Solder & Low-Melting Alloy Sn60Pb39Cu1
Sn60Pb39Cu1 is a copper-doped Sn60Pb40 tin-lead solder in which the copper addition suppresses dissolution of copper from PCB pads and pot linings, extending wave-pot alloy life.
Reference datasheet — Sn60Pb39Cu1 is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.
What is Sn60Pb39Cu1?
Sn60Pb39Cu1 is a copper-doped Sn60Pb40 tin-lead solder in which the copper addition suppresses dissolution of copper from PCB pads and pot linings, extending wave-pot alloy life. It is stocked as bar, solid and RA-cored wire, paste, foil, preforms and powder, with as-soldered values of 52 MPa tensile, 30 MPa yield, 35 % elongation and 16 HB. Service is limited to about 100 °C, pot temperature should stay at or below 270 °C to limit dross and Cu6Sn5 sludge, and the lead content restricts use to RoHS-exempt work. Plain Sn60Pb40 or Sn60Pb40E is the alternative where copper leaching is not a concern. Sn60Pb39Cu1 has a density of 8.5 g/cm³ (0.307 lb/in³), lighter than 52% of solder & low-melting alloy grades. It melts at 183°C (361 °F). Sn60Pb39Cu1 has a yield strength of 30 MPa (4.35 ksi) and a tensile strength of 52 MPa (7.54 ksi) — stronger than 61% of solder & low-melting alloy grades. Elongation at break is 35% and the elastic modulus is 30 GPa (4.35 Msi).
What is Sn60Pb39Cu1 used for?
- Wave soldering pot alloy
- PCB pad protection during wave soldering
- Selective soldering pots
- Through-hole assembly with thin copper plating
- Copper terminal and lug hand soldering
- Reflow solder paste and preform joints
- Cored-wire rework
Limitations
- Difficult to machine — 20/100, worse than 94% of solder & low-melting alloy grades
Sn60Pb39Cu1 properties
Typical room-temperature values; bars are the position among solder & low-melting alloy grades.
Physical3
Sn60Pb39Cu1 has a density of 8.5 g/cm³ (0.307 lb/in³), lighter than 52% of solder & low-melting alloy grades. It melts at 183°C (361 °F).
Mechanical11
Sn60Pb39Cu1 has a yield strength of 30 MPa (4.35 ksi) and a tensile strength of 52 MPa (7.54 ksi) — stronger than 61% of solder & low-melting alloy grades. Elongation at break is 35% and the elastic modulus is 30 GPa (4.35 Msi).
Thermal6
Sn60Pb39Cu1 is rated for continuous service to 100°C (212 °F). It conducts heat at 50 W/m·K (28.9 BTU/hr·ft·°F), better than 63% of solder & low-melting alloy grades. Thermal expansion is 24.5 µm/m·K (13.6 µin/in·°F).
Electrical3
Sn60Pb39Cu1 conducts electricity at 11.5 % IACS, better than 71% of solder & low-melting alloy grades.
Chemical & Environmental3
Corrosion resistance is fair (45/100), worse than 52% of solder & low-melting alloy grades.
Sustainability4
Producing a kilogram of Sn60Pb39Cu1 takes about 205 MJ of energy and emits 10.5 kg of CO₂ — more than 54% of solder & low-melting alloy grades. Typical recycled content is 35%.
Manufacturability7
Sn60Pb39Cu1's machinability is poor (20/100, worse than 94% of solder & low-melting alloy grades); weldability poor (20/100); formability excellent (90/100).
Common Calculations5
Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.
Strength versus weight in the solder & low-melting alloy family
Yield strength against density for every solder & low-melting alloy grade FabDigit runs. Sn60Pb39Cu1 is highlighted; hover a dot for its name, or open the interactive family chart.
Working with Sn60Pb39Cu1
Is Sn60Pb39Cu1 easy to machine?
Rarely machined; if trimmed, use sharp high-rake tools, paraffin/kerosene lube and low speeds — the alloy smears and loads cutting edges, and Pb dust/swarf needs controlled collection.
Can Sn60Pb39Cu1 be welded?
