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Solder & Low-Melting Alloy Pb90Sn10-Sn10A

Grade

ASTM B32 Sn10 · GB HLSnPb10-90 · ISO 9453-122

Sn10A = antimony-restricted chemistry (Sb ≤ 0.12 %) per ASTM B32

Pick where antimony is restricted (cryogenic service, zinc/galvanised contact, some medical/food specs).

High cost $$$$

Values for the Sn10A condition

Other Pb90Sn10 tempers and conditions

Pb90Sn10 is listed in 2 conditions; see the grade overview at Pb90Sn10.

Compare all 2 conditionsHide
Condition · open for datasheetBest forYield MPaTensile MPaElong. %HardnessConductivity
Sn10AThis page
Antimony-restricted chemistry (Sb ≤ 0.12 %) per ASTM B32
Pick where antimony is restricted (cryogenic service, zinc/galvanised contact, some medical/food specs).14252810 HB8.5 % IACS
Antimony-bearing chemistry (Sb 0.20–0.50 %) per ASTM B32
Pick for slightly higher strength and creep resistance where antimony is permitted.17292212 HB8.2 % IACS

What is Pb90Sn10-Sn10A?

Pb90Sn10-Sn10A is Pb90Sn10 in the Sn10A grade — pick where antimony is restricted (cryogenic service, zinc/galvanised contact, some medical/food specs). Pb90Sn10-Sn10A has a yield strength of 14 MPa (2.03 ksi) and a tensile strength of 25 MPa (3.63 ksi) — weaker than 85% of solder & low-melting alloy grades. Elongation at break is 28% and the elastic modulus is 22 GPa (3.19 Msi). Pb90Sn10-Sn10A has a density of 10.75 g/cm³ (0.388 lb/in³), heavier than 86% of solder & low-melting alloy grades. It melts at 268°C (514 °F).

Advantages

  • Low embodied carbon — 3.5 kg CO₂/kg, better than 81% of solder & low-melting alloy grades

Limitations

  • Hard to polish — 20/100, worse than 88% of solder & low-melting alloy grades
  • Heavy — 10.75 g/cm³ (0.388 lb/in³), worse than 86% of solder & low-melting alloy grades
  • Low strength — 14 MPa (2.03 ksi), worse than 85% of solder & low-melting alloy grades
  • Low stiffness — 22 GPa (3.19 Msi), worse than 79% of solder & low-melting alloy grades

Pb90Sn10-Sn10A properties

Typical room-temperature values for Pb90Sn10-Sn10A; 16 are specific to this condition. Other listed values are Pb90Sn10 reference data and may not represent this condition. Bars are the position among solder & low-melting alloy grades.

Physical3

Pb90Sn10-Sn10A has a density of 10.75 g/cm³ (0.388 lb/in³), heavier than 86% of solder & low-melting alloy grades. It melts at 268°C (514 °F).

Density10.75 g/cm³0.39 lb/in³
Melting Point (Solidus)268°C514 °F
Liquidus Temperature302°C576 °F

Mechanical10

Pb90Sn10-Sn10A has a yield strength of 14 MPa (2.03 ksi) and a tensile strength of 25 MPa (3.63 ksi) — weaker than 85% of solder & low-melting alloy grades. Elongation at break is 28% and the elastic modulus is 22 GPa (3.19 Msi).

Elastic (Young's) Modulus22 GPa3.2 Msi
Shear Modulus7.6 GPa1.1 Msi
Bulk Modulus44 GPa6.4 Msi
Poisson's Ratio0.42
Tensile Strength (Ultimate)25 MPa3.6 ksi
Yield Strength (0.2% offset)14 MPa2 ksi
Elongation at Break28%
Shear Strength19 MPa2.8 ksi
Fatigue Strength (Endurance Limit)10 MPa1.5 ksi
Hardness, Brinell10 HB

Thermal6

Pb90Sn10-Sn10A is rated for continuous service to 100°C (212 °F). It conducts heat at 36 W/m·K (20.8 BTU/hr·ft·°F), worse than 64% of solder & low-melting alloy grades. Thermal expansion is 29.5 µm/m·K (16.4 µin/in·°F).

Thermal Conductivity36 W/m·K20.8 BTU/hr·ft·°F
Specific Heat Capacity138 J/kg·K0.03 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)29.5 µm/m·K16.4 µin/in·°F
Latent Heat of Fusion26 J/g11.2 BTU/lb
Max Service Temperature (continuous)100°C212 °F
Min Service Temperature-60°C-76 °F

Electrical3

Pb90Sn10-Sn10A conducts electricity at 8.5 % IACS, worse than 64% of solder & low-melting alloy grades.

Electrical Conductivity8.5 % IACS
Electrical Resistivity2.03×10⁻⁷ Ω·m7.99 µΩ·in
Magnetic Responsenon-magnetic

Chemical & Environmental3

Corrosion resistance is fair (40/100), worse than 82% of solder & low-melting alloy grades.

