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Copper Alloy C66900-H01

Supply condition

UNS C66900

H01 = quarter hard

Lightest rolled temper — use when moderate strength must be combined with substantial bending and forming.

High cost $$$$

Values for the H01 condition

Other C66900 tempers and conditions

C66900 is listed in 8 conditions; see the grade overview at C66900.

Compare all 8 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Soft annealed
Pick when maximum drawability/bendability is needed before subsequent forming or in-service work hardening.2054804555 HRB—
H01This page
Quarter hard
Lightest rolled temper — use when moderate strength must be combined with substantial bending and forming.3805852275 HRB—
Half hard
General-purpose stamping temper balancing strength with 90° bend capability across the grain.4506251582 HRB—
Three-quarter hard
Intermediate step when H02 lacks yield strength but H04 is too stiff to form.5106601185 HRB—
H04Default
Full hard
Most commonly stocked condition — high strength and wear resistance for flat structural parts and gentle bends.565700788 HRB—
Extra hard
Use for flat springs, wear washers and shims where high yield strength matters more than bend ductility.640760592 HRB—
Spring hard
Spring-quality strip for contacts, clips and retaining elements requiring high elastic limit.690800495 HRB—
Extra spring hard
Highest-strength rolled condition; specify only for flat or large-radius parts with minimal forming.725830397 HRB—

What is C66900-H01?

C66900-H01 is C66900 supplied in the H01 condition — lightest rolled temper — use when moderate strength must be combined with substantial bending and forming. C66900-H01 has a yield strength of 380 MPa (55.1 ksi) and a tensile strength of 585 MPa (84.8 ksi) — stronger than 77% of copper alloy grades. Elongation at break is 22% and the elastic modulus is 105 GPa (15.2 Msi). C66900-H01 has a density of 8.1 g/cm³ (0.293 lb/in³), lighter than 86% of copper alloy grades. It melts at 880°C (1,616 °F). H04 is the default condition FabDigit quotes; H01 is available on request or by drawing note.

Advantages

  • High strength — 380 MPa (55.1 ksi), better than 77% of copper alloy grades

Limitations

  • Low electrical conductivity — 4.5 % IACS, worse than 98% of copper alloy grades
  • Poor heat conductor — 27 W/m·K (15.6 BTU/hr·ft·°F), worse than 97% of copper alloy grades
  • Limited service temperature — 175°C (347 °F), worse than 92% of copper alloy grades

C66900-H01 properties

Typical room-temperature values for C66900-H01; 10 are specific to this condition. Other listed values are C66900 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C66900-H01 has a density of 8.1 g/cm³ (0.293 lb/in³), lighter than 86% of copper alloy grades. It melts at 880°C (1,616 °F).

Density8.1 g/cm³0.29 lb/in³
Melting Point (Solidus)880°C1,616 °F
Liquidus Temperature920°C1,688 °F

Mechanical12

C66900-H01 has a yield strength of 380 MPa (55.1 ksi) and a tensile strength of 585 MPa (84.8 ksi) — stronger than 77% of copper alloy grades. Elongation at break is 22% and the elastic modulus is 105 GPa (15.2 Msi).

Elastic (Young's) Modulus105 GPa15.2 Msi
Shear Modulus39 GPa5.7 Msi
Bulk Modulus105 GPa15.2 Msi
Poisson's Ratio0.33
Tensile Strength (Ultimate)585 MPa84.8 ksi
Yield Strength (0.2% offset)380 MPa55.1 ksi
Elongation at Break22%
Shear Strength355 MPa51.5 ksi
Fatigue Strength (Endurance Limit)210 MPa30.5 ksi
Hardness, Brinell185 HB
Hardness, Rockwell B75 HRB
Hardness, Vickers150 HV

Thermal6

C66900-H01 is rated for continuous service to 175°C (347 °F). It conducts heat at 27 W/m·K (15.6 BTU/hr·ft·°F), worse than 97% of copper alloy grades. Thermal expansion is 20 µm/m·K (11.1 µin/in·°F).

Thermal Conductivity27 W/m·K15.6 BTU/hr·ft·°F
Specific Heat Capacity380 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)20 µm/m·K11.1 µin/in·°F
Latent Heat of Fusion175 J/g75.2 BTU/lb
Max Service Temperature (continuous)175°C347 °F
Min Service Temperature-196°C-321 °F

Electrical3

C66900-H01 conducts electricity at 4.5 % IACS, worse than 98% of copper alloy grades.

Electrical Conductivity4.5 % IACS
Electrical Resistivity3.8×10⁻⁷ Ω·m15 µΩ·in
Magnetic Responsenon-magnetic (paramagnetic; μr ≈ 1.00)

Chemical & Environmental3

Corrosion resistance is good (62/100), worse than 57% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.3 V
Corrosion ResistanceGood62/100
Chemical Resistance SummaryGood in fresh water, mild atmospheres and neutral salts; manganese improves tarnish/erosion behaviour, but as a high-zinc brass it is subject to dezincification and stress-corrosion cracking in ammonia, amines and stagnant chlorides — avoid oxidizing acids and mercury compounds.

