Solder & Low-Melting Alloy Pb69Sn30Sb1
ISO 9453-135
Pb69Sn30Sb1 is an antimony-modified version of 30/70 tin-lead solder in which tin content is cut for cost while acceptable mechanical performance is retained (26 MPa yield, 42 MPa tensile, 35% elongation, 13 HB).
Reference datasheet — Pb69Sn30Sb1 is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.
What is Pb69Sn30Sb1?
Pb69Sn30Sb1 is an antimony-modified version of 30/70 tin-lead solder in which tin content is cut for cost while acceptable mechanical performance is retained (26 MPa yield, 42 MPa tensile, 35% elongation, 13 HB). It is used for cable jointing, wiping solder and structural sheet metal work, and is stocked as bar, wire, cored wire, foil and powder. The roughly 70 °C pasty range makes wiping easy but wetting is slower than higher-tin grades, service is limited to about 100 °C, and the alloy is lead-bearing. Pb58Sn40Sb2 is the nearest step up when more strength or faster wetting is required. Pb69Sn30Sb1 has a density of 9.7 g/cm³ (0.35 lb/in³), heavier than 70% of solder & low-melting alloy grades. It melts at 183°C (361 °F). Pb69Sn30Sb1 has a yield strength of 26 MPa (3.77 ksi) and a tensile strength of 42 MPa (6.09 ksi) — weaker than 55% of solder & low-melting alloy grades. Elongation at break is 35% and the elastic modulus is 25 GPa (3.63 Msi).
What is Pb69Sn30Sb1 used for?
- cable jointing
- structural sheet metal work
- wiping solder
Limitations
- Hard to polish — 20/100, worse than 88% of solder & low-melting alloy grades
Pb69Sn30Sb1 properties
Typical room-temperature values; bars are the position among solder & low-melting alloy grades.
Physical3
Pb69Sn30Sb1 has a density of 9.7 g/cm³ (0.35 lb/in³), heavier than 70% of solder & low-melting alloy grades. It melts at 183°C (361 °F).
Mechanical12
Pb69Sn30Sb1 has a yield strength of 26 MPa (3.77 ksi) and a tensile strength of 42 MPa (6.09 ksi) — weaker than 55% of solder & low-melting alloy grades. Elongation at break is 35% and the elastic modulus is 25 GPa (3.63 Msi).
Thermal6
Pb69Sn30Sb1 is rated for continuous service to 100°C (212 °F). It conducts heat at 46 W/m·K (26.6 BTU/hr·ft·°F), better than 53% of solder & low-melting alloy grades. Thermal expansion is 26 µm/m·K (14.4 µin/in·°F).
Electrical3
Pb69Sn30Sb1 conducts electricity at 9 % IACS, worse than 54% of solder & low-melting alloy grades.
Chemical & Environmental3
Corrosion resistance is fair (40/100), worse than 82% of solder & low-melting alloy grades.
Sustainability4
Producing a kilogram of Pb69Sn30Sb1 takes about 115 MJ of energy and emits 7 kg of CO₂ — less than 67% of solder & low-melting alloy grades. Typical recycled content is 55%.
Manufacturability7
Pb69Sn30Sb1's machinability is fair (35/100, better than 58% of solder & low-melting alloy grades); weldability poor (20/100); formability excellent (90/100).
Common Calculations5
Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.
Strength versus weight in the solder & low-melting alloy family
Yield strength against density for every solder & low-melting alloy grade FabDigit runs. Pb69Sn30Sb1 is highlighted; hover a dot for its name, or open the interactive family chart.
Working with Pb69Sn30Sb1
Is Pb69Sn30Sb1 easy to machine?
Rarely machined; if required use very sharp high-rake tools, flood coolant and slow feeds to avoid smearing — treat all swarf as lead-bearing waste.
Can Pb69Sn30Sb1 be welded?
Not fusion welded; joints are made or repaired by re-melting the solder itself with iron, torch or solder pot at 260–300 °C.
Can Pb69Sn30Sb1 be formed, bent or molded?
Extremely ductile — extrudes into wire, rolls into ribbon and wipes readily thanks to the ~70 °C pasty range; avoid disturbing the joint during freezing.
Pb69Sn30Sb1 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Sntin content defines the 30/70 grade | 29.5 – 30.5 | 30 |
| Sbantimony added for solid-solution strengthening / creep resistance | 0.8 – 1.2 | 1 |
| Biimpurity limit | ≤ 0.1 | |
| Cuimpurity limit | ≤ 0.08 | |
| Feimpurity limit | ≤ 0.02 | |
| Agimpurity limit | ≤ 0.02 | |
| Asimpurity limit | ≤ 0.03 | |
| Znimpurity limit | ≤ 0.01 | |
| Alimpurity limit | ≤ 0.01 | |
| Pbbalance ≈ 69 % | balance |
What surface finishes work on Pb69Sn30Sb1?
Leave as-soldered or wire-brush and lacquer; flux residues must be washed off, and no anodizing or bright plating is applicable.
Equivalent designations
Standards and trade names that resolve to Solder & Low-Melting Alloy Pb69Sn30Sb1 in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.
- ISO
- 9453-135
How much does Pb69Sn30Sb1 cost?
Pb69Sn30Sb1 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Pb69Sn30Sb1 — frequently asked
What is Pb69Sn30Sb1 used for?
Pb69Sn30Sb1 is typically used for cable jointing, structural sheet metal work and wiping solder. In short: low-tin economy solder; wide pasty range for wiping; antimony-modified 30/70 grade.
What is the yield strength of Pb69Sn30Sb1?
Pb69Sn30Sb1 has a typical yield strength of 26 MPa (3.77 ksi) and a tensile strength of 42 MPa (6.09 ksi) — weaker than 55% of solder & low-melting alloy grades.
Is Pb69Sn30Sb1 easy to machine?
Not especially — machinability is rated fair (35/100, better than 58% of solder & low-melting alloy grades). Rarely machined; if required use very sharp high-rake tools, flood coolant and slow feeds to avoid smearing — treat all swarf as lead-bearing waste.
Can Pb69Sn30Sb1 be welded?
Not readily — weldability is rated poor (20/100). Not fusion welded; joints are made or repaired by re-melting the solder itself with iron, torch or solder pot at 260–300 °C.
What surface finishes work on Pb69Sn30Sb1?
Leave as-soldered or wire-brush and lacquer; flux residues must be washed off, and no anodizing or bright plating is applicable.
Can Pb69Sn30Sb1 be formed, bent or molded?
Extremely ductile — extrudes into wire, rolls into ribbon and wipes readily thanks to the ~70 °C pasty range; avoid disturbing the joint during freezing.
What is the maximum service temperature of Pb69Sn30Sb1?
Pb69Sn30Sb1 is rated for continuous use to about 100°C (212 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
How much does Pb69Sn30Sb1 cost?
Pb69Sn30Sb1 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sources
- ASTM B32 — Standard Specification for Solder Metal — ASTM International (2020)
- GB/T 3131 (2020)
- ASM Handbook Vol. 3 — Alloy Phase Diagrams (Sn-Pb, Pb-Sb) — ASM International (1992)
- ASM Handbook Vol. 6 — Welding, Brazing and Soldering (Soldering section) — ASM International (1993)
- Solder alloy technical data (Sn-Pb-Sb bar and wire) — AIM / Alpha / Nihon Superior style datasheets (2023)
Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.