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Copper Alloy C68800-H01

Supply condition

UNS C68800

H01 = quarter hard

Light cold work when moderate strength must be kept together with bending across the grain.

High cost $$$$

Values for the H01 condition

Other C68800 tempers and conditions

C68800 is listed in 8 conditions; see the grade overview at C68800.

Compare all 8 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Annealed to 0.035 mm grain size
Softest commercial strip condition for deep drawing and severe forming.2755454070 HRB—
Annealed to 0.015 mm grain size
Fine-grain annealed strip: best combination of formability and a smooth drawn surface.3105653675 HRB—
H01This page
Quarter hard
Light cold work when moderate strength must be kept together with bending across the grain.45062020155 HB18 % IACS
Half hard
Balanced temper for formed contacts and clips that still need 90° bends.51765512168 HB18 % IACS
H04Default
Full hard
Most commonly stocked strip temper: high strength with usable bending along the grain.620725590 HRB—
Extra hard
Higher strength for flat stampings with only gentle forming along the rolling direction.690772492 HRB—
Spring hard
Spring temper for connector contacts and leaf springs needing high elastic limit and low relaxation.745814394 HRB—
Extra spring hard
Maximum-strength temper for flat springs and contact fingers formed only along the grain.772841395 HRB—

What is C68800-H01?

C68800-H01 is C68800 supplied in the H01 condition — light cold work when moderate strength must be kept together with bending across the grain. C68800-H01 has a yield strength of 450 MPa (65.3 ksi) and a tensile strength of 620 MPa (89.9 ksi) — stronger than 86% of copper alloy grades. Elongation at break is 20% and the elastic modulus is 117 GPa (17 Msi). C68800-H01 has a density of 8.17 g/cm³ (0.295 lb/in³), lighter than 86% of copper alloy grades. It melts at 932°C (1,710 °F). H04 is the default condition FabDigit quotes; H01 is available on request or by drawing note.

Advantages

  • Low embodied carbon — 3.1 kg CO₂/kg, better than 95% of copper alloy grades
  • High strength — 450 MPa (65.3 ksi), better than 86% of copper alloy grades
  • Forms and bends easily — 62/100, better than 77% of copper alloy grades

Limitations

  • Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades
  • Difficult to weld — 25/100, worse than 78% of copper alloy grades

C68800-H01 properties

Typical room-temperature values for C68800-H01; 21 are specific to this condition. Other listed values are C68800 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C68800-H01 has a density of 8.17 g/cm³ (0.295 lb/in³), lighter than 86% of copper alloy grades. It melts at 932°C (1,710 °F).

Density8.17 g/cm³0.3 lb/in³
Melting Point (Solidus)932°C1,710 °F
Liquidus Temperature949°C1,740 °F

Mechanical11

C68800-H01 has a yield strength of 450 MPa (65.3 ksi) and a tensile strength of 620 MPa (89.9 ksi) — stronger than 86% of copper alloy grades. Elongation at break is 20% and the elastic modulus is 117 GPa (17 Msi).

Elastic (Young's) Modulus117 GPa17 Msi
Shear Modulus44 GPa6.4 Msi
Bulk Modulus108 GPa15.7 Msi
Poisson's Ratio0.32
Tensile Strength (Ultimate)620 MPa89.9 ksi
Yield Strength (0.2% offset)450 MPa65.3 ksi
Elongation at Break20%
Shear Strength390 MPa56.6 ksi
Fatigue Strength (Endurance Limit)205 MPa29.7 ksi
Hardness, Rockwell B82 HRB
Hardness, Vickers165 HV

Thermal6

C68800-H01 is rated for continuous service to 150°C (302 °F). It conducts heat at 71 W/m·K (41 BTU/hr·ft·°F), worse than 54% of copper alloy grades. Thermal expansion is 18.4 µm/m·K (10.2 µin/in·°F).

Thermal Conductivity71 W/m·K41 BTU/hr·ft·°F
Specific Heat Capacity376 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)18.4 µm/m·K10.2 µin/in·°F
Latent Heat of Fusion200 J/g86 BTU/lb
Max Service Temperature (continuous)150°C302 °F
Min Service Temperature-200°C-328 °F

Electrical3

C68800-H01 conducts electricity at 18 % IACS, better than 51% of copper alloy grades.

Electrical Conductivity18 % IACS
Electrical Resistivity9.6×10⁻⁸ Ω·m3.78 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (68/100), better than 69% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.26 V
Corrosion ResistanceGood68/100
Chemical Resistance SummaryGood resistance to seawater, brackish water and mild atmospheres thanks to an alumina-rich film; resists impingement/erosion and dezincification better than plain brasses. Avoid ammonia and amine environments (stress-corrosion cracking), oxidising acids, and strongly aerated chloride under stress.

