FabDigit

Solder & Low-Melting Alloy Sn50Pb50

ASTM Sn50 · JIS H50A · GB HLSnPb50-50

Sn50Pb50 (H50A, HLSnPb50-50) is a mid-tin lead-bearing solder whose broad 183–216 °C pasty range gives a long plastic stage that suits wiped and swept joints.

High cost $$$$

Reference datasheet — Sn50Pb50 is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.

What is Sn50Pb50?

Sn50Pb50 (H50A, HLSnPb50-50) is a mid-tin lead-bearing solder whose broad 183–216 °C pasty range gives a long plastic stage that suits wiped and swept joints. It is the traditional plumbing, sheet-metal and radiator alloy, supplied as bar, solid wire, rosin- and acid-cored wire, foil, preforms and paste. Mechanical values are modest (42 MPa tensile, 45 % elongation, 14 HB), and the alloy is not permitted on potable-water or RoHS parts. Sn70Pb30 or eutectic Sn-Pb give faster freezing for electrical work, while SAC grades replace it where lead-free legislation applies. Sn50Pb50 has a density of 8.87 g/cm³ (0.32 lb/in³), heavier than 57% of solder & low-melting alloy grades. It melts at 183°C (361 °F). Sn50Pb50 has a yield strength of 30 MPa (4.35 ksi) and a tensile strength of 42 MPa (6.09 ksi) — stronger than 61% of solder & low-melting alloy grades. Elongation at break is 45% and the elastic modulus is 27 GPa (3.92 Msi).

What is Sn50Pb50 used for?

  • plumbing joints
  • sheet metal seaming
  • radiator manufacturing

Advantages

  • Ductile — tolerates forming and impact — 45%, better than 84% of solder & low-melting alloy grades

Sn50Pb50 properties

Typical room-temperature values; bars are the position among solder & low-melting alloy grades.

Physical3

Sn50Pb50 has a density of 8.87 g/cm³ (0.32 lb/in³), heavier than 57% of solder & low-melting alloy grades. It melts at 183°C (361 °F).

Density8.87 g/cm³0.32 lb/in³
Melting Point (Solidus)183°C361 °F
Liquidus Temperature216°C421 °F

Mechanical12

Sn50Pb50 has a yield strength of 30 MPa (4.35 ksi) and a tensile strength of 42 MPa (6.09 ksi) — stronger than 61% of solder & low-melting alloy grades. Elongation at break is 45% and the elastic modulus is 27 GPa (3.92 Msi).

Elastic (Young's) Modulus27 GPa3.9 Msi
Shear Modulus9.6 GPa1.4 Msi
Bulk Modulus45 GPa6.5 Msi
Poisson's Ratio0.4
Tensile Strength (Ultimate)42 MPa6.1 ksi
Yield Strength (0.2% offset)30 MPa4.4 ksi
Elongation at Break45%
Compressive Strength45 MPa6.5 ksi
Shear Strength35 MPa5.1 ksi
Fatigue Strength (Endurance Limit)14 MPa2 ksi
Hardness, Brinell14 HB
Hardness, Vickers13 HV

Thermal6

Sn50Pb50 is rated for continuous service to 100°C (212 °F). It conducts heat at 47 W/m·K (27.2 BTU/hr·ft·°F), better than 55% of solder & low-melting alloy grades. Thermal expansion is 23.4 µm/m·K (13 µin/in·°F).

Thermal Conductivity47 W/m·K27.2 BTU/hr·ft·°F
Specific Heat Capacity176 J/kg·K0.04 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)23.4 µm/m·K13 µin/in·°F
Latent Heat of Fusion43 J/g18.5 BTU/lb
Max Service Temperature (continuous)100°C212 °F
Min Service Temperature-60°C-76 °F

Electrical3

Sn50Pb50 conducts electricity at 10.9 % IACS, better than 63% of solder & low-melting alloy grades.

Electrical Conductivity10.9 % IACS
Electrical Resistivity1.58×10⁻⁷ Ω·m6.22 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is fair (45/100), worse than 52% of solder & low-melting alloy grades.

Galvanic Potential (seawater, vs SCE)-0.52 V
Corrosion ResistanceFair45/100
Chemical Resistance SummaryStable in dry air, fresh water and mild alkalis (forms protective Sn/Pb oxide); attacked by acetic, nitric and other organic/oxidizing acids, and by activated (acid) flux residues if not cleaned. Lead leaching bars it from potable-water plumbing in most jurisdictions.

Sustainability4

Producing a kilogram of Sn50Pb50 takes about 170 MJ of energy and emits 9.5 kg of CO₂ — less than 56% of solder & low-melting alloy grades. Typical recycled content is 40%.

Embodied Energy (primary production)170 MJ/kg73,087 BTU/lb
Embodied Carbon (primary production)9.5 kg CO₂/kg
Embodied Water320 L/kg38.3 gal/lb
Typical Recycled Content40%

Manufacturability6

Sn50Pb50's machinability is poor (25/100, worse than 82% of solder & low-melting alloy grades); weldability poor (20/100); formability excellent (90/100).

