FabDigit

Solder & Low-Melting Alloy Sn30Pb70

ASTM Sn30 · JIS H30A · GB HLSnPb30-70

Sn30Pb70 (H30A, HLSnPb30-70) is a lead-heavy Sn-Pb solder with a very wide 183–255 °C pasty range, giving the longest working time of the common wiping alloys.

High cost $$$$

Reference datasheet — Sn30Pb70 is not in the instant-quote catalog. Upload your part and an engineer will quote it in this grade or suggest the closest stocked equivalent.

Values for the Cast condition

Sn30Pb70 tempers and conditions

Sn30Pb70 is supplied in one standard condition, Cast. Cast is the default FabDigit quotes; the values on this page are for it.

Supply forms, finishes and certifications

Ways Sn30Pb70 is supplied — form, process route, surface or paperwork — without a datasheet of their own. The property values above apply.

OptionWhat it isType
EXT-WIRE
Extruded solid wire / rodSupply form
FOIL
Rolled foil / ribbon preformSupply form
JOINT
As-soldered lap joint on copperSupply option

What is Sn30Pb70?

Sn30Pb70 (H30A, HLSnPb30-70) is a lead-heavy Sn-Pb solder with a very wide 183–255 °C pasty range, giving the longest working time of the common wiping alloys. It was the traditional choice for wiped lead joints in plumbing and lead-sheathed cable work, and is supplied cast and as extruded wire and foil. Strength is low (35 MPa tensile, 22 MPa yield, 45 % elongation, 11 HB), service tops out near 100 °C, and the high lead content excludes potable-water, food-contact and RoHS applications. Sn40Pb60 or Sn50Pb50 wet more readily where a shorter pasty range is acceptable. Sn30Pb70 has a density of 9.7 g/cm³ (0.35 lb/in³), heavier than 70% of solder & low-melting alloy grades. It melts at 183°C (361 °F). Sn30Pb70 has a yield strength of 22 MPa (3.19 ksi) and a tensile strength of 35 MPa (5.08 ksi) — weaker than 70% of solder & low-melting alloy grades. Elongation at break is 45% and the elastic modulus is 25 GPa (3.63 Msi).

What is Sn30Pb70 used for?

  • wiped lead joints
  • cable sheath sealing
  • plumbing caulking

Advantages

  • Ductile — tolerates forming and impact — 45%, better than 84% of solder & low-melting alloy grades

Sn30Pb70 properties

Typical room-temperature values for Sn30Pb70-Cast; bars are the position among solder & low-melting alloy grades.

Physical3

Sn30Pb70 has a density of 9.7 g/cm³ (0.35 lb/in³), heavier than 70% of solder & low-melting alloy grades. It melts at 183°C (361 °F).

Density9.7 g/cm³0.35 lb/in³
Melting Point (Solidus)183°C361 °F
Liquidus Temperature255°C491 °F

Mechanical10

Sn30Pb70 has a yield strength of 22 MPa (3.19 ksi) and a tensile strength of 35 MPa (5.08 ksi) — weaker than 70% of solder & low-melting alloy grades. Elongation at break is 45% and the elastic modulus is 25 GPa (3.63 Msi).

Elastic (Young's) Modulus25 GPa3.6 Msi
Shear Modulus9 GPa1.3 Msi
Bulk Modulus45 GPa6.5 Msi
Poisson's Ratio0.4
Tensile Strength (Ultimate)35 MPa5.1 ksi
Yield Strength (0.2% offset)22 MPa3.2 ksi
Elongation at Break45%
Shear Strength27 MPa3.9 ksi
Fatigue Strength (Endurance Limit)12 MPa1.7 ksi
Hardness, Brinell11 HB

Thermal6

Sn30Pb70 is rated for continuous service to 100°C (212 °F). It conducts heat at 44 W/m·K (25.4 BTU/hr·ft·°F), worse than 52% of solder & low-melting alloy grades. Thermal expansion is 27 µm/m·K (15 µin/in·°F).

Thermal Conductivity44 W/m·K25.4 BTU/hr·ft·°F
Specific Heat Capacity160 J/kg·K0.04 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)27 µm/m·K15 µin/in·°F
Latent Heat of Fusion35 J/g15 BTU/lb
Max Service Temperature (continuous)100°C212 °F
Min Service Temperature-60°C-76 °F

Electrical3

Sn30Pb70 conducts electricity at 9.3 % IACS, better than 50% of solder & low-melting alloy grades.

Electrical Conductivity9.3 % IACS
Electrical Resistivity1.85×10⁻⁷ Ω·m7.28 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is fair (45/100), worse than 52% of solder & low-melting alloy grades.

Galvanic Potential (seawater, vs SCE)-0.5 V
Corrosion ResistanceFair45/100
Chemical Resistance SummaryStable in normal atmosphere and neutral water (self-limiting oxide/carbonate film); attacked by organic acids, acetic/formic vapours, nitric acid and by soft, aggressive potable water — lead leaching makes it unlawful for drinking-water joints.

Sustainability4

Producing a kilogram of Sn30Pb70 takes about 105 MJ of energy and emits 6 kg of CO₂ — less than 69% of solder & low-melting alloy grades. Typical recycled content is 45%.

