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Copper Alloy C27200-H08

Supply condition

UNS C27200

H08 = spring hard

Spring temper strip/wire for clips and contacts; very limited bendability, prone to SCC if not stress relieved.

High cost $$$$

Values for the H08 condition

Other C27200 tempers and conditions

C27200 is listed in 10 conditions; see the grade overview at C27200.

Compare all 10 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Annealed to 0.050 mm grain size
Coarser-grain anneal for the deepest draws where slight orange peel is acceptable.973176255 HB27 % IACS
OS025Default
Annealed to 0.025 mm grain size
Softest commercial condition — pick for deep drawing, spinning and severe forming.1103305560 HB27 % IACS
As hot rolled
Economical as-hot-worked rod, plate and shapes for parts that will be machined or annealed later.1253405065 HB27 % IACS
Quarter hard
Light temper for parts needing moderate bending plus a little more stiffness than annealed.2753854375 HB—
Half hard
Most common strip temper for stamped hardware needing 90° bends and useful strength.34542723110 HB—
Hard drawn
Cold-drawn round product temper — pick for straight, strong rod, wire and tube stock for machining or bending.34547015130 HB—
Three-quarter hard
Intermediate temper when H02 is too soft and H04 too brittle for the bend radius.38047015130 HB26 % IACS
Full hard
Standard high-strength strip/sheet temper for flat springs, contacts and stiff stampings.4145108145 HB—
Extra hard
Choose for maximum flat-strip strength where only gentle forming across grain is required.4485705165 HB—
H08This page
Spring hard
Spring temper strip/wire for clips and contacts; very limited bendability, prone to SCC if not stress relieved.5006204180 HB26 % IACS

What is C27200-H08?

C27200-H08 is C27200 supplied in the H08 condition — spring temper strip/wire for clips and contacts; very limited bendability, prone to SCC if not stress relieved. C27200-H08 has a yield strength of 500 MPa (72.5 ksi) and a tensile strength of 620 MPa (89.9 ksi) — stronger than 89% of copper alloy grades. Elongation at break is 4% and the elastic modulus is 105 GPa (15.2 Msi). C27200-H08 has a density of 8.47 g/cm³ (0.306 lb/in³), lighter than 68% of copper alloy grades. It melts at 905°C (1,661 °F). OS025 is the default condition FabDigit quotes; H08 is available on request or by drawing note.

Advantages

  • Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
  • High strength — 500 MPa (72.5 ksi), better than 89% of copper alloy grades

Limitations

  • Limited service temperature — 120°C (248 °F), worse than 100% of copper alloy grades
  • Needs corrosion protection — 45/100, worse than 98% of copper alloy grades
  • Limited ductility — 4%, worse than 96% of copper alloy grades
  • High embodied carbon — 4.5 kg CO₂/kg, worse than 79% of copper alloy grades
  • Limited formability — 18/100, worse than 75% of copper alloy grades

C27200-H08 properties

Typical room-temperature values for C27200-H08; 20 are specific to this condition. Other listed values are C27200 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C27200-H08 has a density of 8.47 g/cm³ (0.306 lb/in³), lighter than 68% of copper alloy grades. It melts at 905°C (1,661 °F).

Density8.47 g/cm³0.31 lb/in³
Melting Point (Solidus)905°C1,661 °F
Liquidus Temperature930°C1,706 °F

Mechanical13

C27200-H08 has a yield strength of 500 MPa (72.5 ksi) and a tensile strength of 620 MPa (89.9 ksi) — stronger than 89% of copper alloy grades. Elongation at break is 4% and the elastic modulus is 105 GPa (15.2 Msi).

Elastic (Young's) Modulus105 GPa15.2 Msi
Shear Modulus39 GPa5.7 Msi
Bulk Modulus111 GPa16.1 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)620 MPa89.9 ksi
Yield Strength (0.2% offset)500 MPa72.5 ksi
Elongation at Break4%
Reduction in Area20%
Shear Strength380 MPa55.1 ksi
Fatigue Strength (Endurance Limit)165 MPa23.9 ksi
Hardness, Brinell180 HB
Hardness, Rockwell B91 HRB
Hardness, Vickers195 HV

Thermal6

C27200-H08 is rated for continuous service to 120°C (248 °F). It conducts heat at 121 W/m·K (69.9 BTU/hr·ft·°F), better than 68% of copper alloy grades. Thermal expansion is 20.3 µm/m·K (11.3 µin/in·°F).

Thermal Conductivity121 W/m·K69.9 BTU/hr·ft·°F
Specific Heat Capacity375 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)20.3 µm/m·K11.3 µin/in·°F
Latent Heat of Fusion160 J/g68.8 BTU/lb
Max Service Temperature (continuous)120°C248 °F
Min Service Temperature-200°C-328 °F

Electrical3

C27200-H08 conducts electricity at 26 % IACS, better than 63% of copper alloy grades.