Sustainability4

Producing a kilogram of C68800-H01 takes about 46 MJ of energy and emits 3.1 kg of CO₂ — less than 94% of copper alloy grades. Typical recycled content is 35%.

Embodied Energy (primary production)46 MJ/kg19,776 BTU/lb
Embodied Carbon (primary production)3.1 kg CO₂/kg
Embodied Water250 L/kg30 gal/lb
Typical Recycled Content35%

Manufacturability8

C68800-H01's machinability is poor (33/100, worse than 53% of copper alloy grades); weldability poor (25/100); formability good (62/100).

MachinabilityPoor33/100
Machinability Rating (AISI 1212 = 100 %)40%
WeldabilityPoor25/100
Formability (cold)Good62/100
CastabilityPoor30/100
Brazeability / SolderabilityVery good70/100
PolishabilityVery good75/100
Anodizing Responsen/a — copper-base alloy; use bright dipping, passivation or tin/nickel plating instead

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C68800-H01

Is C68800 easy to machine?

Chips are tough and gummy — rate ~30% of free-cutting brass; use sharp positive-rake carbide, high speed, flood coolant, and avoid dwelling in hard tempers.

Can C68800 be welded?

Arc (TIG/MIG) welding is not recommended because of the aluminium oxide film; use resistance spot/seam welding, silver brazing with aggressive flux, or soft soldering after film removal.

Can C68800 be formed, bent or molded?

Stamp and form in OS015/H02 for tight radii; in H04–H10 restrict bends to along the rolling direction and allow high springback due to the ~620–770 MPa yield.

What surface finishes work on C68800?

Not anodizable; degrease and acid-activate (fluoride-bearing pickle) to strip the Al₂O₃ film before nickel/tin/gold plating, otherwise leave as bright-rolled or mechanically polished.

C68800 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Cu71 – 7773.5
Alforms protective alumina-rich film3 – 3.83.4
Cograin refiner / strengthener0.25 – 0.550.4
Asdezincification inhibitor0.02 – 0.080.04
Fe≤ 0.05—
Pb≤ 0.05—
Znbalance—

C68800-H01 — frequently asked

What is C68800-H01 used for?

C68800-H01 is typically used for springs, electrical connectors and corrosion-resistant fasteners. In short: highest-strength brass strip; spring-temper aluminum brass; not arc weldable.

What is the yield strength of C68800-H01?

C68800-H01 has a typical yield strength of 450 MPa (65.3 ksi) and a tensile strength of 620 MPa (89.9 ksi) — stronger than 86% of copper alloy grades. Strength varies by condition: see the 8 listed tempers.

Is C68800-H01 easy to machine?

Not especially — machinability is rated poor (33/100, worse than 53% of copper alloy grades). Chips are tough and gummy — rate ~30% of free-cutting brass; use sharp positive-rake carbide, high speed, flood coolant, and avoid dwelling in hard tempers.

Can C68800-H01 be welded?

Not readily — weldability is rated poor (25/100). Arc (TIG/MIG) welding is not recommended because of the aluminium oxide film; use resistance spot/seam welding, silver brazing with aggressive flux, or soft soldering after film removal.

What surface finishes work on C68800-H01?

Not anodizable; degrease and acid-activate (fluoride-bearing pickle) to strip the Al₂O₃ film before nickel/tin/gold plating, otherwise leave as bright-rolled or mechanically polished.

Can C68800-H01 be formed, bent or molded?

Stamp and form in OS015/H02 for tight radii; in H04–H10 restrict bends to along the rolling direction and allow high springback due to the ~620–770 MPa yield.

What is the maximum service temperature of C68800-H01?

C68800-H01 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C68800-H04 and C68800-OS035?

H04 is the default condition — most commonly stocked strip temper: high strength with usable bending along the grain. OS035: softest commercial strip condition for deep drawing and severe forming. Yield strength is 620 MPa in H04 versus 275 MPa in OS035.

Sources

  1. ASTM B592 — Copper-Zinc-Aluminum-Cobalt Alloy (UNS C68800) Plate, Sheet, Strip and Rolled Bar — ASTM International (2021)
  2. CDA Alloy Datasheet C68800 — Copper Development Association (copper.org) (2023)
  3. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  4. Alloy 688 high-performance strip data — Olin Brass / Global Brass and Copper (2018)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.