Solder & Low-Melting Alloy Pb97.5Ag1.5Sn1
Pb97.5Ag1.5Sn1 is a lead-rich, silver-bearing high-melting solder (nominally 97.5% Pb, 1.5% Ag, 1% Sn) melting near 300 °C.
Reference datasheet — Pb97.5Ag1.5Sn1 is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.
What is Pb97.5Ag1.5Sn1?
Pb97.5Ag1.5Sn1 is a lead-rich, silver-bearing high-melting solder (nominally 97.5% Pb, 1.5% Ag, 1% Sn) melting near 300 °C. It is used where a later reflow step must not remelt the first joint, and is supplied as solid and cored wire, bar, preforms, paste and balls. Joints are soft — 26 MPa tensile, 16 MPa yield, 40% elongation, 10 HB — so structural load must be carried by the package, and use depends on the long-standing RoHS high-melting-solder exemption. Where lead-free construction is mandatory, Au-Sn solder or sintered-silver die attach is the nearest alternative. Pb97.5Ag1.5Sn1 has a density of 11.28 g/cm³ (0.408 lb/in³), heavier than 94% of solder & low-melting alloy grades. It melts at 309°C (588 °F). Pb97.5Ag1.5Sn1 has a yield strength of 15 MPa (2.18 ksi) and a tensile strength of 25 MPa (3.63 ksi) — weaker than 82% of solder & low-melting alloy grades. Elongation at break is 40% and the elastic modulus is 16.5 GPa (2.39 Msi).
What is Pb97.5Ag1.5Sn1 used for?
- semiconductor die attach
- power module packaging
- hermetic seal soldering
- high-temperature electronic assemblies
Advantages
- High service temperature — 200°C (392 °F), better than 99% of solder & low-melting alloy grades
- Low embodied carbon — 3.4 kg CO₂/kg, better than 82% of solder & low-melting alloy grades
Limitations
- Heavy — 11.28 g/cm³ (0.408 lb/in³), worse than 94% of solder & low-melting alloy grades
- Hard to polish — 20/100, worse than 88% of solder & low-melting alloy grades
- Low stiffness — 16.5 GPa (2.39 Msi), worse than 85% of solder & low-melting alloy grades
- Low strength — 15 MPa (2.18 ksi), worse than 82% of solder & low-melting alloy grades
- Low electrical conductivity — 7.5 % IACS, worse than 79% of solder & low-melting alloy grades
Pb97.5Ag1.5Sn1 properties
Typical room-temperature values; bars are the position among solder & low-melting alloy grades.
Physical3
Pb97.5Ag1.5Sn1 has a density of 11.28 g/cm³ (0.408 lb/in³), heavier than 94% of solder & low-melting alloy grades. It melts at 309°C (588 °F).
Mechanical10
Pb97.5Ag1.5Sn1 has a yield strength of 15 MPa (2.18 ksi) and a tensile strength of 25 MPa (3.63 ksi) — weaker than 82% of solder & low-melting alloy grades. Elongation at break is 40% and the elastic modulus is 16.5 GPa (2.39 Msi).
Thermal6
Pb97.5Ag1.5Sn1 is rated for continuous service to 200°C (392 °F). It conducts heat at 33 W/m·K (19.1 BTU/hr·ft·°F), worse than 76% of solder & low-melting alloy grades. Thermal expansion is 29 µm/m·K (16.1 µin/in·°F).
Electrical3
Pb97.5Ag1.5Sn1 conducts electricity at 7.5 % IACS, worse than 79% of solder & low-melting alloy grades.
Chemical & Environmental3
Corrosion resistance is fair (40/100), worse than 82% of solder & low-melting alloy grades.
Sustainability4
Producing a kilogram of Pb97.5Ag1.5Sn1 takes about 45 MJ of energy and emits 3.4 kg of CO₂ — less than 82% of solder & low-melting alloy grades. Typical recycled content is 55%.
Manufacturability7
Pb97.5Ag1.5Sn1's machinability is poor (25/100, worse than 82% of solder & low-melting alloy grades); weldability poor (20/100); formability excellent (92/100).
Common Calculations5
Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.
Strength versus weight in the solder & low-melting alloy family
Yield strength against density for every solder & low-melting alloy grade FabDigit runs. Pb97.5Ag1.5Sn1 is highlighted; hover a dot for its name, or open the interactive family chart.