Embodied Energy (primary production)105 MJ/kg45,142 BTU/lb
Embodied Carbon (primary production)6 kg CO₂/kg
Embodied Water200 L/kg24 gal/lb
Typical Recycled Content45%

Manufacturability6

Sn30Pb70's machinability is fair (35/100, better than 58% of solder & low-melting alloy grades); formability excellent (90/100).

MachinabilityFair35/100
Formability (cold)Excellent90/100
CastabilityExcellent90/100
Brazeability / SolderabilityExcellent95/100
PolishabilityPoor30/100
Anodizing Responsen/a — not an anodizable metal

Common Calculations5

Specific Strength (UTS / density)calculated4 kN·m/kg
Specific Stiffness (E / density)calculated2.6 MN·m/kg
Modulus of Resiliencecalculated10 kJ/m³
Thermal Diffusivitycalculated28.4 mm²/s
Thermal Shock Resistance Indexcalculated2

Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.

Strength versus weight in the solder & low-melting alloy family

Yield strength against density for every solder & low-melting alloy grade FabDigit runs. Sn30Pb70 is highlighted; hover a dot for its name, or open the interactive family chart.

125102050891011Density (g/cm³)Yield strength (MPa) — log scaleSn30Pb70

Working with Sn30Pb70

Is Sn30Pb70 easy to machine?

Rarely machined; if needed use very sharp high-rake tools, low speed and paraffin/kerosene lubricant to stop smearing and tool loading.

Can Sn30Pb70 be welded?

Not fusion welded — it is a filler; join sections by re-melting with a torch or soldering pot at 300–320 °C using zinc-chloride/tallow flux.

Can Sn30Pb70 be formed, bent or molded?

Wipes, pours and hand-shapes easily in its 183–255 °C pasty range; cold-rolls or extrudes into wire/foil with almost no work hardening.

Sn30Pb70 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
SnASTM B32 grade Sn3029.5 – 31.530
Sb≤0.12 % for 'A' grade (Sn30A); 0.20–0.50 % for 'B' grade≤ 0.50.1
Bi≤ 0.25
Cu≤ 0.08
Ag≤ 0.02
Fe≤ 0.02
As≤ 0.03
Zn≤ 0.01
Al≤ 0.01
Cd≤ 0
Pbbalance

What surface finishes work on Sn30Pb70?

Wire-brush and tallow-wipe the joint while warm; the surface dulls to grey lead oxide — do not plate or anodize, and never use on potable-water or food-contact parts.

Equivalent designations

Standards and trade names that resolve to Solder & Low-Melting Alloy Sn30Pb70 in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.

ASTM
Sn30
GB (China)
HLSnPb30-70
JIS
H30A

How much does Sn30Pb70 cost?

Sn30Pb70 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.

Sn30Pb70 — frequently asked

What is Sn30Pb70 used for?

Sn30Pb70 is typically used for wiped lead joints, cable sheath sealing and plumbing caulking. In short: longest pasty range; traditional lead-wiping solder; low tin content, low cost.

What is the yield strength of Sn30Pb70?

Sn30Pb70 has a typical yield strength of 22 MPa (3.19 ksi) and a tensile strength of 35 MPa (5.08 ksi) — weaker than 70% of solder & low-melting alloy grades.

Is Sn30Pb70 easy to machine?

Not especially — machinability is rated fair (35/100, better than 58% of solder & low-melting alloy grades). Rarely machined; if needed use very sharp high-rake tools, low speed and paraffin/kerosene lubricant to stop smearing and tool loading.

Can Sn30Pb70 be welded?

Not fusion welded — it is a filler; join sections by re-melting with a torch or soldering pot at 300–320 °C using zinc-chloride/tallow flux.

What surface finishes work on Sn30Pb70?

Wire-brush and tallow-wipe the joint while warm; the surface dulls to grey lead oxide — do not plate or anodize, and never use on potable-water or food-contact parts.

Can Sn30Pb70 be formed, bent or molded?

Wipes, pours and hand-shapes easily in its 183–255 °C pasty range; cold-rolls or extrudes into wire/foil with almost no work hardening.

What is the maximum service temperature of Sn30Pb70?

Sn30Pb70 is rated for continuous use to about 100°C (212 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

How much does Sn30Pb70 cost?

Sn30Pb70 is a high-cost solder & low-melting alloy ($$$$), pricier than about 78% of the materials FabDigit quotes. Part price depends far more on geometry, tolerance and quantity than on the raw stock — upload a CAD file for a live quote.

Sources

  1. ASTM B32 — Standard Specification for Solder Metal — ASTM International (2020)
  2. ASTM B907 — Zinc, Tin and Lead Base Alloys in Ingot Form for Solder — ASTM International (2019)
  3. GB/T 3131 (2020)
  4. ASM Handbook Vol. 6 — Welding, Brazing and Soldering (solder alloy properties) — ASM International (1993)
  5. ASM Specialty Handbook: Tin and Tin Alloys / Lead and Lead Alloys sections — ASM International (1990)
  6. NIST Database of Solder Alloy Properties — NIST (2002)

Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.