FabDigit

Solder & Low-Melting Alloy Pb95Ag5

ISO 9453-182

Pb95Ag5 is a tin-free high-lead solder with 5% silver, sitting at the high-melting end of the Sn-Pb solder family.

High cost $$$$

Reference datasheet — Pb95Ag5 is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.

What is Pb95Ag5?

Pb95Ag5 is a tin-free high-lead solder with 5% silver, sitting at the high-melting end of the Sn-Pb solder family. The high remelt temperature lets it survive later reflow passes, so it is used as the first step in multi-reflow assembly and for die attach in power modules; forms include wire, cored wire, bar, preform, paste and spheres. It is soft and creep-prone — 25 MPa tensile, 35% elongation, 11 HB — with service limited to about 175 °C. Lead content confines it to RoHS-exempt applications; Pb98Ag2 gives a higher service ceiling, Pb93Sn5Ag2 better wetting. Pb95Ag5 has a density of 11.28 g/cm³ (0.408 lb/in³), heavier than 94% of solder & low-melting alloy grades. It melts at 304°C (579 °F). Pb95Ag5 has a yield strength of 15 MPa (2.18 ksi) and a tensile strength of 24 MPa (3.48 ksi) — weaker than 82% of solder & low-melting alloy grades. Elongation at break is 35% and the elastic modulus is 20 GPa (2.9 Msi).

What is Pb95Ag5 used for?

  • high-temperature electronic joints
  • step-soldering in multi-reflow assembly
  • power module die attach

Advantages

  • High service temperature — 175°C (347 °F), better than 97% of solder & low-melting alloy grades
  • Readily welded — 45/100, better than 89% of solder & low-melting alloy grades

Limitations

  • Heavy — 11.28 g/cm³ (0.408 lb/in³), worse than 94% of solder & low-melting alloy grades
  • Low strength — 15 MPa (2.18 ksi), worse than 82% of solder & low-melting alloy grades
  • Low stiffness — 20 GPa (2.9 Msi), worse than 81% of solder & low-melting alloy grades

Pb95Ag5 properties

Typical room-temperature values; bars are the position among solder & low-melting alloy grades.

Physical3

Pb95Ag5 has a density of 11.28 g/cm³ (0.408 lb/in³), heavier than 94% of solder & low-melting alloy grades. It melts at 304°C (579 °F).

Density11.28 g/cm³0.41 lb/in³
Melting Point (Solidus)304°C579 °F
Liquidus Temperature365°C689 °F

Mechanical10

Pb95Ag5 has a yield strength of 15 MPa (2.18 ksi) and a tensile strength of 24 MPa (3.48 ksi) — weaker than 82% of solder & low-melting alloy grades. Elongation at break is 35% and the elastic modulus is 20 GPa (2.9 Msi).

Elastic (Young's) Modulus20 GPa2.9 Msi
Shear Modulus7.3 GPa1.1 Msi
Bulk Modulus42 GPa6.1 Msi
Poisson's Ratio0.41
Tensile Strength (Ultimate)24 MPa3.5 ksi
Yield Strength (0.2% offset)15 MPa2.2 ksi
Elongation at Break35%
Shear Strength20 MPa2.9 ksi
Fatigue Strength (Endurance Limit)8 MPa1.2 ksi
Hardness, Brinell11 HB

Thermal6

Pb95Ag5 is rated for continuous service to 175°C (347 °F). It conducts heat at 37 W/m·K (21.4 BTU/hr·ft·°F), worse than 62% of solder & low-melting alloy grades. Thermal expansion is 28.5 µm/m·K (15.8 µin/in·°F).

Thermal Conductivity37 W/m·K21.4 BTU/hr·ft·°F
Specific Heat Capacity134 J/kg·K0.03 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)28.5 µm/m·K15.8 µin/in·°F
Latent Heat of Fusion25 J/g10.7 BTU/lb
Max Service Temperature (continuous)175°C347 °F
Min Service Temperature-55°C-67 °F

Electrical3

Pb95Ag5 conducts electricity at 8.5 % IACS, worse than 64% of solder & low-melting alloy grades.

Electrical Conductivity8.5 % IACS
Electrical Resistivity2.03×10⁻⁷ Ω·m7.99 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is fair (45/100), worse than 52% of solder & low-melting alloy grades.

Galvanic Potential (seawater, vs SCE)-0.52 V
Corrosion ResistanceFair45/100
Chemical Resistance SummaryGood resistance to sulfuric and phosphoric acid and to neutral atmospheres (protective oxide/sulfate film); attacked by nitric and acetic acids, and dulls/tarnishes in sulfur-bearing environments.

Sustainability4

Producing a kilogram of Pb95Ag5 takes about 105 MJ of energy and emits 7.5 kg of CO₂ — less than 69% of solder & low-melting alloy grades. Typical recycled content is 50%.

