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Copper Alloy C66100-H01

Supply condition

UNS C66100 · ASTM B98

H01 = quarter hard

Use when a large bending reserve must be kept while strength and surface cutting improve slightly; quarter-hard cold work lifts yield to 205 MPa with 30% elongation still available.

High cost $$$$

Values for the H01 condition

Other C66100 tempers and conditions

C66100 is listed in 5 conditions; see the grade overview at C66100.

Compare all 5 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Soft annealed
Pick when maximum ductility is needed for deep drawing, riveting, bending or later cold forming; the soft annealed temper gives 45% elongation at only 125 MPa yield.1253104565 HB12 % IACS
H01This page
Quarter hard
Use when a large bending reserve must be kept while strength and surface cutting improve slightly; quarter-hard cold work lifts yield to 205 MPa with 30% elongation still available.2053803090 HB12 % IACS
Half hard
General-purpose compromise between strength and formability: half-hard cold work gives 275 MPa yield at 20% elongation, suiting parts with moderate bends plus heavy turning.27545020125 HB12 % IACS
H04Default
Full hard
Most common off-the-shelf condition for rod and wire: full-hard cold work gives 380 MPa yield and good chip breaking for fasteners, valve stems and bushings, but only light bending.38051512150 HB12 % IACS
Extra hard
Choose for spring elements, pins and fine wire that need the highest strength, stiffness and wear resistance with no further forming; heavy cold work leaves just 8% elongation.4805858175 HB12 % IACS

What is C66100-H01?

C66100-H01 is C66100 supplied in the H01 condition — use when a large bending reserve must be kept while strength and surface cutting improve slightly; quarter-hard cold work lifts yield to 205 MPa with 30% elongation still available. C66100-H01 has a yield strength of 205 MPa (29.7 ksi) and a tensile strength of 380 MPa (55.1 ksi) — weaker than 53% of copper alloy grades. Elongation at break is 30% and the elastic modulus is 117 GPa (17 Msi). C66100-H01 has a density of 8.53 g/cm³ (0.308 lb/in³), lighter than 62% of copper alloy grades. It melts at 971°C (1,780 °F). H04 is the default condition FabDigit quotes; H01 is available on request or by drawing note.

Advantages

  • Forms and bends easily — 70/100, better than 80% of copper alloy grades
  • Ductile — tolerates forming and impact — 30%, better than 75% of copper alloy grades

C66100-H01 properties

Typical room-temperature values for C66100-H01; 13 are specific to this condition. Other listed values are C66100 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C66100-H01 has a density of 8.53 g/cm³ (0.308 lb/in³), lighter than 62% of copper alloy grades. It melts at 971°C (1,780 °F).

Density8.53 g/cm³0.31 lb/in³
Melting Point (Solidus)971°C1,780 °F
Liquidus Temperature1,027°C1,881 °F

Mechanical11

C66100-H01 has a yield strength of 205 MPa (29.7 ksi) and a tensile strength of 380 MPa (55.1 ksi) — weaker than 53% of copper alloy grades. Elongation at break is 30% and the elastic modulus is 117 GPa (17 Msi).

Elastic (Young's) Modulus117 GPa17 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus115 GPa16.7 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)380 MPa55.1 ksi
Yield Strength (0.2% offset)205 MPa29.7 ksi
Elongation at Break30%
Shear Strength250 MPa36.3 ksi
Fatigue Strength (Endurance Limit)160 MPa23.2 ksi
Hardness, Brinell90 HB
Hardness, Rockwell B55 HRB

Thermal6

C66100-H01 is rated for continuous service to 200°C (392 °F). It conducts heat at 57 W/m·K (32.9 BTU/hr·ft·°F), worse than 64% of copper alloy grades. Thermal expansion is 18.4 µm/m·K (10.2 µin/in·°F).

Thermal Conductivity57 W/m·K32.9 BTU/hr·ft·°F
Specific Heat Capacity377 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)18.4 µm/m·K10.2 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)200°C392 °F
Min Service Temperature-200°C-328 °F

Electrical3

C66100-H01 conducts electricity at 12 % IACS, worse than 62% of copper alloy grades.

Electrical Conductivity12 % IACS
Electrical Resistivity1.44×10⁻⁷ Ω·m5.67 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is very good (70/100), better than 76% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.26 V
Corrosion ResistanceVery good70/100
Chemical Resistance Summary—

Sustainability4

Producing a kilogram of C66100-H01 takes about 60 MJ of energy and emits 3.6 kg of CO₂ — more than 69% of copper alloy grades. Typical recycled content is 40%.

