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Copper Alloy C21000-H03

Supply condition

UNS C21000 · ASTM B36 · EN CuZn5, CW500L · JIS C2100 · GB H95, H96

H03 = three-quarter hard

Intermediate step when H04 is too stiff for the required bend radius.

High cost $$$$

Values for the H03 condition

Other C21000 tempers and conditions

C21000 is listed in 10 conditions; see the grade overview at C21000.

Compare all 10 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
OS050Default
Annealed to 0.050 mm grain size
Standard soft strip/sheet for deep drawing, coining and bullet-jacket cupping.752404545 HB56 % IACS
As hot rolled
Hot-rolled plate/bar stock for further hot or cold working; lowest cost per kg.852504550 HB56 % IACS
Annealed to 0.025 mm grain size
Fine-grain soft temper when a smooth (orange-peel-free) drawn surface is required.952604255 HB56 % IACS
Quarter hard
Light temper when moderate bending/forming must be kept but soft temper is too weak.2052802570 HB55 % IACS
Half hard
General-purpose stocked temper for stamped and mildly formed decorative/electrical parts.2603151485 HB55 % IACS
H03This page
Three-quarter hard
Intermediate step when H04 is too stiff for the required bend radius.300345995 HB54 % IACS
Full hard
Standard hard strip for flat springs, contacts and stiff trim with only gentle bends.3403805105 HB54 % IACS
Extra hard
Higher-strength strip for spring clips and stiff blanked parts; bends only across grain.3854204115 HB54 % IACS
Spring hard
Spring strip where high elastic limit with near-copper conductivity is needed.4154503120 HB53 % IACS
Extra spring hard
Maximum cold-worked strength available in this alloy; essentially no forming capability.4404703125 HB53 % IACS

What is C21000-H03?

C21000-H03 is C21000 supplied in the H03 condition — intermediate step when H04 is too stiff for the required bend radius. C21000-H03 has a yield strength of 300 MPa (43.5 ksi) and a tensile strength of 345 MPa (50 ksi) — stronger than 61% of copper alloy grades. Elongation at break is 9% and the elastic modulus is 115 GPa (16.7 Msi). C21000-H03 has a density of 8.86 g/cm³ (0.32 lb/in³), heavier than 68% of copper alloy grades. It melts at 1,055°C (1,931 °F). OS050 is the default condition FabDigit quotes; H03 is available on request or by drawing note.

Advantages

  • Polishes to a fine finish — 90/100, better than 99% of copper alloy grades
  • Conducts heat well — 226 W/m·K (130.6 BTU/hr·ft·°F), better than 80% of copper alloy grades
  • High electrical conductivity — 54 % IACS, better than 80% of copper alloy grades
  • Readily welded — 60/100, better than 76% of copper alloy grades

Limitations

  • Limited service temperature — 150°C (302 °F), worse than 96% of copper alloy grades
  • Difficult to machine — 22/100, worse than 94% of copper alloy grades
  • Limited ductility — 9%, worse than 79% of copper alloy grades

C21000-H03 properties

Typical room-temperature values for C21000-H03; 11 are specific to this condition. Other listed values are C21000 reference data and may not represent this condition. Bars are the position among copper alloy grades.

Physical3

C21000-H03 has a density of 8.86 g/cm³ (0.32 lb/in³), heavier than 68% of copper alloy grades. It melts at 1,055°C (1,931 °F).

Density8.86 g/cm³0.32 lb/in³
Melting Point (Solidus)1,055°C1,931 °F
Liquidus Temperature1,066°C1,951 °F

Mechanical12

C21000-H03 has a yield strength of 300 MPa (43.5 ksi) and a tensile strength of 345 MPa (50 ksi) — stronger than 61% of copper alloy grades. Elongation at break is 9% and the elastic modulus is 115 GPa (16.7 Msi).

Elastic (Young's) Modulus115 GPa16.7 Msi
Shear Modulus43 GPa6.2 Msi
Bulk Modulus128 GPa18.6 Msi
Poisson's Ratio0.34
Tensile Strength (Ultimate)345 MPa50 ksi
Yield Strength (0.2% offset)300 MPa43.5 ksi
Elongation at Break9%
Reduction in Area70%
Shear Strength210 MPa30.5 ksi
Fatigue Strength (Endurance Limit)125 MPa18.1 ksi
Hardness, Brinell95 HB
Hardness, Vickers50 HV

Thermal6

C21000-H03 is rated for continuous service to 150°C (302 °F). It conducts heat at 226 W/m·K (130.6 BTU/hr·ft·°F), better than 80% of copper alloy grades. Thermal expansion is 18.1 µm/m·K (10.1 µin/in·°F).

Thermal Conductivity226 W/m·K131 BTU/hr·ft·°F
Specific Heat Capacity380 J/kg·K0.09 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)18.1 µm/m·K10.1 µin/in·°F
Latent Heat of Fusion205 J/g88.1 BTU/lb
Max Service Temperature (continuous)150°C302 °F
Min Service Temperature-200°C-328 °F

Electrical3

C21000-H03 conducts electricity at 54 % IACS, better than 80% of copper alloy grades.

