Solder & Low-Melting Alloy Sn62Pb36Ag2
ASTM B32 Sn62
Sn62Pb36Ag2 (ASTM B32 Sn62) is a near-eutectic tin-lead solder with a 2 % silver addition, available as solid and flux-cored wire, ingot, paste, preforms, ribbon and spheres.
Reference datasheet — Sn62Pb36Ag2 is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.
What is Sn62Pb36Ag2?
Sn62Pb36Ag2 (ASTM B32 Sn62) is a near-eutectic tin-lead solder with a 2 % silver addition, available as solid and flux-cored wire, ingot, paste, preforms, ribbon and spheres. The silver reduces leaching of silver metallization from thick-film and thin-film substrates and silver-terminated components while keeping eutectic-like melting behaviour. Typical properties are 34 MPa yield, 50 MPa tensile, 35 % elongation and 15 HB, with service limited to about 100 °C. It contains lead, so RoHS-controlled work needs a SAC or Sn-Cu alloy instead. Sn62Pb36Ag2 has a density of 8.42 g/cm³ (0.304 lb/in³), lighter than 55% of solder & low-melting alloy grades. It melts at 179°C (354 °F). Sn62Pb36Ag2 has a yield strength of 33 MPa (4.79 ksi) and a tensile strength of 48 MPa (6.96 ksi) — stronger than 77% of solder & low-melting alloy grades. Elongation at break is 35% and the elastic modulus is 30 GPa (4.35 Msi).
What is Sn62Pb36Ag2 used for?
- thick-film/thin-film silver-metallized substrate soldering
- hybrid microelectronics
- silver-terminated component soldering
Advantages
- High strength — 33 MPa (4.79 ksi), better than 77% of solder & low-melting alloy grades
Limitations
- Needs corrosion protection — 35/100, worse than 94% of solder & low-melting alloy grades
Sn62Pb36Ag2 properties
Typical room-temperature values; bars are the position among solder & low-melting alloy grades.
Physical3
Sn62Pb36Ag2 has a density of 8.42 g/cm³ (0.304 lb/in³), lighter than 55% of solder & low-melting alloy grades. It melts at 179°C (354 °F).
Mechanical10
Sn62Pb36Ag2 has a yield strength of 33 MPa (4.79 ksi) and a tensile strength of 48 MPa (6.96 ksi) — stronger than 77% of solder & low-melting alloy grades. Elongation at break is 35% and the elastic modulus is 30 GPa (4.35 Msi).
Thermal6
Sn62Pb36Ag2 is rated for continuous service to 100°C (212 °F). It conducts heat at 50 W/m·K (28.9 BTU/hr·ft·°F), better than 63% of solder & low-melting alloy grades. Thermal expansion is 27 µm/m·K (15 µin/in·°F).
Electrical3
Sn62Pb36Ag2 conducts electricity at 11.5 % IACS, better than 71% of solder & low-melting alloy grades.
Chemical & Environmental3
Corrosion resistance is fair (35/100), worse than 94% of solder & low-melting alloy grades.
Sustainability4
Producing a kilogram of Sn62Pb36Ag2 takes about 210 MJ of energy and emits 13 kg of CO₂ — more than 57% of solder & low-melting alloy grades. Typical recycled content is 35%.
Manufacturability5
Sn62Pb36Ag2's machinability is poor (30/100, worse than 60% of solder & low-melting alloy grades); formability excellent (90/100).
Common Calculations5
Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.
Strength versus weight in the solder & low-melting alloy family
Yield strength against density for every solder & low-melting alloy grade FabDigit runs. Sn62Pb36Ag2 is highlighted; hover a dot for its name, or open the interactive family chart.
Working with Sn62Pb36Ag2
Is Sn62Pb36Ag2 easy to machine?
Very soft and gummy — machine only with sharp high-rake tools, low speed and generous lubricant; expect smearing and burrs rather than clean chips.
Can Sn62Pb36Ag2 be welded?
Not welded; it is the filler itself — soldered at 200–230 °C with rosin (RA/RMA) or no-clean flux, keeping peak reflow ≈ 210–225 °C and dwell short to limit Ag/Cu dissolution.
