Copper Alloy C33500-H08
Supply condition
UNS C33500 · EN CW604N
H08 = spring hard
Pick for light spring elements and washers requiring high elastic limit; bending only with large radii along grain.
Values for the H08 condition
Other C33500 tempers and conditions
C33500 is listed in 7 conditions; see the grade overview at C33500.
Compare all 7 conditionsHide
| Condition · open for datasheet | Best for | Yield MPa | Tensile MPa | Elong. % | Hardness | Conductivity |
|---|---|---|---|---|---|---|
Soft annealed | Pick for deep drawing, severe bending and spinning where maximum ductility is needed. | 105 | 315 | 65 | 58 HB | 27 % IACS |
Quarter hard | Pick when moderate stiffness is wanted but the part still needs 90° bends across the grain. | 275 | 365 | 43 | 100 HB | — |
H02Default Half hard | The standard stock temper: best all-round compromise of strength, bendability and light machining. | 345 | 420 | 23 | 120 HB | — |
Full hard | Pick for flat stamped parts needing stiffness and clean blanking with only gentle forming. | 395 | 485 | 10 | 145 HB | — |
Extra hard | Pick for flat springs, clips and contacts where high yield strength beats formability. | 425 | 525 | 6 | 155 HB | — |
H08This page Spring hard | Pick for light spring elements and washers requiring high elastic limit; bending only with large radii along grain. | 450 | 550 | 4 | 165 HB | — |
Extra spring hard | Highest strength temper for thin strip springs and contacts; essentially no cold forming capability. | 460 | 565 | 3 | 172 HB | — |
What is C33500-H08?
C33500-H08 is C33500 supplied in the H08 condition — pick for light spring elements and washers requiring high elastic limit; bending only with large radii along grain. C33500-H08 has a yield strength of 450 MPa (65.3 ksi) and a tensile strength of 550 MPa (79.8 ksi) — stronger than 86% of copper alloy grades. Elongation at break is 4% and the elastic modulus is 97 GPa (14.1 Msi). C33500-H08 has a density of 8.47 g/cm³ (0.306 lb/in³), lighter than 68% of copper alloy grades. It melts at 900°C (1,652 °F). H02 is the default condition FabDigit quotes; H08 is available on request or by drawing note.
Advantages
- Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
- High strength — 450 MPa (65.3 ksi), better than 86% of copper alloy grades
- Easy to machine — 63/100, better than 76% of copper alloy grades
Limitations
- Needs corrosion protection — 45/100, worse than 98% of copper alloy grades
- Limited ductility — 4%, worse than 96% of copper alloy grades
- Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades
- Low stiffness — 97 GPa (14.1 Msi), worse than 88% of copper alloy grades
- Difficult to weld — 22/100, worse than 83% of copper alloy grades
C33500-H08 properties
Typical room-temperature values for C33500-H08; 11 are specific to this condition. Other listed values are C33500 reference data and may not represent this condition. Bars are the position among copper alloy grades.
Physical3
C33500-H08 has a density of 8.47 g/cm³ (0.306 lb/in³), lighter than 68% of copper alloy grades. It melts at 900°C (1,652 °F).
Mechanical12
C33500-H08 has a yield strength of 450 MPa (65.3 ksi) and a tensile strength of 550 MPa (79.8 ksi) — stronger than 86% of copper alloy grades. Elongation at break is 4% and the elastic modulus is 97 GPa (14.1 Msi).
Thermal6
C33500-H08 is rated for continuous service to 150°C (302 °F). It conducts heat at 115 W/m·K (66.4 BTU/hr·ft·°F), better than 61% of copper alloy grades. Thermal expansion is 20.3 µm/m·K (11.3 µin/in·°F).
Electrical3
C33500-H08 conducts electricity at 26 % IACS, better than 63% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is fair (45/100), worse than 98% of copper alloy grades.
Sustainability4
Producing a kilogram of C33500-H08 takes about 58 MJ of energy and emits 3.6 kg of CO₂ — more than 61% of copper alloy grades. Typical recycled content is 65%.
Manufacturability7
C33500-H08's machinability is good (63/100, better than 76% of copper alloy grades); weldability poor (22/100); formability poor (25/100).
Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.
Working with C33500-H08
Is C33500 easy to machine?
Machines well with sharp positive-rake carbide or HSS tools and light emulsion; chips are semi-continuous — expect ~50–60 % of the feed rates used on C36000.
Can C33500 be welded?
Not suited to fusion welding (lead-induced hot cracking and zinc fume); join by soft soldering, silver brazing, riveting or crimping with good ventilation.
Can C33500 be formed, bent or molded?
Excellent in O60/H01 for deep drawing and 90° bends; interstage anneal at 425–600 °C, and stress-relieve cold-formed parts at 250–300 °C to avoid season cracking.
What surface finishes work on C33500?
Polishes and buffs to a bright yellow finish; readily nickel/chrome/gold plated or lacquered — no anodizing; avoid ammonia-based cleaners.
C33500 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Cuincludes Ag | 62 – 65 | 63.5 |
| Pb | 0.25 – 0.7 | 0.5 |
| Fe | ≤ 0.15 | — |
| Znremainder, nominally ~36 % | balance | — |
C33500-H08 — frequently asked
What is C33500-H08 used for?
C33500-H08 is typically used for hardware, stamped and machined fittings and electrical components. In short: formable low-lead brass; stamping plus light machining; between C27400 and C36000.
What is the yield strength of C33500-H08?
C33500-H08 has a typical yield strength of 450 MPa (65.3 ksi) and a tensile strength of 550 MPa (79.8 ksi) — stronger than 86% of copper alloy grades. Strength varies by condition: see the 7 listed tempers.
Is C33500-H08 easy to machine?
Reasonably — machinability is rated good (63/100, better than 76% of copper alloy grades). Machines well with sharp positive-rake carbide or HSS tools and light emulsion; chips are semi-continuous — expect ~50–60 % of the feed rates used on C36000.
Can C33500-H08 be welded?
Not readily — weldability is rated poor (22/100). Not suited to fusion welding (lead-induced hot cracking and zinc fume); join by soft soldering, silver brazing, riveting or crimping with good ventilation.
What surface finishes work on C33500-H08?
Polishes and buffs to a bright yellow finish; readily nickel/chrome/gold plated or lacquered — no anodizing; avoid ammonia-based cleaners.
Can C33500-H08 be formed, bent or molded?
Excellent in O60/H01 for deep drawing and 90° bends; interstage anneal at 425–600 °C, and stress-relieve cold-formed parts at 250–300 °C to avoid season cracking.
What is the maximum service temperature of C33500-H08?
C33500-H08 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C33500-H02 and C33500-O60?
H02 is the default condition — the standard stock temper: best all-round compromise of strength, bendability and light machining. O60: pick for deep drawing, severe bending and spinning where maximum ductility is needed. Yield strength is 345 MPa in H02 versus 105 MPa in O60.
Sources
- ASTM B121/B121M — Leaded Brass Plate, Sheet, Strip and Rolled Bar — ASTM International (2020)
- ASTM B36/B36M — Brass Plate, Sheet, Strip and Rolled Bar — ASTM International (2018)
- CDA Alloy Database — C33500 Low-Leaded Brass — Copper Development Association (2023)
- ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
- EN 1652 / EN 12164 wrought leaded brass designations (CW6xxN) — CEN (2016)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.