Embodied Energy (primary production)105 MJ/kg45,142 BTU/lb
Embodied Carbon (primary production)7.5 kg CO₂/kg
Embodied Water120 L/kg14.4 gal/lb
Typical Recycled Content50%

Manufacturability7

Pb95Ag5's machinability is poor (30/100, worse than 60% of solder & low-melting alloy grades); weldability fair (45/100); formability excellent (90/100).

MachinabilityPoor30/100
WeldabilityFair45/100
Formability (cold)Excellent90/100
CastabilityExcellent85/100
Brazeability / SolderabilityGood65/100
PolishabilityPoor25/100
Anodizing Responsen/a — lead-base alloy, not anodized

Common Calculations5

Specific Strength (UTS / density)calculated2 kN·m/kg
Specific Stiffness (E / density)calculated1.8 MN·m/kg
Modulus of Resiliencecalculated6 kJ/m³
Thermal Diffusivitycalculated24.5 mm²/s
Thermal Shock Resistance Indexcalculated2

Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.

Strength versus weight in the solder & low-melting alloy family

Yield strength against density for every solder & low-melting alloy grade FabDigit runs. Pb95Ag5 is highlighted; hover a dot for its name, or open the interactive family chart.

125102050891011Density (g/cm³)Yield strength (MPa) — log scalePb95Ag5

Working with Pb95Ag5

Is Pb95Ag5 easy to machine?

Extremely soft and gummy — machining is rarely done; use sharp positive-rake tools, high speed and no coolant carryover, or stamp/shear preforms instead.

Can Pb95Ag5 be welded?

Not fusion welded; it is itself a filler — solder at 380–420 °C with activated rosin or halide-bearing flux, or use flux-free reflow under H₂/formic-acid atmosphere.

Can Pb95Ag5 be formed, bent or molded?

Readily extruded into wire, rolled to ribbon and stamped into preforms at room temperature; it work-softens and creeps, so avoid stressed storage of thin sections.

Pb95Ag5 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Agsilver content defining the alloy4.5 – 5.55
Snimpurity limit — nominally tin-free≤ 0.25
Sb≤ 0.4
Bi≤ 0.25
Cu≤ 0.08
Fe≤ 0.02
Zn≤ 0.01
Al≤ 0.01
As≤ 0.03
Cd≤ 0
Pbbalance

What surface finishes work on Pb95Ag5?

Joint surface is dull grey and tarnishes; clean flux residues with saponifier or solvent — plating and polishing are not practical on the solder itself.

Equivalent designations

Standards and trade names that resolve to Solder & Low-Melting Alloy Pb95Ag5 in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.

ISO
9453-182

How much does Pb95Ag5 cost?

Pb95Ag5 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.

Pb95Ag5 — frequently asked

What is Pb95Ag5 used for?

Pb95Ag5 is typically used for high-temperature electronic joints, step-soldering in multi-reflow assembly and power module die attach. In short: high remelt temperature; tin-free high-lead solder; harder than Pb98Ag2.

What is the yield strength of Pb95Ag5?

Pb95Ag5 has a typical yield strength of 15 MPa (2.18 ksi) and a tensile strength of 24 MPa (3.48 ksi) — weaker than 82% of solder & low-melting alloy grades.

Is Pb95Ag5 easy to machine?

Not especially — machinability is rated poor (30/100, worse than 60% of solder & low-melting alloy grades). Extremely soft and gummy — machining is rarely done; use sharp positive-rake tools, high speed and no coolant carryover, or stamp/shear preforms instead.

Can Pb95Ag5 be welded?

With care — weldability is rated fair (45/100). Not fusion welded; it is itself a filler — solder at 380–420 °C with activated rosin or halide-bearing flux, or use flux-free reflow under H₂/formic-acid atmosphere.

What surface finishes work on Pb95Ag5?

Joint surface is dull grey and tarnishes; clean flux residues with saponifier or solvent — plating and polishing are not practical on the solder itself.

Can Pb95Ag5 be formed, bent or molded?

Readily extruded into wire, rolled to ribbon and stamped into preforms at room temperature; it work-softens and creeps, so avoid stressed storage of thin sections.

What is the maximum service temperature of Pb95Ag5?

Pb95Ag5 is rated for continuous use to about 175°C (347 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

How much does Pb95Ag5 cost?

Pb95Ag5 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.

Sources

  1. ASTM B32 — Standard Specification for Solder Metal — ASTM International (2020)
  2. J-STD-006 — Requirements for Electronic Grade Solder Alloys — IPC (2013)
  3. ASM Handbook Vol. 6A — Welding, Brazing and Soldering (Solder alloy properties) — ASM International (2011)
  4. ASM Handbook Vol. 3 — Alloy Phase Diagrams (Ag-Pb system) — ASM International (1992)
  5. High-temperature Pb-Ag solder alloy data (wire, preform, paste forms) — Indium Corporation / AIM Solder (2023)

Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.