  4. C11600 Silver-bearing Tough Pitch Copper alloy data — Copper Development Association (copper.org) (2023)
  5. ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.