Embodied Energy (primary production)60 MJ/kg25,795 BTU/lb
Embodied Carbon (primary production)3.6 kg CO₂/kg
Embodied Water320 L/kg38.3 gal/lb
Typical Recycled Content40%

Manufacturability8

C66100-H01's machinability is fair (50/100, better than 69% of copper alloy grades); weldability poor (30/100); formability very good (70/100).

MachinabilityFair50/100
Machinability Rating (AISI 1212 = 100 %)45%
WeldabilityPoor30/100
Formability (cold)Very good70/100
CastabilityFair35/100
Brazeability / SolderabilityVery good75/100
PolishabilityVery good70/100
Anodizing Response—

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C66100-H01

Is C66100 easy to machine?

Lead produces short, broken chips; use sharp positive-rake carbide, high speed with moderate feed and flood emulsion coolant. Machinability is about half that of free-cutting brass, so run larger clearance angles than on brass to prevent smearing.

Can C66100 be welded?

The lead content causes hot cracking in the weld metal and HAZ, so fusion welding is generally not recommended. If unavoidable, use low-heat-input GTAW with ERCuSi-A filler on pre-cleaned surfaces; brazing, soldering or mechanical joining is preferred.

Can C66100 be formed, bent or molded?

O60 and H01 tempers cold bend, rivet and knurl well. In H04/H06 keep bend radii at 2t or greater and allow for work hardening; hot work at about 700–850 °C and anneal at 480–650 °C with water or air cooling.

What surface finishes work on C66100?

Polishes to a high lustre and can be chemically coloured bronze or black and lacquered; nickel, tin and chrome plating adhere well. Anodizing does not apply, and leaded surfaces must be assessed against lead-free regulations for the intended use.

C66100 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Simain solid-solution strengthening element1.5 – 2.21.8
Pbfree lead particles improve machinability0.2 – 0.80.5
Zn≤ 1.5—
Fe≤ 0.25—
Mn≤ 0.7—
Cubalance, includes silver≥ 94 (balance)—

C66100-H01 — frequently asked

What is C66100-H01 used for?

C66100-H01 is typically used for gears, bearings and machined fittings. In short: best-machining silicon bronze; leaded free-cutting bronze; screw-machine bronze grade.

What is the yield strength of C66100-H01?

C66100-H01 has a typical yield strength of 205 MPa (29.7 ksi) and a tensile strength of 380 MPa (55.1 ksi) — weaker than 53% of copper alloy grades. Strength varies by condition: see the 5 listed tempers.

Is C66100-H01 easy to machine?

Reasonably — machinability is rated fair (50/100, better than 69% of copper alloy grades). Lead produces short, broken chips; use sharp positive-rake carbide, high speed with moderate feed and flood emulsion coolant. Machinability is about half that of free-cutting brass, so run larger clearance angles than on brass to prevent smearing.

Can C66100-H01 be welded?

Not readily — weldability is rated poor (30/100). The lead content causes hot cracking in the weld metal and HAZ, so fusion welding is generally not recommended. If unavoidable, use low-heat-input GTAW with ERCuSi-A filler on pre-cleaned surfaces; brazing, soldering or mechanical joining is preferred.

What surface finishes work on C66100-H01?

Polishes to a high lustre and can be chemically coloured bronze or black and lacquered; nickel, tin and chrome plating adhere well. Anodizing does not apply, and leaded surfaces must be assessed against lead-free regulations for the intended use.

Can C66100-H01 be formed, bent or molded?

O60 and H01 tempers cold bend, rivet and knurl well. In H04/H06 keep bend radii at 2t or greater and allow for work hardening; hot work at about 700–850 °C and anneal at 480–650 °C with water or air cooling.

What is the maximum service temperature of C66100-H01?

C66100-H01 is rated for continuous use to about 200°C (392 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C66100-H04 and C66100-O60?

H04 is the default condition — most common off-the-shelf condition for rod and wire: full-hard cold work gives 380 MPa yield and good chip breaking for fasteners, valve stems and bushings, but only light bending. O60: pick when maximum ductility is needed for deep drawing, riveting, bending or later cold forming; the soft annealed temper gives 45% elongation at only 125 MPa yield. Yield strength is 380 MPa in H04 versus 125 MPa in O60.

Sources

  1. ASTM B99/B99M — Copper-Silicon Alloy Wire and Rod — ASTM International (2020)
  2. CDA/UNS C66100 alloy datasheet (copper.org) — Copper Development Association (2024)
  3. ASM Handbook Vol.2 — Properties of Nonferrous Alloys (Silicon Bronzes) — ASM International (1990)
  4. ASM Handbook Vol.13B — Corrosion of Copper and Copper Alloys — ASM International (2005)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.