Electrical Conductivity54 % IACS
Electrical Resistivity3.08×10⁻⁸ Ω·m1.21 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is good (62/100), worse than 57% of copper alloy grades.

Galvanic Potential (seawater, vs SCE)-0.22 V
Corrosion ResistanceGood62/100
Chemical Resistance SummaryGood in fresh water, seawater (low velocity) and rural/marine atmospheres; essentially immune to dezincification at 5% Zn. Attacked by ammonia, amines, nitric/oxidizing acids, sulfides and mercury compounds; tarnishes readily in sulfur-bearing air.

Sustainability4

Producing a kilogram of C21000-H03 takes about 55 MJ of energy and emits 3.8 kg of CO₂ — less than 72% of copper alloy grades. Typical recycled content is 45%.

Embodied Energy (primary production)55 MJ/kg23,646 BTU/lb
Embodied Carbon (primary production)3.8 kg CO₂/kg
Embodied Water260 L/kg31.2 gal/lb
Typical Recycled Content45%

Manufacturability8

C21000-H03's machinability is poor (22/100, worse than 94% of copper alloy grades); weldability good (60/100); formability good (60/100).

MachinabilityPoor22/100
Machinability Rating (AISI 1212 = 100 %)27%
WeldabilityGood60/100
Formability (cold)Good60/100
CastabilityFair45/100
Brazeability / SolderabilityExcellent95/100
PolishabilityExcellent90/100
Anodizing Responsen/a — copper alloy; use clear lacquer, bright dip, electroplating (Ni/Au) or chemical patination instead

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with C21000-H03

Is C21000 easy to machine?

Gummy, low machinability (~20% of C36000) — use sharp positive-rake tools, high speed, generous coolant and avoid dwell; not a screw-machine alloy.

Can C21000 be welded?

Excellent for soldering and brazing; GTAW/GMAW acceptable with ERCu/CuSi filler and low heat input, resistance welding only fair due to high conductivity.

Can C21000 be formed, bent or molded?

Outstanding deep drawing, coining, spinning and severe bending in OS tempers; interanneal at 425–650 °C and stress-relieve formed parts (~200–260 °C) to prevent season cracking.

What surface finishes work on C21000?

Bright-dips, buffs and polishes to a rich gold color; readily nickel/gold/chrome plated, patinated or clear-lacquered — anodizing is not applicable.

C21000 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
CuCu + Ag counted together per ASTM B3694 – 9695
Pbimpurity limit≤ 0.03—
Feimpurity limit≤ 0.05—
Znbalance—

C21000-H03 — frequently asked

What is C21000-H03 used for?

C21000-H03 is typically used for coinage blanks, bullet jackets, architectural trim, jewelry and emblems. In short: highest-formability wrought brass; gold-color low-zinc brass; 56 % IACS conductivity.

What is the yield strength of C21000-H03?

C21000-H03 has a typical yield strength of 300 MPa (43.5 ksi) and a tensile strength of 345 MPa (50 ksi) — stronger than 61% of copper alloy grades. Strength varies by condition: see the 10 listed tempers.

Is C21000-H03 easy to machine?

Not especially — machinability is rated poor (22/100, worse than 94% of copper alloy grades). Gummy, low machinability (~20% of C36000) — use sharp positive-rake tools, high speed, generous coolant and avoid dwell; not a screw-machine alloy.

Can C21000-H03 be welded?

Yes — weldability is rated good (60/100). Excellent for soldering and brazing; GTAW/GMAW acceptable with ERCu/CuSi filler and low heat input, resistance welding only fair due to high conductivity.

What surface finishes work on C21000-H03?

Bright-dips, buffs and polishes to a rich gold color; readily nickel/gold/chrome plated, patinated or clear-lacquered — anodizing is not applicable.

Can C21000-H03 be formed, bent or molded?

Outstanding deep drawing, coining, spinning and severe bending in OS tempers; interanneal at 425–650 °C and stress-relieve formed parts (~200–260 °C) to prevent season cracking.

What is the maximum service temperature of C21000-H03?

C21000-H03 is rated for continuous use to about 150°C (302 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

What is the difference between C21000-OS050 and C21000-H10?

OS050 is the default condition — standard soft strip/sheet for deep drawing, coining and bullet-jacket cupping. H10: maximum cold-worked strength available in this alloy; essentially no forming capability. Yield strength is 75 MPa in OS050 versus 440 MPa in H10.

Sources

  1. ASTM B36/B36M — Brass Plate, Sheet, Strip and Rolled Bar — ASTM International (2018)
  2. CDA Alloy Datasheet C21000 (Gilding, 95%) — Copper Development Association (2023)
  3. ASM Handbook Vol.2 — Properties and Selection: Nonferrous Alloys — ASM International (1990)
  4. EN 1652 / CW500L (CuZn5) copper and copper alloy plate, sheet and strip — CEN (1998)
  5. GB/T 2059 / GB/T 2040 (H95) (2017)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.