Sustainability4

Producing a kilogram of C66900-H01 takes about 55 MJ of energy and emits 3.5 kg of CO₂ — less than 72% of copper alloy grades. Typical recycled content is 40%.

Embodied Energy (primary production)55 MJ/kg23,646 BTU/lb
Embodied Carbon (primary production)3.5 kg CO₂/kg
Embodied Water400 L/kg47.9 gal/lb
Typical Recycled Content40%

Manufacturability8

C66900-H01's machinability is poor (30/100, worse than 67% of copper alloy grades); weldability fair (40/100); formability good (60/100).

MachinabilityPoor30/100
Machinability Rating (AISI 1212 = 100 %)28%
WeldabilityFair40/100
Formability (cold)Good60/100
CastabilityFair40/100
Brazeability / SolderabilityGood60/100
PolishabilityVery good80/100
Anodizing Responsen/a — copper alloy; use bright dip, clear lacquer, nickel or chrome plating instead

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C66900-H01

Is C66900 easy to machine?

Unleaded and work-hardened: use sharp carbide, positive rake, 0.05–0.15 mm/rev feeds and flood coolant; expect gummy chips and ~30 % of free-cutting brass throughput.

Can C66900 be welded?

Best joined by resistance spot/seam welding or silver brazing; fusion welding causes zinc fuming, porosity and loss of temper — use local extraction and avoid heating cold-worked strip above ~250 °C.

Can C66900 be formed, bent or molded?

Form in O60/H01–H02; in H04 and harder restrict to gentle bends with generous radii and bend across the rolling direction, and stress-relieve 200–260 °C to prevent season cracking.

What surface finishes work on C66900?

Not anodizable — bright dip and clear lacquer, or nickel/chrome/tin plating after thorough oxide removal (Mn-rich film needs activated cleaning); polishes to a bright warm finish.

C66900 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Cuper CDA/UNS registration for C66900; confirm against mill certificate63 – 6865.5
Mnprincipal strengthening addition — distinguishes C66900 from C66700/C6680011 – 1312
Fe≤ 0.5—
Al≤ 0.5—
Pb≤ 0.05—
Znremainder, nominally ~22–24 %balance—

C66900-H01 — frequently asked

What is C66900-H01 used for?

C66900-H01 is typically used for gears and wear parts, structural fasteners and marine hardware. In short: highest-strength manganese brass; 700 MPa tensile strip; wear-resistant structural grade.

What is the yield strength of C66900-H01?

C66900-H01 has a typical yield strength of 380 MPa (55.1 ksi) and a tensile strength of 585 MPa (84.8 ksi) — stronger than 77% of copper alloy grades. Strength varies by condition: see the 8 listed tempers.

Is C66900-H01 easy to machine?

Not especially — machinability is rated poor (30/100, worse than 67% of copper alloy grades). Unleaded and work-hardened: use sharp carbide, positive rake, 0.05–0.15 mm/rev feeds and flood coolant; expect gummy chips and ~30 % of free-cutting brass throughput.

Can C66900-H01 be welded?

With care — weldability is rated fair (40/100). Best joined by resistance spot/seam welding or silver brazing; fusion welding causes zinc fuming, porosity and loss of temper — use local extraction and avoid heating cold-worked strip above ~250 °C.

What surface finishes work on C66900-H01?

Not anodizable — bright dip and clear lacquer, or nickel/chrome/tin plating after thorough oxide removal (Mn-rich film needs activated cleaning); polishes to a bright warm finish.

Can C66900-H01 be formed, bent or molded?

Form in O60/H01–H02; in H04 and harder restrict to gentle bends with generous radii and bend across the rolling direction, and stress-relieve 200–260 °C to prevent season cracking.

What is the maximum service temperature of C66900-H01?

C66900-H01 is rated for continuous use to about 175°C (347 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C66900-H04 and C66900-O60?

H04 is the default condition — most commonly stocked condition — high strength and wear resistance for flat structural parts and gentle bends. O60: pick when maximum drawability/bendability is needed before subsequent forming or in-service work hardening. Yield strength is 565 MPa in H04 versus 205 MPa in O60.

Sources

  1. CDA/UNS Copper Alloy Registration & Alloy Data — C669xx manganese brasses — Copper Development Association (2023)
  2. ASM Handbook Vol. 2 — Properties and Selection: Nonferrous Alloys and Special-Purpose Materials — ASM International (1990)
  3. ASM Handbook Vol. 13B — Corrosion: Materials (brasses, dezincification, SCC) — ASM International (2005)
  4. ASTM B36/B36M — Brass Plate, Sheet, Strip and Rolled Bar (temper designations per ASTM B601) — ASTM International (2018)
  5. ASTM B601 — Temper Designations for Copper and Copper Alloys — ASTM International (2019)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.