MachinabilityPoor25/100
WeldabilityPoor20/100
Formability (cold)Excellent90/100
CastabilityExcellent92/100
Brazeability / SolderabilityExcellent97/100
PolishabilityPoor30/100

Common Calculations5

Specific Strength (UTS / density)calculated5 kN·m/kg
Specific Stiffness (E / density)calculated3 MN·m/kg
Modulus of Resiliencecalculated17 kJ/m³
Thermal Diffusivitycalculated30.1 mm²/s
Thermal Shock Resistance Indexcalculated3

Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.

Strength versus weight in the solder & low-melting alloy family

Yield strength against density for every solder & low-melting alloy grade FabDigit runs. Sn50Pb50 is highlighted; hover a dot for its name, or open the interactive family chart.

125102050891011Density (g/cm³)Yield strength (MPa) — log scaleSn50Pb50

Working with Sn50Pb50

Is Sn50Pb50 easy to machine?

Very soft and gummy — use sharp high-rake tools, low speed and paraffin/kerosene lube; solder is normally cast or extruded to shape rather than machined.

Can Sn50Pb50 be welded?

Not fusion welded; the alloy is a filler metal — joints are made by soldering at 230–260 °C with rosin (electrical) or acid/ZnCl2 (sheet metal, non-potable plumbing) flux.

Can Sn50Pb50 be formed, bent or molded?

Extrudes and rolls easily at room temperature into wire, ribbon and preforms; the wide 183–216 °C pasty range makes it ideal for wiped and swept joints.

Sn50Pb50 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
SnASTM B32 alloy grade Sn5049.5 – 51.550
Sbgrade Sn50A; antimonial grade Sn50B allows 0.20–0.50 %≤ 0.120.05
Biimpurity limit≤ 0.25
Cuimpurity limit≤ 0.08
Agimpurity limit (non-silver-bearing grade)≤ 0.02
Feimpurity limit≤ 0.02
Asimpurity limit≤ 0.03
Znimpurity limit≤ 0.01
Alimpurity limit≤ 0.01
Cdimpurity limit≤ 0
Pbbalance

What surface finishes work on Sn50Pb50?

Wipe or wire-brush hot; wash off activated flux residues to prevent corrosion; do not plate or anodize — surface dulls to a grey oxide that is cosmetically stable.

Equivalent designations

Standards and trade names that resolve to Solder & Low-Melting Alloy Sn50Pb50 in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.

ASTM
Sn50
GB (China)
HLSnPb50-50
JIS
H50A

How much does Sn50Pb50 cost?

Sn50Pb50 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.

Sn50Pb50 — frequently asked

What is Sn50Pb50 used for?

Sn50Pb50 is typically used for plumbing joints, sheet metal seaming and radiator manufacturing. In short: classic wiping solder; long plastic freezing range; sheet-metal and plumbing grade.

What is the yield strength of Sn50Pb50?

Sn50Pb50 has a typical yield strength of 30 MPa (4.35 ksi) and a tensile strength of 42 MPa (6.09 ksi) — stronger than 61% of solder & low-melting alloy grades.

Is Sn50Pb50 easy to machine?

Not especially — machinability is rated poor (25/100, worse than 82% of solder & low-melting alloy grades). Very soft and gummy — use sharp high-rake tools, low speed and paraffin/kerosene lube; solder is normally cast or extruded to shape rather than machined.

Can Sn50Pb50 be welded?

Not readily — weldability is rated poor (20/100). Not fusion welded; the alloy is a filler metal — joints are made by soldering at 230–260 °C with rosin (electrical) or acid/ZnCl2 (sheet metal, non-potable plumbing) flux.

What surface finishes work on Sn50Pb50?

Wipe or wire-brush hot; wash off activated flux residues to prevent corrosion; do not plate or anodize — surface dulls to a grey oxide that is cosmetically stable.

Can Sn50Pb50 be formed, bent or molded?

Extrudes and rolls easily at room temperature into wire, ribbon and preforms; the wide 183–216 °C pasty range makes it ideal for wiped and swept joints.

What is the maximum service temperature of Sn50Pb50?

Sn50Pb50 is rated for continuous use to about 100°C (212 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

How much does Sn50Pb50 cost?

Sn50Pb50 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.

Sources

  1. ASTM B32 — Standard Specification for Solder Metal — ASTM International (2020)
  2. GB/T 3131 (2020)
  3. J-STD-006 — Requirements for Electronic Grade Solder Alloys — IPC (2013)
  4. ASM Handbook Vol. 6 — Welding, Brazing, and Soldering (Solder alloy properties) — ASM International (1993)
  5. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys (Tin and Lead alloys) — ASM International (1990)
  6. Sn50Pb50 solder bar/wire technical data — AIM Solder / Indium Corporation (2023)

Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.