Can Sn62Pb36Ag2 be formed, bent or molded?
Extrudes, rolls and stamps easily at room temperature into wire, ribbon and preforms; no annealing needed but avoid work-hardening-free assumptions since it recrystallizes/creeps at RT.
Sn62Pb36Ag2 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| SnISO 9453 alloy 171 / ASTM B32 grade Sn62 | 61.5 – 62.5 | 62 |
| Agsuppresses Ag dissolution from silver metallizations | 1.75 – 2.25 | 2 |
| Sbimpurity limit | ≤ 0.2 | |
| Biimpurity limit | ≤ 0.1 | |
| Cuimpurity limit | ≤ 0.05 | |
| Asimpurity limit | ≤ 0.03 | |
| Feimpurity limit | ≤ 0.02 | |
| Znimpurity limit | ≤ 0 | |
| Alimpurity limit | ≤ 0 | |
| Cdimpurity limit | ≤ 0 | |
| Pbremainder, nominally 36 % | balance |
What surface finishes work on Sn62Pb36Ag2?
Joints are cleaned per flux type (saponifier/IPA for RA-RMA, none for no-clean); do not plate or anodize — protect instead with conformal coating, and avoid ammonia or strong organic-acid cleaners.
Equivalent designations
Standards and trade names that resolve to Solder & Low-Melting Alloy Sn62Pb36Ag2 in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.
- ASTM
- B32 Sn62
- Also called
- Sn62 Silver SolderSn62
How much does Sn62Pb36Ag2 cost?
Sn62Pb36Ag2 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sn62Pb36Ag2 — frequently asked
What is Sn62Pb36Ag2 used for?
Sn62Pb36Ag2 is typically used for thick-film/thin-film silver-metallized substrate soldering, hybrid microelectronics and silver-terminated component soldering. In short: protects silver metallization; near-eutectic SnPb behaviour; hybrid-microelectronics standard.
What is the yield strength of Sn62Pb36Ag2?
Sn62Pb36Ag2 has a typical yield strength of 33 MPa (4.79 ksi) and a tensile strength of 48 MPa (6.96 ksi) — stronger than 77% of solder & low-melting alloy grades.
Is Sn62Pb36Ag2 easy to machine?
Not especially — machinability is rated poor (30/100, worse than 60% of solder & low-melting alloy grades). Very soft and gummy — machine only with sharp high-rake tools, low speed and generous lubricant; expect smearing and burrs rather than clean chips.
Can Sn62Pb36Ag2 be welded?
Not welded; it is the filler itself — soldered at 200–230 °C with rosin (RA/RMA) or no-clean flux, keeping peak reflow ≈ 210–225 °C and dwell short to limit Ag/Cu dissolution.
What surface finishes work on Sn62Pb36Ag2?
Joints are cleaned per flux type (saponifier/IPA for RA-RMA, none for no-clean); do not plate or anodize — protect instead with conformal coating, and avoid ammonia or strong organic-acid cleaners.
Can Sn62Pb36Ag2 be formed, bent or molded?
Extrudes, rolls and stamps easily at room temperature into wire, ribbon and preforms; no annealing needed but avoid work-hardening-free assumptions since it recrystallizes/creeps at RT.
What is the maximum service temperature of Sn62Pb36Ag2?
Sn62Pb36Ag2 is rated for continuous use to about 100°C (212 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
How much does Sn62Pb36Ag2 cost?
Sn62Pb36Ag2 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sources
- ASTM B32 — Standard Specification for Solder Metal — ASTM International (2020)
- ISO 9453 — Soft solder alloys: chemical composition and forms (alloy 171) — ISO (2020)
- J-STD-006 — Requirements for Electronic Grade Solder Alloys — IPC (2013)
- ASM Handbook Vol. 6 — Welding, Brazing and Soldering (solder alloy properties) — ASM International (1993)
- Properties of Lead-Free and Lead-Bearing Solders (solder property database) — NIST (2002)
- Sn62Pb36Ag2 alloy and paste datasheets — Indium Corporation / Kester / AIM (2023)
Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.