Solder & Low-Melting Alloy Pb93Sn5Ag2
ISO 9453-191
Pb93Sn5Ag2 is a high-lead solder in the Sn-Pb family with small tin and silver additions that improve wetting while keeping a high melting range.
Reference datasheet — Pb93Sn5Ag2 is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.
What is Pb93Sn5Ag2?
Pb93Sn5Ag2 is a high-lead solder in the Sn-Pb family with small tin and silver additions that improve wetting while keeping a high melting range. It is the common first-level, high-melting step solder for semiconductor die attach and multi-reflow assembly, supplied as ingot, wire, cored wire, preform, paste, spheres and powder. It is the strongest of the high-lead group here at 33 MPa tensile and 22 MPa yield, 35% elongation and 11 HB, but service is limited to about 150 °C and it creeps under load. Lead content restricts use to RoHS-exempt applications; Pb95Ag5 or Pb98Ag2 raise the remelt point further. Pb93Sn5Ag2 has a density of 11 g/cm³ (0.397 lb/in³), heavier than 89% of solder & low-melting alloy grades. It melts at 296°C (565 °F). Pb93Sn5Ag2 has a yield strength of 22 MPa (3.19 ksi) and a tensile strength of 33 MPa (4.79 ksi) — weaker than 70% of solder & low-melting alloy grades. Elongation at break is 35% and the elastic modulus is 23 GPa (3.34 Msi).
What is Pb93Sn5Ag2 used for?
- semiconductor die attach
- step soldering (first reflow)
- high-reliability high-temperature joints
Advantages
- High service temperature — 150°C (302 °F), better than 92% of solder & low-melting alloy grades
Limitations
- Needs corrosion protection — 35/100, worse than 94% of solder & low-melting alloy grades
- Heavy — 11 g/cm³ (0.397 lb/in³), worse than 89% of solder & low-melting alloy grades
- Hard to polish — 20/100, worse than 88% of solder & low-melting alloy grades
- Low stiffness — 23 GPa (3.34 Msi), worse than 75% of solder & low-melting alloy grades
Pb93Sn5Ag2 properties
Typical room-temperature values; bars are the position among solder & low-melting alloy grades.
Physical3
Pb93Sn5Ag2 has a density of 11 g/cm³ (0.397 lb/in³), heavier than 89% of solder & low-melting alloy grades. It melts at 296°C (565 °F).
Mechanical10
Pb93Sn5Ag2 has a yield strength of 22 MPa (3.19 ksi) and a tensile strength of 33 MPa (4.79 ksi) — weaker than 70% of solder & low-melting alloy grades. Elongation at break is 35% and the elastic modulus is 23 GPa (3.34 Msi).
Thermal6
Pb93Sn5Ag2 is rated for continuous service to 150°C (302 °F). It conducts heat at 36 W/m·K (20.8 BTU/hr·ft·°F), worse than 64% of solder & low-melting alloy grades. Thermal expansion is 29 µm/m·K (16.1 µin/in·°F).
Electrical3
Pb93Sn5Ag2 conducts electricity at 8.5 % IACS, worse than 64% of solder & low-melting alloy grades.
Chemical & Environmental3
Corrosion resistance is fair (35/100), worse than 94% of solder & low-melting alloy grades.
Sustainability4
Producing a kilogram of Pb93Sn5Ag2 takes about 70 MJ of energy and emits 5 kg of CO₂ — less than 74% of solder & low-melting alloy grades. Typical recycled content is 45%.
Manufacturability5
Pb93Sn5Ag2's machinability is poor (30/100, worse than 60% of solder & low-melting alloy grades); formability excellent (90/100).
Common Calculations5
Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.
Strength versus weight in the solder & low-melting alloy family
Yield strength against density for every solder & low-melting alloy grade FabDigit runs. Pb93Sn5Ag2 is highlighted; hover a dot for its name, or open the interactive family chart.
Working with Pb93Sn5Ag2
Is Pb93Sn5Ag2 easy to machine?
Too soft and gummy for conventional machining — parts are stamped, coined, sheared or sawn with sharp tools and lubricant; capture all lead swarf.
Can Pb93Sn5Ag2 be welded?