Galvanic Potential (seawater, vs SCE)-0.51 V
Corrosion ResistanceFair40/100
Chemical Resistance SummarySelf-passivating grey oxide/carbonate film gives fair resistance to neutral water, atmosphere and sulphuric acid; rapidly attacked by organic acids (acetic, formic), nitric acid, chlorides in flux residues and by hot alkalis.

Sustainability4

Producing a kilogram of Pb90Sn10-Sn10A takes about 49 MJ of energy and emits 3.5 kg of CO₂ — less than 81% of solder & low-melting alloy grades. Typical recycled content is 50%.

Embodied Energy (primary production)49 MJ/kg21,066 BTU/lb
Embodied Carbon (primary production)3.5 kg CO₂/kg
Embodied Water110 L/kg13.2 gal/lb
Typical Recycled Content50%

Manufacturability7

Pb90Sn10-Sn10A's machinability is poor (30/100, worse than 60% of solder & low-melting alloy grades); weldability poor (20/100); formability excellent (90/100).

MachinabilityPoor30/100
WeldabilityPoor20/100
Formability (cold)Excellent90/100
CastabilityExcellent90/100
Brazeability / SolderabilityVery good80/100
PolishabilityPoor20/100
Anodizing Responsen/a — not an anodizable metal

Values are nominal handbook figures for design screening. Confirm any required mill or lot documentation when quoting.

Working with Pb90Sn10-Sn10A

Is Pb90Sn10 easy to machine?

Cuts easily but smears badly — use very sharp positive-rake tools, high rake angles, kerosene/soluble oil lubricant and expect poor dimensional stability from creep.

Can Pb90Sn10 be welded?

Not fusion-welded; joints are made by soldering/dipping at 320–360 °C, and the alloy itself is used as a filler for step-soldering ahead of lower-melting Sn-Pb.

Can Pb90Sn10 be formed, bent or molded?

Cast, extruded or cold-rolled with essentially unlimited ductility; work at room temperature since it recrystallises immediately and cannot be work-hardened.

What surface finishes work on Pb90Sn10?

Reflowed surfaces self-dull to a matte grey oxide; clean rosin/RA residues with IPA or saponified wash, avoid acidic cleaners, and never polish or machine dry because of lead-dust exposure limits.

Pb90Sn10 chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
SnASTM B32 / J-STD-006 Sn10 range9 – 1110
Sb≤0.12 % for the A chemistry; 0.20–0.50 % for the B (antimonial) chemistry≤ 0.50.1
Bi≤ 0.1—
Cu≤ 0.08—
Ag≤ 0.05—
Fe≤ 0.02—
Zn≤ 0.01—
Al≤ 0.01—
As≤ 0.03—
Cd≤ 0—
Pbbalance, nominally ~90 %balance—

Pb90Sn10-Sn10A — frequently asked

What is Pb90Sn10-Sn10A used for?

Pb90Sn10-Sn10A is typically used for step soldering in electronics assembly, battery terminal soldering and sealing applications. In short: high-solidus step-solder alloy; lowest tin cost driver; weak, low-temperature service only.

What is the yield strength of Pb90Sn10-Sn10A?

Pb90Sn10-Sn10A has a typical yield strength of 14 MPa (2.03 ksi) and a tensile strength of 25 MPa (3.63 ksi) — weaker than 85% of solder & low-melting alloy grades. Strength varies by condition: see the 2 listed tempers.

Is Pb90Sn10-Sn10A easy to machine?

Not especially — machinability is rated poor (30/100, worse than 60% of solder & low-melting alloy grades). Cuts easily but smears badly — use very sharp positive-rake tools, high rake angles, kerosene/soluble oil lubricant and expect poor dimensional stability from creep.

Can Pb90Sn10-Sn10A be welded?

Not readily — weldability is rated poor (20/100). Not fusion-welded; joints are made by soldering/dipping at 320–360 °C, and the alloy itself is used as a filler for step-soldering ahead of lower-melting Sn-Pb.

What surface finishes work on Pb90Sn10-Sn10A?

Reflowed surfaces self-dull to a matte grey oxide; clean rosin/RA residues with IPA or saponified wash, avoid acidic cleaners, and never polish or machine dry because of lead-dust exposure limits.

Can Pb90Sn10-Sn10A be formed, bent or molded?

Cast, extruded or cold-rolled with essentially unlimited ductility; work at room temperature since it recrystallises immediately and cannot be work-hardened.

What is the maximum service temperature of Pb90Sn10-Sn10A?

Pb90Sn10-Sn10A is rated for continuous use to about 100°C (212 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Sources

  1. ASTM B32 — Standard Specification for Solder Metal — ASTM International (2020)
  2. J-STD-006 — Requirements for Electronic Grade Solder Alloys and Fluxed/Non-Fluxed Solid Solders — IPC/JEDEC (2013)
  3. ASM Handbook Vol. 3: Alloy Phase Diagrams / Sn-Pb solder property tables — ASM International (1992)
  4. NIST Database of Solder Properties with Emphasis on New Lead-Free Solders — NIST/Colorado School of Mines (2002)
  5. Sn10Pb90 high-temperature solder bar/wire technical data — Kester / AIM / Indium Corporation (2023)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.