Electrical Conductivity26 % IACS
Electrical Resistivity6.6×10⁻⁸ Ω·m2.6 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is fair (45/100), worse than 98% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.25 V
Corrosion ResistanceFair45/100
Chemical Resistance SummaryGood in fresh water, dry atmospheres and most organic media; attacked by ammonia/amines (stress-corrosion cracking), oxidizing acids, sulfides and high-velocity or stagnant chloride waters where dezincification occurs.

Sustainability4

Producing a kilogram of C27200-H08 takes about 65 MJ of energy and emits 4.5 kg of CO₂ — more than 81% of copper alloy grades. Typical recycled content is 45%.

Embodied Energy (primary production)65 MJ/kg27,945 BTU/lb
Embodied Carbon (primary production)4.5 kg CO₂/kg
Embodied Water280 L/kg33.6 gal/lb
Typical Recycled Content45%

Manufacturability8

C27200-H08's machinability is fair (42/100, better than 59% of copper alloy grades); weldability fair (38/100); formability poor (18/100).

MachinabilityFair42/100
Machinability Rating (AISI 1212 = 100 %)38%
WeldabilityFair38/100
Formability (cold)Poor18/100
CastabilityFair45/100
Brazeability / SolderabilityExcellent92/100
PolishabilityExcellent85/100
Anodizing Responsen/a — copper alloy; use lacquer, electroplate (Ni/Cr) or chemical antique/patina finishes instead

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C27200-H08

Is C27200 easy to machine?

Machinable but gummy compared with leaded C36000 (≈30 % of AISI 1212) — use sharp positive-rake tools, high speed, light feeds and good lubrication; prefer H02/H04 tempers for cleaner chips.

Can C27200 be welded?

Best joined by soldering or brazing; GTAW/oxyfuel possible with silicon-bronze filler but zinc volatilization causes porosity and fume — provide extraction and avoid resistance welding.

Can C27200 be formed, bent or molded?

Excellent cold formability in OS025/OS050 for deep drawing, spinning and stamping; interanneal at 425–600 °C and stress-relieve cold-worked parts at 260–300 °C to prevent season cracking.

What surface finishes work on C27200?

Buffs to a bright gold lustre; readily nickel/chrome/gold plated, chemically antiqued or lacquered — anodizing is not applicable to copper alloys.

C27200 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
Cuincludes silver62 – 6563
Pb≤ 0.07—
Fe≤ 0.07—
Znbalance—

C27200-H08 — frequently asked

What is C27200-H08 used for?

C27200-H08 is typically used for hardware, decorative trim, stampings and wire products. In short: low-cost decorative brass; excellent deep-drawing formability; gummy compared with C36000.

What is the yield strength of C27200-H08?

C27200-H08 has a typical yield strength of 500 MPa (72.5 ksi) and a tensile strength of 620 MPa (89.9 ksi) — stronger than 89% of copper alloy grades. Strength varies by condition: see the 10 listed tempers.

Is C27200-H08 easy to machine?

Not especially — machinability is rated fair (42/100, better than 59% of copper alloy grades). Machinable but gummy compared with leaded C36000 (≈30 % of AISI 1212) — use sharp positive-rake tools, high speed, light feeds and good lubrication; prefer H02/H04 tempers for cleaner chips.

Can C27200-H08 be welded?

With care — weldability is rated fair (38/100). Best joined by soldering or brazing; GTAW/oxyfuel possible with silicon-bronze filler but zinc volatilization causes porosity and fume — provide extraction and avoid resistance welding.

What surface finishes work on C27200-H08?

Buffs to a bright gold lustre; readily nickel/chrome/gold plated, chemically antiqued or lacquered — anodizing is not applicable to copper alloys.

Can C27200-H08 be formed, bent or molded?

Excellent cold formability in OS025/OS050 for deep drawing, spinning and stamping; interanneal at 425–600 °C and stress-relieve cold-worked parts at 260–300 °C to prevent season cracking.

What is the maximum service temperature of C27200-H08?

C27200-H08 is rated for continuous use to about 120°C (248 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C27200-OS025 and C27200-H08?

OS025 is the default condition — softest commercial condition — pick for deep drawing, spinning and severe forming. H08: spring temper strip/wire for clips and contacts; very limited bendability, prone to SCC if not stress relieved. Yield strength is 110 MPa in OS025 versus 500 MPa in H08.

Sources

  1. ASTM B36/B36M Brass Plate, Sheet, Strip and Rolled Bar — ASTM International (2018)
  2. ASTM B134/B134M Brass Wire — ASTM International (2015)
  3. CDA Copper Alloy Datasheet C27200 — Copper Development Association (2023)
  4. ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.