Not welded; joined only by reflow/dip soldering at 330–380 °C peak using activated rosin flux or formic-acid/forming-gas reflow, and it must be the first (highest-temperature) step in a step-soldering sequence.
Can Pb93Sn5Ag2 be formed, bent or molded?
Extrudes, rolls and draws readily at room temperature into wire, ribbon and preforms; recrystallizes at RT so no annealing needed, but avoid work-hardening assumptions in design.
Pb93Sn5Ag2 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Snwets Cu/Ni, forms Cu6Sn5 interface | 4.5 – 5.5 | 5 |
| Agcreep/fatigue resistance, limits Ag-metallization leaching | 1.5 – 2.5 | 2 |
| Sbimpurity limit | ≤ 0.5 | |
| Biimpurity limit | ≤ 0.25 | |
| Cuimpurity limit | ≤ 0.08 | |
| Asimpurity limit | ≤ 0.03 | |
| Feimpurity limit | ≤ 0.02 | |
| Znimpurity limit (dewetting) | ≤ 0.01 | |
| Alimpurity limit (dewetting) | ≤ 0.01 | |
| Cdimpurity limit | ≤ 0 | |
| Pbbalance, ~93 % | balance |
What surface finishes work on Pb93Sn5Ag2?
As-solidified surface dulls to grey lead oxide; clean flux residues with appropriate saponifier or solvent, and avoid plating or paint directly on the joint — protect adjacent surfaces instead.
Equivalent designations
Standards and trade names that resolve to Solder & Low-Melting Alloy Pb93Sn5Ag2 in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.
- ISO
- 9453-191
How much does Pb93Sn5Ag2 cost?
Pb93Sn5Ag2 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Pb93Sn5Ag2 — frequently asked
What is Pb93Sn5Ag2 used for?
Pb93Sn5Ag2 is typically used for semiconductor die attach, step soldering (first reflow) and high-reliability high-temperature joints. In short: strongest high-lead step solder; first-reflow die-attach alloy; better wetting than tin-free Pb-Ag.
What is the yield strength of Pb93Sn5Ag2?
Pb93Sn5Ag2 has a typical yield strength of 22 MPa (3.19 ksi) and a tensile strength of 33 MPa (4.79 ksi) — weaker than 70% of solder & low-melting alloy grades.
Is Pb93Sn5Ag2 easy to machine?
Not especially — machinability is rated poor (30/100, worse than 60% of solder & low-melting alloy grades). Too soft and gummy for conventional machining — parts are stamped, coined, sheared or sawn with sharp tools and lubricant; capture all lead swarf.
Can Pb93Sn5Ag2 be welded?
Not welded; joined only by reflow/dip soldering at 330–380 °C peak using activated rosin flux or formic-acid/forming-gas reflow, and it must be the first (highest-temperature) step in a step-soldering sequence.
What surface finishes work on Pb93Sn5Ag2?
As-solidified surface dulls to grey lead oxide; clean flux residues with appropriate saponifier or solvent, and avoid plating or paint directly on the joint — protect adjacent surfaces instead.
Can Pb93Sn5Ag2 be formed, bent or molded?
Extrudes, rolls and draws readily at room temperature into wire, ribbon and preforms; recrystallizes at RT so no annealing needed, but avoid work-hardening assumptions in design.
What is the maximum service temperature of Pb93Sn5Ag2?
Pb93Sn5Ag2 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
How much does Pb93Sn5Ag2 cost?
Pb93Sn5Ag2 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sources
- ASTM B32 — Standard Specification for Solder Metal — ASTM International (2020)
- J-STD-006 — Requirements for Electronic Grade Solder Alloys and Fluxed/Non-Fluxed Solid Solders — IPC/JEDEC (2013)
- ASM Handbook Vol. 6 — Welding, Brazing and Soldering (solder alloy properties) — ASM International (1993)
- NIST Database for Solder Properties with Emphasis on New Lead-Free Solders — NIST (2002)
- High-lead solder alloy data (Pb-Sn-Ag step-soldering alloys) — Indium Corporation (2023)
- Solder alloy and preform technical data — AIM Solder / Kester (2023)
Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.