Solder & Low-Melting Alloy Pb50Sn50E
ISO 9453-112
Pb50Sn50E is the same nominal 50Pb/50Sn tin-lead solder composition produced to tighter E-grade impurity limits for higher-reliability soldering.
Reference datasheet — Pb50Sn50E is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.
What is Pb50Sn50E?
Pb50Sn50E is the same nominal 50Pb/50Sn tin-lead solder composition produced to tighter E-grade impurity limits for higher-reliability soldering. The controlled chemistry reduces dross and joint defects, and the alloy is available as bar, solid and cored wire, foil, stamped preforms, paste and powder for repeatable process control. Properties are those of the 50/50 system — 42 MPa tensile, 27 MPa yield, 60 % elongation, 14 HB, 100 °C maximum service — so it creeps under sustained load and remains lead-bearing. Standard Pb50Sn50 is the lower-cost option where impurity limits are not specified. Pb50Sn50E has a density of 8.87 g/cm³ (0.32 lb/in³), heavier than 57% of solder & low-melting alloy grades. It melts at 183°C (361 °F). Pb50Sn50E has a yield strength of 27 MPa (3.92 ksi) and a tensile strength of 42 MPa (6.09 ksi) — weaker than 51% of solder & low-melting alloy grades. Elongation at break is 60% and the elastic modulus is 25 GPa (3.63 Msi).
What is Pb50Sn50E used for?
- precision plumbing joints
- quality-controlled soft soldering
- sheet metal work requiring low-impurity solder
Advantages
- Ductile — tolerates forming and impact — 60%, better than 99% of solder & low-melting alloy grades
Limitations
- Hard to polish — 20/100, worse than 88% of solder & low-melting alloy grades
Pb50Sn50E properties
Typical room-temperature values; bars are the position among solder & low-melting alloy grades.
Physical3
Pb50Sn50E has a density of 8.87 g/cm³ (0.32 lb/in³), heavier than 57% of solder & low-melting alloy grades. It melts at 183°C (361 °F).
Mechanical10
Pb50Sn50E has a yield strength of 27 MPa (3.92 ksi) and a tensile strength of 42 MPa (6.09 ksi) — weaker than 51% of solder & low-melting alloy grades. Elongation at break is 60% and the elastic modulus is 25 GPa (3.63 Msi).
Thermal6
Pb50Sn50E is rated for continuous service to 100°C (212 °F). It conducts heat at 50 W/m·K (28.9 BTU/hr·ft·°F), better than 63% of solder & low-melting alloy grades. Thermal expansion is 23.4 µm/m·K (13 µin/in·°F).
Electrical3
Pb50Sn50E conducts electricity at 10.9 % IACS, better than 63% of solder & low-melting alloy grades.
Chemical & Environmental3
Corrosion resistance is fair (45/100), worse than 52% of solder & low-melting alloy grades.
Sustainability4
Producing a kilogram of Pb50Sn50E takes about 175 MJ of energy and emits 9 kg of CO₂ — less than 54% of solder & low-melting alloy grades. Typical recycled content is 15%.
Manufacturability6
Pb50Sn50E's machinability is poor (30/100, worse than 60% of solder & low-melting alloy grades); formability excellent (92/100).
Common Calculations5
Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.
Strength versus weight in the solder & low-melting alloy family
Yield strength against density for every solder & low-melting alloy grade FabDigit runs. Pb50Sn50E is highlighted; hover a dot for its name, or open the interactive family chart.
Working with Pb50Sn50E
Is Pb50Sn50E easy to machine?
Very soft and smearing — use sharp high-rake tools, light cuts and paraffin/alcohol lubricant; parts are normally cast, extruded or stamped rather than machined.
Can Pb50Sn50E be welded?
Not welded; it is itself a filler metal — join at 220–260 °C with rosin/no-clean flux and avoid overheating to limit Cu6Sn5 growth and dross.
Can Pb50Sn50E be formed, bent or molded?
Extrudes and rolls easily at room temperature into wire, ribbon and stamped preforms; work-hardening is negligible because it recrystallises at RT.
Pb50Sn50E chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Snnominal 50 % tin | 49.5 – 51 | 50 |
| SbE-grade (electronic) impurity limit | ≤ 0.12 | 0.02 |
| Bi | ≤ 0.1 | 0.02 |
| Cu | ≤ 0.05 | 0.01 |
| Ag | ≤ 0.02 | 0.01 |
| Fe | ≤ 0.02 | 0.01 |
| As | ≤ 0.03 | 0.01 |
| Znkept very low to avoid dross/dewetting | ≤ 0 | 0 |
| Al | ≤ 0 | 0 |
| Cd | ≤ 0 | 0 |
| others totalsum of unspecified impurities | ≤ 0.08 | |
| Pbbalance, ~50 % | balance |
What surface finishes work on Pb50Sn50E?
Cannot be anodised or polished usefully; clean flux residues (IPA or saponifier), and expect a dull grey oxide film that does not affect solderability of the joint.
Equivalent designations
Standards and trade names that resolve to Solder & Low-Melting Alloy Pb50Sn50E in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.
- ISO
- 9453-112
How much does Pb50Sn50E cost?
Pb50Sn50E is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Pb50Sn50E — frequently asked
What is Pb50Sn50E used for?
Pb50Sn50E is typically used for precision plumbing joints, quality-controlled soft soldering and sheet metal work requiring low-impurity solder. In short: low-impurity 50/50 solder; wide product-form range; reliability-grade chemistry.
What is the yield strength of Pb50Sn50E?
Pb50Sn50E has a typical yield strength of 27 MPa (3.92 ksi) and a tensile strength of 42 MPa (6.09 ksi) — weaker than 51% of solder & low-melting alloy grades.
Is Pb50Sn50E easy to machine?
Not especially — machinability is rated poor (30/100, worse than 60% of solder & low-melting alloy grades). Very soft and smearing — use sharp high-rake tools, light cuts and paraffin/alcohol lubricant; parts are normally cast, extruded or stamped rather than machined.
Can Pb50Sn50E be welded?
Not welded; it is itself a filler metal — join at 220–260 °C with rosin/no-clean flux and avoid overheating to limit Cu6Sn5 growth and dross.
What surface finishes work on Pb50Sn50E?
Cannot be anodised or polished usefully; clean flux residues (IPA or saponifier), and expect a dull grey oxide film that does not affect solderability of the joint.
Can Pb50Sn50E be formed, bent or molded?
Extrudes and rolls easily at room temperature into wire, ribbon and stamped preforms; work-hardening is negligible because it recrystallises at RT.
What is the maximum service temperature of Pb50Sn50E?
Pb50Sn50E is rated for continuous use to about 100°C (212 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
How much does Pb50Sn50E cost?
Pb50Sn50E is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sources
- ASTM B32 Standard Specification for Solder Metal — ASTM International (2020)
- J-STD-006 Requirements for Electronic Grade Solder Alloys — IPC (2013)
- ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys (Solders) — ASM International (1990)
- GB/T 3131 (2020)
- Sn50Pb50 solder alloy datasheets — Indium Corporation / AIM Solder / Kester (2023)
Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.