Working with Pb97.5Ag1.5Sn1
Is Pb97.5Ag1.5Sn1 easy to machine?
Very soft and prone to sticking to tools; cutting is limited to blanking preforms or cutting wire and bar to length. Control lead dust during cutting and grinding and recover all scrap.
Can Pb97.5Ag1.5Sn1 be welded?
Not fusion welded; joints are made by soldering at 350–400 °C with activated rosin or inorganic activated flux. Verify that substrates and components tolerate the temperature and the resulting oxidation.
Can Pb97.5Ag1.5Sn1 be formed, bent or molded?
Extrudes, draws to wire and rolls to foil easily at room temperature with no intermediate annealing. Cast ingots have a narrow solidification range and low tendency to shrinkage cavities.
Pb97.5Ag1.5Sn1 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| AgASTM B32 alloy grade Ag1.5 | 1.3 – 1.7 | 1.5 |
| Sn | 0.75 – 1.25 | 1 |
| Sbimpurity max | ≤ 0.4 | |
| Biimpurity max | ≤ 0.25 | |
| Cuimpurity max | ≤ 0.08 | |
| Asimpurity max | ≤ 0.03 | |
| Feimpurity max | ≤ 0.02 | |
| Znimpurity max | ≤ 0.01 | |
| Alimpurity max | ≤ 0.01 | |
| Cdimpurity max | ≤ 0 | |
| Pbbalance, ~97.5% | balance |
What surface finishes work on Pb97.5Ag1.5Sn1?
Not anodizable; remove flux residues after soldering to prevent corrosion. Apply Sn or Ni plating or conformal coating where lead exposure must be blocked.
How much does Pb97.5Ag1.5Sn1 cost?
Pb97.5Ag1.5Sn1 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Pb97.5Ag1.5Sn1 — frequently asked
What is Pb97.5Ag1.5Sn1 used for?
Pb97.5Ag1.5Sn1 is typically used for semiconductor die attach, power module packaging, hermetic seal soldering and high-temperature electronic assemblies. In short: high-melt step-solder alloy; roHS-exempt die attach; melts near 300 °C.
What is the yield strength of Pb97.5Ag1.5Sn1?
Pb97.5Ag1.5Sn1 has a typical yield strength of 15 MPa (2.18 ksi) and a tensile strength of 25 MPa (3.63 ksi) — weaker than 82% of solder & low-melting alloy grades.
Is Pb97.5Ag1.5Sn1 easy to machine?
Not especially — machinability is rated poor (25/100, worse than 82% of solder & low-melting alloy grades). Very soft and prone to sticking to tools; cutting is limited to blanking preforms or cutting wire and bar to length. Control lead dust during cutting and grinding and recover all scrap.
Can Pb97.5Ag1.5Sn1 be welded?
Not readily — weldability is rated poor (20/100). Not fusion welded; joints are made by soldering at 350–400 °C with activated rosin or inorganic activated flux. Verify that substrates and components tolerate the temperature and the resulting oxidation.
What surface finishes work on Pb97.5Ag1.5Sn1?
Not anodizable; remove flux residues after soldering to prevent corrosion. Apply Sn or Ni plating or conformal coating where lead exposure must be blocked.
Can Pb97.5Ag1.5Sn1 be formed, bent or molded?
Extrudes, draws to wire and rolls to foil easily at room temperature with no intermediate annealing. Cast ingots have a narrow solidification range and low tendency to shrinkage cavities.
What is the maximum service temperature of Pb97.5Ag1.5Sn1?
Pb97.5Ag1.5Sn1 is rated for continuous use to about 200°C (392 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
How much does Pb97.5Ag1.5Sn1 cost?
Pb97.5Ag1.5Sn1 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sources
- ASTM B32 Standard Specification for Solder Metal — ASTM International (2020)
- J-STD-006 Requirements for Electronic Grade Solder Alloys — IPC (2013)
- ASM Handbook Vol. 6 — Welding, Brazing and Soldering (Solder Alloys) — ASM International (1993)
- NIST Database for Solder Properties with Emphasis on New Lead-free Solders — NIST/Colorado School of Mines (2002)
- High-temperature (high-lead) solder alloy datasheets — Indium Corporation / AIM Solder (2023)
Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.