Not fusion welded; joints are made by soldering at 230–270 °C pot/iron temperature with RA/RMA or no-clean flux, and remelted joints simply re-wet.
Can Sn60Pb39Cu1 be formed, bent or molded?
Cast to bar/ingot, extruded and drawn to wire, or rolled to foil at room temperature with essentially unlimited ductility; keep pot temperature ≤270 °C to limit dross and Cu6Sn5 sludge.
Sn60Pb39Cu1 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Sn | 59 – 61 | 60 |
| Cuadded to pre-saturate the melt and cut copper dissolution | 0.7 – 1.3 | 1 |
| Sbimpurity limit | ≤ 0.2 | |
| Biimpurity limit | ≤ 0.1 | |
| Agimpurity limit | ≤ 0.05 | |
| Asimpurity limit | ≤ 0.03 | |
| Feimpurity limit | ≤ 0.02 | |
| Znimpurity limit; degrades wetting | ≤ 0 | |
| Alimpurity limit; causes gritty dross | ≤ 0 | |
| Cdimpurity limit | ≤ 0 | |
| Pbbalance; alloy is not RoHS compliant | balance |
What surface finishes work on Sn60Pb39Cu1?
Joints are cleaned per flux type (IPA/DI wash for RA, none for no-clean); the surface tarnishes to matte grey but takes conformal coating well — do not plate or anodize.
How much does Sn60Pb39Cu1 cost?
Sn60Pb39Cu1 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sn60Pb39Cu1 — frequently asked
What is Sn60Pb39Cu1 used for?
Sn60Pb39Cu1 is typically used for wave soldering pot alloy, PCB pad protection during wave soldering, selective soldering pots, through-hole assembly with thin copper plating, copper terminal and lug hand soldering and reflow solder paste and preform joints. In short: copper-leach resistant solder; long pot-life wave alloy; leaded, RoHS-restricted.
What is the yield strength of Sn60Pb39Cu1?
Sn60Pb39Cu1 has a typical yield strength of 30 MPa (4.35 ksi) and a tensile strength of 52 MPa (7.54 ksi) — stronger than 61% of solder & low-melting alloy grades.
Is Sn60Pb39Cu1 easy to machine?
Not especially — machinability is rated poor (20/100, worse than 94% of solder & low-melting alloy grades). Rarely machined; if trimmed, use sharp high-rake tools, paraffin/kerosene lube and low speeds — the alloy smears and loads cutting edges, and Pb dust/swarf needs controlled collection.
Can Sn60Pb39Cu1 be welded?
Not readily — weldability is rated poor (20/100). Not fusion welded; joints are made by soldering at 230–270 °C pot/iron temperature with RA/RMA or no-clean flux, and remelted joints simply re-wet.
What surface finishes work on Sn60Pb39Cu1?
Joints are cleaned per flux type (IPA/DI wash for RA, none for no-clean); the surface tarnishes to matte grey but takes conformal coating well — do not plate or anodize.
Can Sn60Pb39Cu1 be formed, bent or molded?
Cast to bar/ingot, extruded and drawn to wire, or rolled to foil at room temperature with essentially unlimited ductility; keep pot temperature ≤270 °C to limit dross and Cu6Sn5 sludge.
What is the maximum service temperature of Sn60Pb39Cu1?
Sn60Pb39Cu1 is rated for continuous use to about 100°C (212 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
How much does Sn60Pb39Cu1 cost?
Sn60Pb39Cu1 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.
Sources
- ISO 9453 — Soft solder alloys: chemical compositions and forms — ISO (2020)
- ASTM B32 — Standard Specification for Solder Metal — ASTM International (2020)
- GB/T 3131 (2020)
- ASM Handbook Vol. 3: Alloy Phase Diagrams / Vol. 6: Welding, Brazing and Soldering — solder alloy property tables — ASM International (1993)
- J-STD-006 — Requirements for Electronic Grade Solder Alloys and Fluxed/Non-Fluxed Solid Solders — IPC (2013)
- Tin-lead solder bar and cored wire datasheets (Cu-bearing 60/40 grades) — solder producers (AIM, Nihon Superior, / ) (2024)
Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.