Solder & Low-Melting Alloy Sn60Pb40
ASTM B32 Sn60 · JIS Z3282 H60A · GB HLSnPb60-40, SnPb60
Sn60Pb40 is a near-eutectic tin-lead solder with a short pasty range of 183–190 °C, listed as ASTM B32 Sn60, JIS Z3282 H60A and equivalent designations.
Reference datasheet — Sn60Pb40 is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.
What is Sn60Pb40?
Sn60Pb40 is a near-eutectic tin-lead solder with a short pasty range of 183–190 °C, listed as ASTM B32 Sn60, JIS Z3282 H60A and equivalent designations. It is the cost-effective general-purpose choice for wave soldering, wire and sheet-metal work, supplied as rosin-cored and solid wire, bar, paste, powder, foil and preforms, with 55 MPa tensile strength, 35 % elongation, 16 HB and service to about 100 °C. The plastic range can produce disturbed joints if parts move during freezing, so eutectic Sn63Pb37 is preferred for fine-pitch reflow, and lead content bars it from RoHS and food-contact use. Sn60Pb40 has a density of 8.52 g/cm³ (0.308 lb/in³), heavier than 50% of solder & low-melting alloy grades. It melts at 183°C (361 °F). Sn60Pb40 has a yield strength of 32 MPa (4.64 ksi) and a tensile strength of 52 MPa (7.54 ksi) — stronger than 73% of solder & low-melting alloy grades. Elongation at break is 40% and the elastic modulus is 31 GPa (4.5 Msi).
What is Sn60Pb40 used for?
- wave soldering
- general electrical connections
- plumbing (legacy)
- sheet metal seam soldering
Sn60Pb40 properties
Typical room-temperature values; bars are the position among solder & low-melting alloy grades.
Physical3
Sn60Pb40 has a density of 8.52 g/cm³ (0.308 lb/in³), heavier than 50% of solder & low-melting alloy grades. It melts at 183°C (361 °F).
Mechanical11
Sn60Pb40 has a yield strength of 32 MPa (4.64 ksi) and a tensile strength of 52 MPa (7.54 ksi) — stronger than 73% of solder & low-melting alloy grades. Elongation at break is 40% and the elastic modulus is 31 GPa (4.5 Msi).
Thermal6
Sn60Pb40 is rated for continuous service to 100°C (212 °F). It conducts heat at 50 W/m·K (28.9 BTU/hr·ft·°F), better than 63% of solder & low-melting alloy grades. Thermal expansion is 24.5 µm/m·K (13.6 µin/in·°F).
Electrical3
Sn60Pb40 conducts electricity at 11.5 % IACS, better than 71% of solder & low-melting alloy grades.
Chemical & Environmental3
Corrosion resistance is fair (45/100), worse than 52% of solder & low-melting alloy grades.
Sustainability4
Producing a kilogram of Sn60Pb40 takes about 200 MJ of energy and emits 10.5 kg of CO₂ — more than 53% of solder & low-melting alloy grades. Typical recycled content is 35%.
Manufacturability6
Sn60Pb40's machinability is poor (30/100, worse than 60% of solder & low-melting alloy grades); formability excellent (90/100).
Common Calculations5
Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.
Strength versus weight in the solder & low-melting alloy family
Yield strength against density for every solder & low-melting alloy grade FabDigit runs. Sn60Pb40 is highlighted; hover a dot for its name, or open the interactive family chart.
Working with Sn60Pb40
Is Sn60Pb40 easy to machine?
Rarely machined; extremely gummy and smears — use very sharp high-rake tools, high speed, low feed and flood lubricant, or simply cast/extrude to size.
Can Sn60Pb40 be welded?
Not welded; it is the filler metal — soldering iron 320–380 °C tip or wave pot at 245–260 °C with RMA/no-clean flux, avoid overheating to limit Cu₆Sn₅ growth.
Can Sn60Pb40 be formed, bent or molded?
Casts and extrudes easily at room temperature into bar, wire, foil and preforms; work hardening is negligible because it recrystallizes at RT.
Sn60Pb40 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| SnISO 9453 alloy 103 / ASTM B32 Sn60 | 59.5 – 61.5 | 60 |
| Sbimpurity limit (0.12 max in some grades) | ≤ 0.2 | |
| Bi | ≤ 0.1 | |
| Cu | ≤ 0.05 | |
| Ag | ≤ 0.05 | |
| As | ≤ 0.03 | |
| Fe | ≤ 0.02 | |
| Ni | ≤ 0.01 | |
| Zn | ≤ 0.01 | |
| Al | ≤ 0.01 | |
| Cd | ≤ 0 | |
| Pb | balance |
What surface finishes work on Sn60Pb40?
Joints are brightened by hot-air levelling or light brushing; clean rosin residues with IPA/saponifier — no plating or anodizing is applicable, and lead content bars RoHS/food-contact use.
Equivalent designations
Standards and trade names that resolve to Solder & Low-Melting Alloy Sn60Pb40 in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.
- ASTM
- B32 Sn60
- GB (China)
- HLSnPb60-40SnPb60
- JIS
- Z3282 H60A
- Also called
- 60/40 Solder
How much does Sn60Pb40 cost?
Sn60Pb40 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sn60Pb40 — frequently asked
What is Sn60Pb40 used for?
Sn60Pb40 is typically used for wave soldering, general electrical connections, plumbing (legacy) and sheet metal seam soldering. In short: lower-cost tin-lead solder; short 183–190 °C pasty range; not RoHS compliant.
What is the yield strength of Sn60Pb40?
Sn60Pb40 has a typical yield strength of 32 MPa (4.64 ksi) and a tensile strength of 52 MPa (7.54 ksi) — stronger than 73% of solder & low-melting alloy grades.
Is Sn60Pb40 easy to machine?
Not especially — machinability is rated poor (30/100, worse than 60% of solder & low-melting alloy grades). Rarely machined; extremely gummy and smears — use very sharp high-rake tools, high speed, low feed and flood lubricant, or simply cast/extrude to size.
Can Sn60Pb40 be welded?
Not welded; it is the filler metal — soldering iron 320–380 °C tip or wave pot at 245–260 °C with RMA/no-clean flux, avoid overheating to limit Cu₆Sn₅ growth.
What surface finishes work on Sn60Pb40?
Joints are brightened by hot-air levelling or light brushing; clean rosin residues with IPA/saponifier — no plating or anodizing is applicable, and lead content bars RoHS/food-contact use.
Can Sn60Pb40 be formed, bent or molded?
Casts and extrudes easily at room temperature into bar, wire, foil and preforms; work hardening is negligible because it recrystallizes at RT.
What is the maximum service temperature of Sn60Pb40?
Sn60Pb40 is rated for continuous use to about 100°C (212 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
How much does Sn60Pb40 cost?
Sn60Pb40 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sources
- ISO 9453 — Soft solder alloys, chemical composition and forms (alloy 103) — ISO (2020)
- ASTM B32 — Standard Specification for Solder Metal (Sn60) — ASTM (2020)
- J-STD-006 — Requirements for Electronic Grade Solder Alloys — IPC/JEDEC (2017)
- GB/T 3131 — SAC (China) (2020)
- ASM Handbook Vol. 6 — Welding, Brazing and Soldering (Soldering section) — ASM International (1993)
- ASM Handbook Vol. 2 — Properties of Tin and Lead Alloys — ASM International (1990)
- NIST Database for Solder Properties with Emphasis on New Lead-free Solders — NIST / Colorado School of Mines (2002)
- Solder bar / cored wire technical data (Sn60Pb40) — AIM Solder / Alpha Assembly / (2023)
Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.